Fabrication, Characterization, and Analysis of a DRIE CMOS-MEMS Gyroscope PDF Download

Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 11

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Book Description
A gyroscope with a measured noise floor of 0.02 degrees /s/Hz1/2 at 5 Hz is fabricated by post-CMOS micromachining that uses interconnect metal layers to mask the structural etch steps. The 1x1 mm lateral-axis angular rate sensor employs in-plane vibration and out-of-plane Coriolis acceleration detection with on-chip CMOS circuitry. The resultant device incorporates a combination of 1.8- micrometers-thick thin-film structures for springs with out-of-plane compliance and 60- micrometers-thick bulk silicon structures defined by deep reactive-ion etching for the proof mass and springs with out-of-plane stiffness. The microstructure is flat and avoids excessive curling, which exists in prior thin-film CMOS-microelectromechanical systems gyroscopes. Complete etch removal of selective silicon regions provides electrical isolation of bulk silicon to obtain individually controllable comb fingers. Direct motion coupling is observed and analyzed.

Author: Ridha Almikhlafi
Publisher:
ISBN:
Category : Gyroscopes
Languages : en
Pages : 50

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Book Description
This thesis presents the design, fabrication and characterization of two Micro-Electro-Mechanical Systems (MEMS) vibratory gyroscopes fabricated using the Silicon-On-Insulator-Multi-User-MEMS Process (SOIMUMPs) and Polysilicon Multi-User-MEMS-Process (Poly-MUMPs). Firstly, relevant literature and background on static and dynamic analysis of MEMS gyroscopes are described. Secondly, the gyroscope analytical model is presented and numerically solved using Mathematica software. The lumped mass model was used to analytically design the gyroscope and predict their performance. Finite element analysis was carried out on the gyroscopes to verify the proposed designs. Thirdly, gyroscope fabrication using MEMSCAP's SOIMUMPs and PolyMUMPs processes is described. For the former, post-processing was carried out at the Quantum Nanofab Center (QNC) on a die-level in order to create the vibratory structural elements (cantilever beam). Following this, the PolyMUMPs gyroscopes are characterized optically by measuring their resonance frequencies and quality factor using a Laser Doppler Vibrometer (LDV). The drive resonance frequency was measured at 40 kHz and the quality factor as Q = 1. For the sense mode, the resonance frequency was measured at 55 kHz and the unity quality factor as Q = 1. The characterization results show large drive direction motions of 100 um/s in response to a voltage pulse of 10 V. The drive pull-in voltage was measured at 19 V. Finally, the ratio of the measured drive to sense mode velocities in response to a voltage pulse of 10 V was calculated at 1.375.

Author: Masayoshi Esashi
Publisher: John Wiley & Sons
ISBN: 3527823255
Category : Technology & Engineering
Languages : en
Pages : 528

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Book Description
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.

Author: Mario N. Armenise
Publisher: Springer Science & Business Media
ISBN: 3642154948
Category : Technology & Engineering
Languages : en
Pages : 123

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Book Description
This monograph collects and critically reviews the main results obtained by the scientific community in gyroscope technologies research field. It describes architectures, design techniques and fabrication technology of angular rate sensors proposed in literature. MEMS, MOEMS, optical and mechanical technologies are discussed together with achievable performance. The book also consideres future research trends aimed to cover special applications. The book is intended for researchers and Ph.D. students interested in modelling, design and fabrication of gyros. The book may be a useful education support in some university courses focused on gyro technologies.

Author: Salvatore Baglio
Publisher: John Wiley & Sons
ISBN: 9780470034088
Category : Technology & Engineering
Languages : en
Pages : 244

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Book Description
This accessible volume delivers a complete design methodology for microelectromechanical systems (MEMS). Focusing on the scaling of an autonomous micro-system, it explains the real-world problems and theoretical concepts of several different aspects inherent to the miniaturization of sensors and actuators. It reports on the analysis of dimensional scaling, the modelling, design and experimental characterization of a wide range of specific devices and applications, including: temperature microsensors based on an integrated complementary metal-oxide-semiconductor (CMOS) thermocouple; mechanical sensors; inductive microsensors for the detection of magnetic particles; electrostatic, thermal and magnetic actuators. With an original approach, this informative text encompasses the entire range of themes currently at the forefront of MEMS, including an analysis of the importantissue of energy sources in MEMS. In addition, the book explores contemporary research into the design of complete MEMS with a case study on colonies of microbots. Scaling Issues and Design of MEMS aims to improve the reader’s basic knowledge on modelling issues of complex micro devices, and to encourage new thinking about scaling effects. It will provide support for practising engineers working within the defence industry and will also be of welcome interest to graduate students and researchers with a background in electronic engineering, physics, chemistry, biology and materials science.

