Estimating Influence of Temperature on Microelectronic Device Reliability PDF Download

Author: P. Lall
Publisher:
ISBN:
Category :
Languages : en
Pages : 512

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Author: Pradeep Lall
Publisher: CRC Press
ISBN: 0429605595
Category : Technology & Engineering
Languages : en
Pages : 332

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This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The

Author: Shahrzad Salemi
Publisher: RIAC
ISBN: 1933904291
Category : Electronic apparatus and appliances
Languages : en
Pages : 271

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Author: Way Kuo
Publisher: Springer Science & Business Media
ISBN: 1461556716
Category : Technology & Engineering
Languages : en
Pages : 407

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The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: • the economic impact of employing the microelectronics fabricated by in dustry, • a study of the relationship between reliability and yield, • the progression toward miniaturization and higher reliability, and • the correctness and complexity of new system designs, which include a very significant portion of software.

Author: Frank Kreith
Publisher: CRC Press
ISBN: 9781420050424
Category : Science
Languages : en
Pages : 1204

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To be successful in the international marketplace, corporations must have access to the latest developments and most recent experimental data. Traditional handbooks of heat transfer stress fundamental principles, analytical approaches to thermal problems, and elegant solutions to classical problems. The CRC Handbook of Thermal Engineering is not a traditional handbook. Engineers in industry need up-to-date, accessible information on the applications of heat and mass transfer-The CRC Handbook of Thermal Engineering provides it. Peer reviewed articles-selected on the basis of their current relevance to the development of new products-provide in-depth treatment of applications in diverse fields, such as: Bioengineering Desalination Electronics Energy conservation Food processing Measurement techniques in fluid flow and heat transfer You'll find complete, up-to-date information on the latest development in the field, including: Recent advances in thermal sciences Microthermal design Compact heat exchangers Thermal optimization Exergy analysis A unique, one-stop resource for all your thermal engineering questions From the basics of thermodynamics, fluid mechanics, and heat and mass transfer, to comprehensive treatment of current applications, the latest computational tools, to data tables for the properties of gases, liquids, and solids, The CRC Handbook of Thermal Engineering has it all!

Author: Raj P. Chhabra
Publisher: CRC Press
ISBN: 1351646036
Category : Science
Languages : en
Pages : 1801

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The CRC Handbook of Thermal Engineering, Second Edition, is a fully updated version of this respected reference work, with chapters written by leading experts. Its first part covers basic concepts, equations and principles of thermodynamics, heat transfer, and fluid dynamics. Following that is detailed coverage of major application areas, such as bioengineering, energy-efficient building systems, traditional and renewable energy sources, food processing, and aerospace heat transfer topics. The latest numerical and computational tools, microscale and nanoscale engineering, and new complex-structured materials are also presented. Designed for easy reference, this new edition is a must-have volume for engineers and researchers around the globe.

Author: Pradeep Lall
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 914

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Author: Michael Pecht
Publisher: CRC Press
ISBN: 9780849396229
Category : Technology & Engineering
Languages : en
Pages : 474

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The rapid growth of the electronic products market has created an increasing need for affordable, reliable, high-speed and high-density multi-layer printed circuit boards (PCBs). This book presents the technologies, algorithms, and methodologies for engineers and others developing the next generation of electronic products. A vision of the future in advanced electronics Advanced Routing of Electronic Modules provides both fundamental theory and advanced technologies for improving routing. Beginning chapters discuss approaches to approximate a minimum rectilinear Steiner tree from a minimum spanning tree and introduce ways to avoid obstacles for routing simple multi-terminal nets sequentially in a workspace. Timing delay, clock skew, and noise control requirements in signal integrity are described as well as computer-aided approaches to managing these requirements in high-speed PCB/MCM routing. Later chapters present the two-layer wiring problem, rip-up and reroute approaches, and parallel routing, including global routing, boundary crossing placement, and detailed maze routing in hardware acceleration. Data structures, data management, and algorithms for parallel routing in a multiple-processor hardware systems are also covered.

Author: United States. National Aeronautics and Space Administration. Office of Reliability and Quality Assurance
Publisher:
ISBN:
Category : Quality control
Languages : en
Pages : 602

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Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 956

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