Étude de la fiabilité et des mécanismes de dégradation dans les composants numériques de dernière génération

Étude de la fiabilité et des mécanismes de dégradation dans les composants numériques de dernière génération PDF Author: Julien Coutet
Publisher:
ISBN:
Category :
Languages : fr
Pages : 0

Book Description
La réduction des tailles aux niveaux transistors des composants électroniques commerciaux est rendue possible par l'utilisation de nouveaux matériaux au niveau de l'oxyde de grille notamment pour les DSM. Afin de pouvoir utiliser en toute confiance ces composants pour des applications en environnements sévères il est nécessaire d'en évaluer la fiabilité. Les deux catégories de composants choisies pour représenter les technologies DSM sont les mémoires Flash et les FPGA. Nous avons étudié les différents mécanismes de dégradation séparément au moyen de vieillissements accélérées. Ensuite les résultats sont analysés et une démarche statistique rigoureuse a été mise en place afin d'estimer une fiabilité réaliste.Nos essais ont montré que la température de stockage ainsi que les cycles d'écriture-effacement réduisent nettement la fiabilité en rétention des mémoires Flash NAND. Une particularité de cette étude est la mise en évidence qu'un grand écart entre la température d'écriture et celle de lecture mène à une forte perte de fiabilité en rétention qui n'est pas liée à la physique du point mémoire à basse température mais à une dérive du circuit périphérique gérant l'écriture et la lecture des cellules. D'autre part, nous avons montré que le manque de fiabilité en rétention avéré avec ce type de composant est dû à l'architecture MLC et non à la finesse du nœud technologique. Les codes correcteurs d'erreurs, les mécanismes d'uniformisation d'usure ou bien le surdimensionnement permettent de rendre la fiabilité acceptable. Ils font par conséquent partie intégrante du système et sont à prendre en compte dans le calcul de la fiabilité.Pour mesurer des dérives dans circuits numériques, nous avons utilisé des oscillateurs en anneaux implantés dans des FPGA. Nous avons mesuré du BTI et du HCI mais nous n'avons pas observé d'électromigration ou de TDDB. Ces dérives ont été modélisées pour chaque mécanisme. Une extraction des dégradations par transistor sous l'hypothèse de l'architecture issue de brevets ont permis de distinguer le NBTI du PBTI. Par ailleurs l'analyse des dérives - très faibles - à basse température nous prouve l'intervention du mécanisme HCI en mettant clairement en évidence le lien avec le nombre de commutations. Enfin, pour évaluer la fiabilité de manière rigoureuse - la somme des deux taux de défaillance HCI et BTI n'étant pas représentative de la fiabilité - une autre méthode plus réaliste reposant sur la somme des dérives allant jusqu'au critère de défaillance a été proposée dans cette étude.

Annales des télécommunications

Annales des télécommunications PDF Author:
Publisher:
ISBN:
Category : Telecommunication
Languages : en
Pages : 540

Book Description


Composite Materials

Composite Materials PDF Author: Jean-Marie Berthelot
Publisher: Springer
ISBN: 9781461268031
Category : Technology & Engineering
Languages : en
Pages : 0

Book Description
Mechanical engineering, an engineering discipline borne of the needs of the in dustrial revolution, is once again asked to do its substantial share in the call for industrial renewal. The general call is urgent as we face profound issues of produc tivity and competitiveness that require engineering solutions, among others. The Mechanical Engineering Series features graduate texts and research monographs intended to address the need for information in contemporary areas of mechanical engineering. The series is conceived as a comprehensive one that covers a broad range of concentrations important to mechanical engineering graduate education and re search. We are fortunate to have a distinguished roster of consulting editors on the advisory board, each an expert in one of the areas of concentration. The names of the consulting editors are listed on the next page of this volume. The areas of concentration are applied mechanics, biomechanics, computational mechan ics, dynamic systems and control, energetics, mechanics of materials, processing, thermal science, and tribology.

Free-Radical Chemistry

Free-Radical Chemistry PDF Author: D. C. Nonhebel
Publisher: CUP Archive
ISBN: 9780521201490
Category : Science
Languages : en
Pages : 620

Book Description


ICREEC 2019

ICREEC 2019 PDF Author: Ahmed Belasri
Publisher: Springer Nature
ISBN: 9811554447
Category : Technology & Engineering
Languages : en
Pages : 659

Book Description
This book highlights peer reviewed articles from the 1st International Conference on Renewable Energy and Energy Conversion, ICREEC 2019, held at Oran in Algeria. It presents recent advances, brings together researchers and professionals in the area and presents a platform to exchange ideas and establish opportunities for a sustainable future. Topics covered in this proceedings, but not limited to, are photovoltaic systems, bioenergy, laser and plasma technology, fluid and flow for energy, software for energy and impact of energy on the environment.

