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Author: Aboozar Mosleh Publisher: ISBN: Category : Microelectronics Languages : en Pages : 274
Book Description
Microelectronics industry has experienced a tremendous change over the last few decades and has shown that Moore's law has been followed by doubling the number of transistors on the chip every 18 months. However, continuous scaling down of the transistors size is reaching the physical limits and data transfer through metal interconnects will not be able to catch up with the increasing data processing speed in the future. Therefore, optical data transfer between chips and on-chip has been widely investigated. Silicon based optoelectronics has received phenomenal attention since Si has been the core material on which microelectronic industry has been built. However, due to the indirect bandgap nature of Si, its optical characteristics fall short compared to similar III-IV semiconductors. The efforts in III-V incorporation on Si substrate have not been successful due to the incompatibility of the growth with complementary metal oxide semiconductor processing. Germanium has been studied in order to develop a Si compatible technology and it has been shown that a direct bandgap material is achievable by alloying Sn in Ge. Further investigations on Si-Ge-Sn material system showed its viability as a technology that can be used for fabrication of Si-compatible light source and detectors. The work presented in this dissertation is focused on the low temperature growth of Si-Ge-Sn alloys. High quality crystalline homoepitaxial silicon films were deposited at 250 °C using a plasma-enhanced chemical vapor deposition (PECVD) system. Strain-relaxed Ge and SiGe films were also grown on Si substrate at 350-550 °C in a reduced pressure CVD system. Commercial precursors of silane and germane were used to grow the films at different chamber pressures. Germanium-tin and silicon-germanium-tin alloys were grown by a cold-wall chemical vapor deposition system at low temperatures (300-450 °C) directly on Si substrates. Two different delivery systems were adopted for the delivery of stannic chloride and deuterated stannane as Sn precursors along with silane and germane. Crystallinity and growth quality of the films were investigated through material characterization methods including X-ray diffraction, scanning electron microscopy and transmission electron microscopy. Elemental characterization of the films was done using Rutherford backscattering measurement and energy-dispersive X-ray spectroscopy. Moreover, optical characterizations were performed using Raman spectroscopy and photoluminescence on the samples to investigate Sn incorporation in the films. Additionally, compressively strained (
Author: Aboozar Mosleh Publisher: ISBN: Category : Microelectronics Languages : en Pages : 274
Book Description
Microelectronics industry has experienced a tremendous change over the last few decades and has shown that Moore's law has been followed by doubling the number of transistors on the chip every 18 months. However, continuous scaling down of the transistors size is reaching the physical limits and data transfer through metal interconnects will not be able to catch up with the increasing data processing speed in the future. Therefore, optical data transfer between chips and on-chip has been widely investigated. Silicon based optoelectronics has received phenomenal attention since Si has been the core material on which microelectronic industry has been built. However, due to the indirect bandgap nature of Si, its optical characteristics fall short compared to similar III-IV semiconductors. The efforts in III-V incorporation on Si substrate have not been successful due to the incompatibility of the growth with complementary metal oxide semiconductor processing. Germanium has been studied in order to develop a Si compatible technology and it has been shown that a direct bandgap material is achievable by alloying Sn in Ge. Further investigations on Si-Ge-Sn material system showed its viability as a technology that can be used for fabrication of Si-compatible light source and detectors. The work presented in this dissertation is focused on the low temperature growth of Si-Ge-Sn alloys. High quality crystalline homoepitaxial silicon films were deposited at 250 °C using a plasma-enhanced chemical vapor deposition (PECVD) system. Strain-relaxed Ge and SiGe films were also grown on Si substrate at 350-550 °C in a reduced pressure CVD system. Commercial precursors of silane and germane were used to grow the films at different chamber pressures. Germanium-tin and silicon-germanium-tin alloys were grown by a cold-wall chemical vapor deposition system at low temperatures (300-450 °C) directly on Si substrates. Two different delivery systems were adopted for the delivery of stannic chloride and deuterated stannane as Sn precursors along with silane and germane. Crystallinity and growth quality of the films were investigated through material characterization methods including X-ray diffraction, scanning electron microscopy and transmission electron microscopy. Elemental characterization of the films was done using Rutherford backscattering measurement and energy-dispersive X-ray spectroscopy. Moreover, optical characterizations were performed using Raman spectroscopy and photoluminescence on the samples to investigate Sn incorporation in the films. Additionally, compressively strained (
Author: Yijie Huo Publisher: Stanford University ISBN: Category : Languages : en Pages : 139
Book Description
The on-chip interconnect bandwidth limitation is becoming an increasingly critical challenge for integrated circuits (ICs) as device scaling continues to push the speed and density of ICs. Silicon photonics has the ability to solve this emerging problem due to its high speed, high bandwidth, low power consumption, and ability to be monolithically integrated on silicon. Most of the key devices for Si photonic ICs have already been demonstrated. However, a practical CMOS compatible coherent light source is still a major challenge. Germanium (Ge) has already been demonstrated to be a promising material for optoelectronic devices, such as photo-detectors and modulators. However, Ge is an indirect band gap semiconductor, which makes Ge-based light sources very inefficient and limits their practical use. Fortunately, the direct [uppercase Gamma] valley of the Ge conduction band is only 0.14 eV higher than the indirect L valley, suggesting that with band-structure engineering, Ge has the potential to become a direct band gap material and an efficient light emitter. In this dissertation, we first discuss our work on highly biaxial tensile strained Ge grown by molecular beam epitaxy (MBE). Relaxed step-graded InGaAs buffer layers, which are prepared with low temperature growth and high temperature annealing, are used to provide a larger lattice constant substrate to produce tensile strain in Ge epitaxial layers. Up to 2.3% in-plane biaxial tensile strained thin Ge epitaxial layers were achieved with smooth surfaces and low threading dislocation density. A strong increase of photoluminescence with highly tensile strained Ge layers at low temperature suggests that a direct band gap semiconductor has been achieved. This dissertation also presents our work on more than 9% Sn incorporation in epitaxial GeSn alloys using a low temperature MBE growth method. This amount of Sn is 10 times greater than the solid-solubility of Sn in crystalline Ge. Material characterization shows good crystalline quality without Sn precipitation or phase segregation. With increasing Sn percentage, direct band gap narrowing is observed by optical transmission measurements. The studies described in this dissertation will help enable efficient germanium based CMOS compatible coherent light sources. Other possible applications of this work are also discussed in the concluding chapter.
