Electronic Packaging, Microelectronics, and Interconnection Dictionary PDF Download
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Author: Charles A. Harper Publisher: McGraw-Hill Professional Publishing ISBN: Category : Technology & Engineering Languages : en Pages : 264
Book Description
From circuits and communication systems to all types of electronic subsystems and assemblies, this reference includes concise definitions for more than 6000 terms, acronyms, abbreviations and symbols that are commonly encountered by everyone working in the industry, whatever their expertise.
Author: Charles A. Harper Publisher: McGraw-Hill Professional Publishing ISBN: Category : Technology & Engineering Languages : en Pages : 264
Book Description
From circuits and communication systems to all types of electronic subsystems and assemblies, this reference includes concise definitions for more than 6000 terms, acronyms, abbreviations and symbols that are commonly encountered by everyone working in the industry, whatever their expertise.
Author: Charles A. Harper Publisher: McGraw-Hill Professional Publishing ISBN: Category : Technology & Engineering Languages : en Pages : 1112
Book Description
Covering every aspect of electronic packaging from development and design to manufacturing, facilities, and testing, Electronic Packaging and Interconnection Handbook, Third Edition, continues to be the standard reference in its field. Here, in this single information-packed resource are all the data and guidelines you need for all types and levels of electronic packages, interconnection technologies, and electronic systems. No other book treats all of the subjects covered in this handbook in such an integrated and inter-related manner, a treatment designed to help you achieve a more reliable, more manufacturable, and more cost-effective electronic package. Here's everything you need to know about materials, thermal management, mechanical and thermomechanical stress behavior, wiring and cabling, soldering and solder technology, integrated circuit packaging, surface mount technologies, rigid and flexible printed wiring boards. And with over 60% new material, this third edition brings you thoroughly up to speed on a new generation of packaging technologies: single chip packaging...ball gridarrays...chip scale packaging...low-cost flip chiptechnologies...direct chip attach, and more.
Author: Junmo Kim Publisher: AuthorHouse ISBN: 1546245766 Category : Business & Economics Languages : en Pages : 80
Book Description
Technology development needs a market. Since technology development is from supply side, it is always crucial to pay attention to the demand side of technology. Taking this notion as an underlying assumption, this book discusses a technology development case in the realm of microelectronic packaging technology based on a real case study of a three-year consecutive research and development program conducted in Korea with expandable implications for other contexts.
Author: David W. South Publisher: CRC Press ISBN: 9780849324444 Category : Computers Languages : en Pages : 318
Book Description
Written for the professional and the layman, the book provides the meanings of important and interesting acronyms in the broad area of computing and information science and technology. The acronyms and abbreviations contained in this book were created by the men and women of the computer and information age to save time and space and eliminate unnecessary repetition and wordage. The book is of value to engineers, scientists, technologists, executives and managers in technical fields, programmers, systems analysts, writers, and computer owners or potential buyers.
Author: Robert S. Mroczkowski Publisher: McGraw Hill Professional ISBN: 9780070414013 Category : Technology & Engineering Languages : en Pages : 446
Book Description
Includes data on connectors, this handbook covers the basic functions of connectors and details the range of electronic connectors. It discusses connector parameters in an application context to expedite implementation, and provides design and materials selection criteria for the range of connectors.
Author: Stephen G. Konsowski Publisher: McGraw Hill Professional ISBN: 9780070359703 Category : Technology & Engineering Languages : en Pages : 488
Book Description
A comprehensive guide to the packaging of high speed circuits for today's advanced electronic products. This is a unique and expert guide to the design and packaging of the high-frequency circuitry crucial to the performance of today's advanced electronic products, such as Pentium chips, HDTV, and mobile communications. Written by two of the leading innovators in the field, this book fully explains integrated design approaches that will enable you to take advantage of all the latest advances in electronic devices, circuit design, materials, and circuit packaging. You'll read about approaches that include basic signal transmission theory, digital circuit design, and how these are integrated with the packaging and interconnection characteristics. There is detailed coverage of signal behavior in both high speed digital circuits, as well as crucial aspects of materials selection and manufacturing. This state-of-the-art resource also provides you with practical design guidelines--plus information on the major issues of design verification and perfomance evaluation.
Author: Jerry E. Sergent Publisher: McGraw-Hill Companies ISBN: Category : Technology & Engineering Languages : en Pages : 778
Book Description
Featuring new contributions from experts in the field, the second edition of the Handbook provides electronics design, process, and packaging engineers with the data they need to design, test, and manufacture today's most-wanted hybrid microcircuits.
Author: S W Amos Publisher: Elsevier ISBN: 0080524052 Category : Technology & Engineering Languages : en Pages : 399
Book Description
The revised edition of the Newnes Dictionary of Electronics includes a substantial new section devoted to acronyms and abbreviations. So if you think you know the meaning of ADDER, LAP, FIB, SPICE or WORM, we recommend you check in the Newnes Dictionary of Electronics first.*A concise glossary for electronics, TV, radio and computing*Ideal for engineers, students and enthusiasts*Includes a handy appendix of acronyms
Author: Charles A. Harper
Author: Charles A. Harper
Author: Charles A. Harper
Author: Junmo Kim
Author: David W. South
Author: Robert S. Mroczkowski
Author: Stephen G. Konsowski
Author: 
Author: P. S. Ho
Author: Jerry E. Sergent
Author: S W Amos