Adhesion Between Polymers and Concrete / Adhésion Entre Polymères Et Béton

Adhesion Between Polymers and Concrete / Adhésion Entre Polymères Et Béton PDF Author: H. R. Sasse
Publisher: Springer
ISBN:
Category : Science
Languages : en
Pages : 792

Book Description
Preface Adhesion is a phenomenon architects and civil engineers are not very familiar with. In other disciplines knowledge about surface properties and the background of bonding energies is also far from satisfactory; nevertheless there are many important· applications in concrete engineering, where adhesion is necessary for success and durability. These include: - coating and painting - repair of concrete surfaces - bonding of fresh to old concrete - crack injection - glueing of precast elements - glueing of steel to concrete, etc. In 1981 RILEM established the technical committee 52-RAC 'Resin Adherence to Concrete'. The main aims of the committee's work were - to collect research results and practical experiences - to initiate and coordinate research programs - to develop, on a scientific base, test methods for field and for laboratory purposes. One of the results of the committee's work is a state-of-the-art report, which will be presented orally as a General Report at the International Symposium ISAP '86, and will be printed either in the RILEM journal Materials and Structures or separately. Several test recommendations have been elaborated and will be prepared as drafts for the participants ofISAP '86. These are: - direct tensile test - pull-off test - direct shear test - slant shear test - four-point bending test - dynamic loading test - thermal compatibility test (two versions) - injectibility test.

In-Vessel Melt Retention and Ex-Vessel Corium Cooling: IAEA Tecdoc No. 1906

In-Vessel Melt Retention and Ex-Vessel Corium Cooling: IAEA Tecdoc No. 1906 PDF Author: International Atomic Energy Agency
Publisher: International Atomic Energy Agency
ISBN: 9789201063205
Category : Technology & Engineering
Languages : en
Pages : 72

Book Description
This publication results from a technical meeting on phenomenology and technologies relevant to in-vessel melt retention (IVMR) and ex-vessel corium cooling (EVCC). The purpose of the publication is to capture the state of knowledge, at the time of that meeting, related to phenomenology and technologies as well as the challenges and pending issues relevant to IVMR and EVCC for water cooled reactors by summarizing the information provided by the meeting participants in a form useful to practitioners in Member States.

How to Design Wastewater Systems for Local Conditions in Developing Countries

How to Design Wastewater Systems for Local Conditions in Developing Countries PDF Author: David M. Robbins
Publisher: IWA Publishing
ISBN: 178040476X
Category : Science
Languages : en
Pages : 148

Book Description
This is a practical handbook providing a step-by-step approach to the techniques used for characterizing wastewater sources and investigating sites where collection, treatment and reuse/disposal technologies will be installed. It is intended to help enable local implementation of on-site and decentralized wastewater management system (DWMS)for wide scale use in development settings. How to Design Wastewater Systems for Local Conditions in Developing Countries helps local service providers and regulatory officials make informed decisions through the use of tools, checklists and case studies. It includes a link to a web based community of on-site and decentralized wastewater professionals, which contains related tools and case studies. This handbook serves as a reference for training classes, certification programs, and higher education programs in civil and sanitary engineering. There is an increasing interest on the part of local government officials and private sector service providers to implement wastewater treatment systems to solve sanitation problems. The model presented in this handbook promotes activities that first generate data related to source and site conditions that represent critical inputs, and then applies this information to the technology selection process. Matching the most appropriate technologies to the specific needs of the wastewater project is the key that leads to long term sustainability. How to Design Wastewater Systems for Local Conditions in Developing Countries is an invaluable resource for public sector decision makers and private sector service providers in developing countries. It is also a useful text for students at engineering colleges in developing countries interested in taking a class that teaches the methods of decentralized wastewater management system (DWMS) development.

MILCOM 2005

MILCOM 2005 PDF Author: Institute of Electrical and Electronics Engineers
Publisher:
ISBN:
Category :
Languages : en
Pages : 674

Book Description


Lasers in Materials Processing

Lasers in Materials Processing PDF Author: Edward A. Metzbower
Publisher: ASM International(OH)
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 286

Book Description