IEEE Electronic Components and Technology Conference, 43rd, 1993 PDF Download
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Author: IEEE Components Hybrids & Manufacturing Publisher: Institute of Electrical & Electronics Engineers(IEEE) ISBN: 9780780307940 Category : Languages : en Pages : 1166
Book Description
The ECTC offers papers covering a wide spectrum of topics, including not only electronic components, but also exciting new developments in all areas of electronics technology.
Author: IEEE Components Hybrids & Manufacturing Publisher: Institute of Electrical & Electronics Engineers(IEEE) ISBN: 9780780307940 Category : Languages : en Pages : 1166
Book Description
The ECTC offers papers covering a wide spectrum of topics, including not only electronic components, but also exciting new developments in all areas of electronics technology.
Author: John H. Lau Publisher: Springer Science & Business Media ISBN: 9780442014414 Category : Computers Languages : en Pages : 584
Book Description
This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
Author: M. Datta Publisher: CRC Press ISBN: 020347368X Category : Technology & Engineering Languages : en Pages : 564
Book Description
Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.
Author: IEEE Components Hybrids & Manufacturing
Author: IEEE Components Hybrids & Manufacturing
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Author: 
Author: 
Author: IEEE, Components, Hybrids and Manufacturing Technology
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Author: John H. Lau
Author: John H. Lau
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Author: M. Datta