Author: Mohamed Henini Publisher: Elsevier ISBN: 0128121378 Category : Science Languages : en Pages : 790
Book Description
Molecular Beam Epitaxy (MBE): From Research to Mass Production, Second Edition, provides a comprehensive overview of the latest MBE research and applications in epitaxial growth, along with a detailed discussion and 'how to' on processing molecular or atomic beams that occur on the surface of a heated crystalline substrate in a vacuum. The techniques addressed in the book can be deployed wherever precise thin-film devices with enhanced and unique properties for computing, optics or photonics are required. It includes new semiconductor materials, new device structures that are commercially available, and many that are at the advanced research stage. This second edition covers the advances made by MBE, both in research and in the mass production of electronic and optoelectronic devices. Enhancements include new chapters on MBE growth of 2D materials, Si-Ge materials, AIN and GaN materials, and hybrid ferromagnet and semiconductor structures. - Condenses the fundamental science of MBE into a modern reference, speeding up literature review - Discusses new materials, novel applications and new device structures, grounding current commercial applications with modern understanding in industry and research - Includes coverage of MBE as mass production epitaxial technology and how it enhances processing efficiency and throughput for the semiconductor industry and nanostructured semiconductor materials research community
Author: Eric Tournié Publisher: Woodhead Publishing ISBN: 0081027389 Category : Technology & Engineering Languages : en Pages : 754
Book Description
Mid-infrared Optoelectronics: Materials, Devices, and Applications addresses the new materials, devices and applications that have emerged over the last decade, along with exciting areas of research. Sections cover fundamentals, light sources, photodetectors, new approaches, and the application of mid-IR devices, with sections discussing LEDs, laser diodes, and quantum cascade lasers, mid-infrared optoelectronics, emerging research areas, dilute bismide and nitride alloys, Group-IV materials, gallium nitride heterostructures, and new nonlinear materials. Finally, the most relevant applications of mid-infrared devices are reviewed in industry, gas sensing, spectroscopy, and imaging. This book presents a key reference for materials scientists, engineers and professionals working in R&D in the area of semiconductors and optoelectronics. - Provides a comprehensive overview of mid-infrared photodetectors and light sources and the latest materials and devices - Reviews emerging areas of research in the field of mid-infrared optoelectronics, including new materials, such as wide bandgap materials, chalcogenides and new approaches, like heterogeneous integration - Includes information on the most relevant applications in industry, like gas sensing, spectroscopy and imaging
Author: John D. Cressler Publisher: CRC Press ISBN: 1420066862 Category : Technology & Engineering Languages : en Pages : 264
Book Description
What seems routine today was not always so. The field of Si-based heterostructures rests solidly on the shoulders of materials scientists and crystal growers, those purveyors of the semiconductor “black arts” associated with the deposition of pristine films of nanoscale dimensionality onto enormous Si wafers with near infinite precision. We can now grow near-defect free, nanoscale films of Si and SiGe strained-layer epitaxy compatible with conventional high-volume silicon integrated circuit manufacturing. SiGe and Si Strained-Layer Epitaxy for Silicon Heterostructure Devices tells the materials side of the story and details the many advances in the Si-SiGe strained-layer epitaxy for device applications. Drawn from the comprehensive and well-reviewed Silicon Heterostructure Handbook, this volume defines and details the many advances in the Si/SiGe strained-layer epitaxy for device applications. Mining the talents of an international panel of experts, the book covers modern SiGe epitaxial growth techniques, epi defects and dopant diffusion in thin films, stability constraints, and electronic properties of SiGe, strained Si, and Si-C alloys. It includes appendices on topics such as the properties of Si and Ge, the generalized Moll-Ross relations, integral charge-control relations, and sample SiGe HBT compact model parameters.
