Author: G.Q. Zhang Publisher: Springer Science & Business Media ISBN: 1402049358 Category : Technology & Engineering Languages : en Pages : 580
Book Description
This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.
Author: John Hock Lye Pang Publisher: Springer Science & Business Media ISBN: 1461404630 Category : Technology & Engineering Languages : en Pages : 184
Book Description
Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.
Author: Navid Asadizanjani Publisher: Springer Nature ISBN: 3030626091 Category : Technology & Engineering Languages : en Pages : 193
Book Description
This book provides readers with a comprehensive introduction to physical inspection-based approaches for electronics security. The authors explain the principles of physical inspection techniques including invasive, non-invasive and semi-invasive approaches and how they can be used for hardware assurance, from IC to PCB level. Coverage includes a wide variety of topics, from failure analysis and imaging, to testing, machine learning and automation, reverse engineering and attacks, and countermeasures.
Author: James E. Morris Publisher: Springer ISBN: 3319903624 Category : Technology & Engineering Languages : en Pages : 1007
Book Description
This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Author: Ephraim Suhir Publisher: Springer Science & Business Media ISBN: 0387329897 Category : Technology & Engineering Languages : en Pages : 1471
Book Description
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Author: John X. Wang Publisher: CRC Press ISBN: 1439826692 Category : Technology & Engineering Languages : en Pages : 350
Book Description
Going "green" is becoming a major component of the mission for electronics manufacturers worldwide. While this goal seems simplistic, it poses daunting dilemmas. Yet, to compete effectively in the global economy, manufacturers must take the initiative to drive this crucial movement. Green Electronics Manufacturing: Creating Environmental Sensible P
Author: Roger Narayan Publisher: Springer Science & Business Media ISBN: 038784872X Category : Technology & Engineering Languages : en Pages : 573
Book Description
Biomedical Materials provides a comprehensive discussion of contemporary biomaterials research and development. Highlighting important topics associated with Engineering, Medicine and Surgery, this volume reaches a wide scope of professionals, researchers and graduate students involved with biomaterials. A pedagogical writing style and structure provides readers with an understanding of the fundamental concepts necessary to pursue research and industrial work on biomaterials, including characteristics of biomaterials, biological processes, biocompatibility, and applications of biomaterials in implants and medical instruments. Written by leading researchers in the field, this text book takes readers to the forefront of biomedical materials development, providing them with a taste of how the field is changing, while also serving as a useful reference to physicians and engineers.
Author: Advanced Thermal Solutions Publisher: Advanced Thermal Solutions ISBN: 098462791X Category : Science Languages : en Pages : 204
Book Description
The complete editorial contents of Qpedia Thermal eMagazine, Volume 3, Issues 1 - 12 features in-depth, technical articles covering the most critical areas of electronics cooling.
Author: G.Q. Zhang
Author: John Hock Lye Pang
Author: Navid Asadizanjani
Author: James E. Morris
Author: 
Author: Ephraim Suhir
Author: 
Author: John X. Wang
Author: Roger Narayan
Author: Advanced Thermal Solutions