Author: Publisher:
ISBN:
Category : Electronic industries
Languages : en
Pages : 8
Book Description
Equipment and Materials for Electronic Components Production, Mexico
Author: Electronics Manufacturing Processes
Author: Thomas L. LandersPublisher: Pearson Education
ISBN:
Category : Business & Economics
Languages : en
Pages : 584
Book Description
This volume provides a comprehensive introduction to electronic technology, products, and manufacturing processes.Reviews principles of production and electronics fundamentals (electronic components, interconnections, printed wiring boards, soldering and solderability); explains automatic assembly (automation, leaded component insertion, and surface-mount device placement); discusses life-cycle engineering (design for assembly, quality and reliability, testability, and environmental stress screening); and explores manufacturing systems (facilities and materials handling, production and inventory control, production economics).For electrical or industrial engineers interested in electronics manufacturing.
Equipment and Materials for Electronic Components Production, France
Author: Equipment and Materials for Electronic Components Production, Mexico
Author: Equipment and Materials for Electronic Components Production, Norway
Author: Equipment and Materials for Electronic Components Production, Japan
Author: Equipment and Materials for Electronic Components Production, Germany
Author: Equipment and Materials for Electronic Components Production
Author: Equipment and Materials for Electronic Components Production, Taiwan
Author: The Electronics Assembly Handbook
Author: Frank RileyPublisher: Springer Science & Business Media
ISBN: 3662131617
Category : Technology & Engineering
Languages : en
Pages : 576
Book Description
The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.