Author: David Harame Publisher: The Electrochemical Society ISBN: 1566776562 Category : Electronic apparatus and appliances Languages : en Pages : 1136
Book Description
Advanced semiconductor technology is depending on innovation and less on "classical" scaling. SiGe, Ge, and Related Compounds have become a key component of the arsenal in improving semiconductor performance. This issue of ECS Transactions discusses the technology to form these materials, process them, FET devices incorporating them, Surfaces and Interfaces, Optoelectronic devices, and HBT devices.
Author: Sudip Acharya Publisher: ISBN: Category : Crystallization Languages : en Pages : 115
Book Description
Group IV elements based nanoelectronics devices (mainly Si and Ge based devices) have been developed and improved over a long period of time and are the most influencing materials of semiconductor electronics, but due to their indirect bandgap their use in optoelectronics is limited. Alternatively, new Group IV alloys comprised of Ge, Si, and Sn semiconductor materials have emerged as attractive options for various electronic and optoelectronic applications. The binary and ternary alloys provide strain and energy bandgap engineering by controlling element content, a route for realizing direct-transition semiconductors, improvement in interface and defect properties, and a reduction of the process temperature related to the crystal growth. However, there are many obstacles and challenges for the crystal growth of Ge-Sn alloy on the Silicon or Germanium substrate. One of the problems in Ge-Sn growth is Sn precipitation from Ge-Sn. Theoretical calculation predicts that Ge transitions from an indirect semiconductor to a direct semiconductor by incorporation of Sn on Ge matrix. For tensile strained Ge-Sn alloys, the transition is predicted at 6.3% Sn concentration. This is the main driving force for the growth of epitaxial Ge-Sn crystals on Si substrates. The epitaxial growth of Ge-Sn is very challenging because of huge lattice mismatch between Ge and Sn and, the strong surface segregation of Sn on Ge and extremely low equilibrium solubility of Sn on Ge. In the recent past, a lot of progress has been made for the development of epitaxial growth techniques. Besides other techniques like MBE for the deposition of Ge-Sn on the substrate of Si, chemical vapor deposition has been achieved. Similarly, pulsed laser-induced epitaxy is also another technique for the deposition. Besides the experimental efforts to study the Ge-Sn-Si elemental binary and ternary alloys, Molecular Dynamics (MD) modeling provides insight into atomic configurations and structural dynamics, which requires the accurate inter-atomic potential for Ge-Sn-Si binary and ternary system. Present work is an effort to generate Embedded Atom Method (EAM) potential for this system, which can then be used with the MD method to study epitaxial growth. The work presented here uses classical molecular dynamics approach and EAM potential fitting code to develop the EAM potential, which can be used to study the properties of Ge-Sn, Ge-Si, Si-Sn, and Ternary Ge-Sn-Si system. Density Functional Theory (DFT) calculations are performed for each binary pair - Ge-Sn, Ge-Si and Si-Sn using Vienna Ab initio Simulation Package, better known as VASP for a range of temperatures in the range of 1200K- 1500K. The interatomic potential fitting code, MEAMfit, is used to fit EAM potentials to energies and atomic forces generated from DFT calculations. The data to be fitted are directly read from "vasprun.xml" files from VASP. Three different methods were used to test the accuracy of developed potentials, namely, testing the fit for its predictability of DFT energies in the testing set; computing elastic properties, and crystal properties such as phonon band-structure with fitted potential and comparing those with direct DFT calculations.
Author: Jiang Wu Publisher: John Wiley & Sons ISBN: 3527349766 Category : Technology & Engineering Languages : en Pages : 293
Book Description
Understand the future of optical imaging with this cutting-edge guide Optoelectronic devices for imaging and sensing are among the backbones of modern technology. Facilitating the mutual conversion of optical and electrical signals, they have applications from telecommunications to molecular spectroscopy, and their incorporation into photon-involved technologies is only growing. The rapid development of this field makes the need for a fully up-to-date introduction all the more critical. Optical Imaging and Sensing meets this need with a comprehensive guide to the novel materials and devices employed in optical imaging and sensing. Given the current revolution in new imaging materials, an introduction that fully incorporates the latest research is an indispensable tool for scientists and engineers in a huge range of fields. The technologies surveyed here promise to transform public security, 5G and next-generation wireless communication, clinical imaging, and many more. Optical Imaging and Sensing Readers will also find: Detailed discussion of materials including semimetallic graphene, semiconducting black phosphorous, and many more Discussion of devices from infrared photodetectors to nonlinear interferometers A thorough look forward to the future of the field Optical Imaging and Sensing is a useful reference for materials scientists, spectroscopists, semiconductor physicists, and engineers working in any field or industry involving optical imaging or sensing technology.
Author: Aboozar Mosleh
Author: Aboozar Mosleh
Author: Yijie Huo
Author: Mohamed Henini
Author: Eric Tournié
Author: D. Harame
Author: John D. Cressler
Author: David Harame
Author: Q. Liu
Author: Sudip Acharya
Author: Jiang Wu