Author: Peter Børgesen
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 480
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Electronic Packaging Materials Science VII: Volume 323
Author: Peter Børgesen
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 480
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 480
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Electronic Packaging Materials Science
Author:
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages : 344
Book Description
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages : 344
Book Description
Electronic Packaging Materials Science III: Volume 108
Author: Ralph Jaccodine
Publisher: Mrs Proceedings
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 514
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Publisher: Mrs Proceedings
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 514
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Electronic Packaging Materials Science VIII: Volume 390
Author: Robert C. Sundahl
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 312
Book Description
The dynamic nature of the microelectronics industry, in particular within the area of packaging, requires a continuous updating and revision of priorities. In an effort to communicate these priorities to researchers and engineers in the field, the National Technology Road Map was developed. This proceedings volume, the eighth in a series on electronic packaging, focuses on the materials research, development and processing issues identified in the road map. Topics include: an overview of the National Technology Road Map for Semiconductors; institutional and industrial perspectives; impact on materials needs and materials science issues; and research responses. Technical subtopics include polymers, ceramics, solder and composites.
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 312
Book Description
The dynamic nature of the microelectronics industry, in particular within the area of packaging, requires a continuous updating and revision of priorities. In an effort to communicate these priorities to researchers and engineers in the field, the National Technology Road Map was developed. This proceedings volume, the eighth in a series on electronic packaging, focuses on the materials research, development and processing issues identified in the road map. Topics include: an overview of the National Technology Road Map for Semiconductors; institutional and industrial perspectives; impact on materials needs and materials science issues; and research responses. Technical subtopics include polymers, ceramics, solder and composites.
Scintillator and Phosphor Materials: Volume 348
Author: Marvin J. Weber
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 548
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 548
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Electronic Packaging Materials Science V:
Author: Edwin D. Lillie
Publisher: Cambridge University Press
ISBN: 9781107409996
Category : Technology & Engineering
Languages : en
Pages : 484
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Publisher: Cambridge University Press
ISBN: 9781107409996
Category : Technology & Engineering
Languages : en
Pages : 484
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Electronic Packaging Materials Science IV:
Author: Ralph Jaccodine
Publisher: Cambridge University Press
ISBN: 9781107410398
Category : Technology & Engineering
Languages : en
Pages : 520
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Publisher: Cambridge University Press
ISBN: 9781107410398
Category : Technology & Engineering
Languages : en
Pages : 520
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Electronic Packaging Materials Science IX: Volume 445
Author: Steven K. Groothuis
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 344
Book Description
While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing. These are important areas for technology development in electronic packaging, particularly since materials and processing play an important role in controlling system performance and reliability. Topics include: flip-chip and solder technology; future packaging technology; manufacturing technology in packaging; packaging materials and metrology; interfacial adhesion and fracture and packaging reliability and testing.
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 344
Book Description
While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing. These are important areas for technology development in electronic packaging, particularly since materials and processing play an important role in controlling system performance and reliability. Topics include: flip-chip and solder technology; future packaging technology; manufacturing technology in packaging; packaging materials and metrology; interfacial adhesion and fracture and packaging reliability and testing.
Metal-organic Chemical Vapor Deposition of Electronic Ceramics
Materials Reliability in Microelectronics IV
Author: Materials Research Society. Spring Meeting
Publisher:
ISBN:
Category : Electrodiffusion
Languages : en
Pages : 666
Book Description
Publisher:
ISBN:
Category : Electrodiffusion
Languages : en
Pages : 666
Book Description