Author: Volker Kempe
Publisher: Cambridge University Press
ISBN: 1139494821
Category : Technology & Engineering
Languages : en
Pages : 497

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Book Description
A practical and systematic overview of the design, fabrication and test of MEMS-based inertial sensors, this comprehensive and rigorous guide shows you how to analyze and transform application requirements into practical designs, and helps you to avoid potential pitfalls and to cut design time. With this book you'll soon be up to speed on the relevant basics, including MEMS technologies, packaging, kinematics and mechanics, and transducers. You'll also get a thorough evaluation of different approaches and architectures for design and an overview of key aspects of testing and calibration. Unique insights into the practical difficulties of making sensors for real-world applications make this up-to-date description of the state of the art in inertial MEMS an ideal resource for professional engineers in industry as well as students looking for a complete introduction to the area.

Author: Mohamed Gad-el-Hak
Publisher: CRC Press
ISBN: 1420036556
Category : Technology & Engineering
Languages : en
Pages : 576

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Book Description
As our knowledge of microelectromechanical systems (MEMS) continues to grow, so does The MEMS Handbook. The field has changed so much that this Second Edition is now available in three volumes. Individually, each volume provides focused, authoritative treatment of specific areas of interest. Together, they comprise the most comprehensive collection

Author: Bharat Bhushan
Publisher: Springer Science & Business Media
ISBN: 3642025250
Category : Technology & Engineering
Languages : en
Pages : 1968

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Book Description
Since 2004 and with the 2nd edition in 2006, the Springer Handbook of Nanotechnology has established itself as the definitive reference in the nanoscience and nanotechnology area. It integrates the knowledge from nanofabrication, nanodevices, nanomechanics, Nanotribology, materials science, and reliability engineering in just one volume. Beside the presentation of nanostructures, micro/nanofabrication, and micro/nanodevices, special emphasis is on scanning probe microscopy, nanotribology and nanomechanics, molecularly thick films, industrial applications and microdevice reliability, and on social aspects. In its 3rd edition, the book grew from 8 to 9 parts now including a part with chapters on biomimetics. More information is added to such fields as bionanotechnology, nanorobotics, and (bio)MEMS/NEMS, bio/nanotribology and bio/nanomechanics. The book is organized by an experienced editor with a universal knowledge and written by an international team of over 150 distinguished experts. It addresses mechanical and electrical engineers, materials scientists, physicists and chemists who work either in the nano area or in a field that is or will be influenced by this new key technology.

Author: Cenk Acar
Publisher: Springer Science & Business Media
ISBN: 0387095365
Category : Technology & Engineering
Languages : en
Pages : 262

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Book Description
MEMS Vibratory Gyroscopes provides a solid foundation in the theory and fundamental operational principles of micromachined vibratory rate gyroscopes, and introduces structural designs that provide inherent robustness against structural and environmental variations. In the first part, the dynamics of the vibratory gyroscope sensing element is developed, common micro-fabrication processes and methods commonly used in inertial sensor production are summarized, design of mechanical structures for both linear and torsional gyroscopes are presented, and electrical actuation and detection methods are discussed along with details on experimental characterization of MEMS gyroscopes. In the second part, design concepts that improve robustness of the micromachined sensing element are introduced, supported by constructive computational examples and experimental results illustrating the material.

Author: Muthu Wijesundara
Publisher: Springer Science & Business Media
ISBN: 1441971211
Category : Technology & Engineering
Languages : en
Pages : 247

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Book Description
Silicon Carbide Microsystems for Harsh Environments reviews state-of-the-art Silicon Carbide (SiC) technologies that, when combined, create microsystems capable of surviving in harsh environments, technological readiness of the system components, key issues when integrating these components into systems, and other hurdles in harsh environment operation. The authors use the SiC technology platform suite the model platform for developing harsh environment microsystems and then detail the current status of the specific individual technologies (electronics, MEMS, packaging). Additionally, methods towards system level integration of components and key challenges are evaluated and discussed based on the current state of SiC materials processing and device technology. Issues such as temperature mismatch, process compatibility and temperature stability of individual components and how these issues manifest when building the system receive thorough investigation. The material covered not only reviews the state-of-the-art MEMS devices, provides a framework for the joining of electronics and MEMS along with packaging into usable harsh-environment-ready sensor modules.