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Author: Yi-Kan Cheng Publisher: Springer Science & Business Media ISBN: 0306470241 Category : Technology & Engineering Languages : en Pages : 220
Book Description
This useful book addresses electrothermal problems in modern VLSI systems. It discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires. The authors present three important applications of VLSI electrothermal analysis: temperature-dependent electromigration diagnosis, cell-level thermal placement, and temperature-driven power and timing analysis.
Author: Yi-Kan Cheng Publisher: Springer Science & Business Media ISBN: 0306470241 Category : Technology & Engineering Languages : en Pages : 220
Book Description
This useful book addresses electrothermal problems in modern VLSI systems. It discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires. The authors present three important applications of VLSI electrothermal analysis: temperature-dependent electromigration diagnosis, cell-level thermal placement, and temperature-driven power and timing analysis.
Author: Márta Rencz Publisher: MDPI ISBN: 303943831X Category : Technology & Engineering Languages : en Pages : 310
Book Description
This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
Author: J. Altet Publisher: Springer Science & Business Media ISBN: 1475736355 Category : Technology & Engineering Languages : en Pages : 212
Book Description
Temperature has been always considered as an appreciable magnitude to detect failures in electric systems. In this book, the authors present the feasibility of considering temperature as an observable for testing purposes, with full coverage of the state of the art.
Author: Blaise Ravelo Publisher: Springer Nature ISBN: 9811505527 Category : Technology & Engineering Languages : en Pages : 239
Book Description
This book focuses on the modelling methodology of microstrip interconnects, discussing various structures of single-input multiple-output (SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based on single-input single-output (SIMO) models of symmetric and asymmetric trees, and investigates more complicated phenomenon, such as interbranch coupling. The modelling approaches are based on the analytical methods using the Z-, Y- and T-matrices. The established method enables the S-parameters and voltage transfer function of SIMO tree to be determined. Providing illustrative results with frequency and time domain analyses for each tree interconnect structure, the book is a valuable resource for researchers, engineers, and graduate students in fields of analogue, RF/microwave, digital and mixed circuit design, SI and manufacturing engineering.
Author: Joseph Bernstein Publisher: Academic Press ISBN: 0128008199 Category : Technology & Engineering Languages : en Pages : 108
Book Description
This work will educate chip and system designers on a method for accurately predicting circuit and system reliability in order to estimate failures that will occur in the field as a function of operating conditions at the chip level. This book will combine the knowledge taught in many reliability publications and illustrate how to use the knowledge presented by the semiconductor manufacturing companies in combination with the HTOL end-of-life testing that is currently performed by the chip suppliers as part of their standard qualification procedure and make accurate reliability predictions. This book will allow chip designers to predict FIT and DPPM values as a function of operating conditions and chip temperature so that users ultimately will have control of reliability in their design so the reliability and performance will be considered concurrently with their design. - The ability to include reliability calculations and test results in their product design - The ability to use reliability data provided to them by their suppliers to make meaningful reliability predictions - Have accurate failure rate calculations for calculating warrantee period replacement costs
Author: Luis R.J. Costa Publisher: Springer Science & Business Media ISBN: 3642122949 Category : Technology & Engineering Languages : en Pages : 610
Book Description
This book is a collection of 65 selected papers presented at the 7th International Conference on Scientific Computing in Electrical Engineering (SCEE), held in Espoo, Finland, in 2008. The aim of the SCEE 2008 conference was to bring together scientists from academia and industry, e.g. mathematicians, electrical engineers, computer scientists, and physicists, with the goal of intensive discussions on industrially relevant mathematical problems, with an emphasis on modeling and numerical simulation of electronic circuits and devices, electromagnetic fields, and coupled problems.This extensive reference work is divided into five parts: 1. Computational electromagnetics, 2. Circuit simulation, 3. Coupled problems, 4. Mathematical and computational methods, and 5. Model-order reduction. Each part starts with an general introduction followed by the actual papers.
Author: Yi-Kan Cheng
Author: Yi-Kan Cheng
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Author: Márta Rencz
Author: J. Altet
Author: Blaise Ravelo
Author: Shahrzad Salemi
Author: Joseph Bernstein
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Author: Luis R.J. Costa
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