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Author: Scott A. Schroeder Publisher: ASTM International ISBN: 0803119941 Category : Electronics Languages : en Pages : 154
Book Description
Unlike earlier electronic circuits, today's microelectronic devices demand that solder serve structural as well as electrical ends, and do so at relatively high temperature for years. Fatigue and failure of the solder has therefore become an issue in the industry. Nine studies from a May 1993 sympos
Author: Scott A. Schroeder Publisher: ASTM International ISBN: 0803119941 Category : Electronics Languages : en Pages : 154
Book Description
Unlike earlier electronic circuits, today's microelectronic devices demand that solder serve structural as well as electrical ends, and do so at relatively high temperature for years. Fatigue and failure of the solder has therefore become an issue in the industry. Nine studies from a May 1993 sympos
Author: Gary R. Halford Publisher: ASM International ISBN: 1615030743 Category : Architecture Languages : en Pages : 471
Book Description
Fatigue and Durability of Structural Materials explains how mechanical material behavior relates to the design of structural machine components. The major emphasis is on fatigue and failure behavior using engineering models that have been developed to predict, in advance of service, acceptable fatigue and other durability-related lifetimes. The book covers broad classes of materials used for high-performance structural applications such as aerospace components, automobiles, and power generation systems. Coverage focuses on metallic materials but also addresses unique capabilities of important nonmetals. The concepts are applied to behavior at room or ambient temperatures; a planned second volume will address behavior at higher-temperatures. The volume is a repository of the most significant contributions by the authors to the art and science of material and structural durability over the past half century. During their careers, including 40 years of direct collaboration, they have developed a host of durability models that are based on sound physical and engineering principles. Yet, the models and interpretation of behavior have a unique simplicity that is appreciated by the practicing engineer as well as the beginning student. In addition to their own pioneering work, the authors also present the work of numerous others who have provided useful results that have moved progress in these fields. This book will be of immense value to practicing mechanical and materials engineers and designers charged with producing structural components with adequate durability. The coverage is appropriate for a range of technical levels from undergraduate engineering students through material behavior researchers and model developers. It will be of interest to personnel in the automotive and off-highway vehicle manufacturing industry, the aeronautical industry, space propulsion and the power generation/conversion industry, the electric power industry, the machine tool industry, and any industry associated with the design and manufacturing of mechanical equipment subject to cyclic loads.
Author: Publisher: ASM International ISBN: 9780871702852 Category : Technology & Engineering Languages : en Pages : 1234
Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author: Erdogan Madenci Publisher: Springer Science & Business Media ISBN: 1461502551 Category : Technology & Engineering Languages : en Pages : 201
Book Description
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
Author: J. Schijve Publisher: Springer Science & Business Media ISBN: 1402068085 Category : Science Languages : en Pages : 627
Book Description
Fatigue of structures and materials covers a wide scope of different topics. The purpose of the present book is to explain these topics, to indicate how they can be analyzed, and how this can contribute to the designing of fatigue resistant structures and to prevent structural fatigue problems in service. Chapter 1 gives a general survey of the topic with brief comments on the signi?cance of the aspects involved. This serves as a kind of a program for the following chapters. The central issues in this book are predictions of fatigue properties and designing against fatigue. These objectives cannot be realized without a physical and mechanical understanding of all relevant conditions. In Chapter 2 the book starts with basic concepts of what happens in the material of a structure under cyclic loads. It illustrates the large number of variables which can affect fatigue properties and it provides the essential background knowledge for subsequent chapters. Different subjects are presented in the following main parts: • Basic chapters on fatigue properties and predictions (Chapters 2–8) • Load spectra and fatigue under variable-amplitude loading (Chapters 9–11) • Fatigue tests and scatter (Chapters 12 and 13) • Special fatigue conditions (Chapters 14–17) • Fatigue of joints and structures (Chapters 18–20) • Fiber-metal laminates (Chapter 21) Each chapter presents a discussion of a speci?c subject.
Author: Milton Ohring Publisher: Academic Press ISBN: 0080575528 Category : Technology & Engineering Languages : en Pages : 759
Book Description
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Author: Subra Suresh Publisher: Cambridge University Press ISBN: 9780521578479 Category : Technology & Engineering Languages : en Pages : 708
Book Description
Written by a leading researcher in the field, this revised and updated second edition of a highly successful book provides an authoritative, comprehensive and unified treatment of the mechanics and micromechanisms of fatigue in metals, non-metals and composites. The author discusses the principles of cyclic deformation, crack initiation and crack growth by fatigue, covering both microscopic and continuum aspects. The book begins with discussions of cyclic deformation and fatigue crack initiation in monocrystalline and polycrystalline ductile alloys as well as in brittle and semi-/non-crystalline solids. Total life and damage-tolerant approaches are then introduced in metals, non-metals and composites followed by more advanced topics. The book includes an extensive bibliography and a problem set for each chapter, together with worked-out example problems and case studies. This will be an important reference for anyone studying fracture and fatigue in materials science and engineering, mechanical, civil, nuclear and aerospace engineering, and biomechanics.
Author: Ephraim Suhir Publisher: Springer Science & Business Media ISBN: 0387329897 Category : Technology & Engineering Languages : en Pages : 1471
Book Description
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Author: Abdel Salam Hamdy Makhlouf Publisher: Butterworth-Heinemann ISBN: 0128113960 Category : Technology & Engineering Languages : en Pages : 388
Book Description
Handbook of Materials Failure Analysis: With Case Studies from the Electronics Industries examines the reasons materials fail in certain situations, including material defects and mechanical failure as a result of various causes. The book begins with a general overview of materials failure analysis and its importance. It then proceeds to discussions on the types of failure analysis, specific tools and techniques, and an analysis of materials failure from various causes. As failure can occur for several reasons, including materials defects-related failure, materials design-related failure, or corrosion-related failures, the topics covered in this comprehensive source are an important tool for practitioners. - Provides the most up-to-date and balanced coverage of failure analysis, combining foundational knowledge and current research on the latest developments and innovations in the field - Offers an ideal accompaniment for those interested in materials forensic investigation, failure of materials, static failure analysis, dynamic failure analysis, and fatigue life prediction - Presents compelling new case studies from key industries to demonstrate concepts
Author: Scott A. Schroeder
Author: Scott A. Schroeder
Author: Gary R. Halford
Author: 
Author: Erdogan Madenci
Author: J. Schijve
Author: Milton Ohring
Author: Subra Suresh
Author: Huseyin Sehitoglu
Author: Ephraim Suhir
Author: Abdel Salam Hamdy Makhlouf