Design and Modeling for 3D ICs and Interposers PDF Download

Author: Madhavan Swaminathan
Publisher: World Scientific
ISBN: 9814508608
Category : Technology & Engineering
Languages : en
Pages : 379

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Book Description
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

Author: Khaled Salah
Publisher: Springer
ISBN: 3319076116
Category : Technology & Engineering
Languages : en
Pages : 181

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Book Description
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

Author: Kazuo Kondo
Publisher: Springer
ISBN: 3319186752
Category : Science
Languages : en
Pages : 423

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Book Description
This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

Author: Saad Motahhir
Publisher: Springer Nature
ISBN: 3030738825
Category : Technology & Engineering
Languages : en
Pages : 1836

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Book Description
This book gathers selected research papers presented at the First International Conference on Digital Technologies and Applications (ICDTA 21), held at Sidi Mohamed Ben Abdellah University, Fez, Morocco, on 29–30 January 2021. highlighting the latest innovations in digital technologies as: artificial intelligence, Internet of things, embedded systems, network technology, information processing, and their applications in several areas such as hybrid vehicles, renewable energy, robotic, and COVID-19. The respective papers encourage and inspire researchers, industry professionals, and policymakers to put these methods into practice.

Author: Christian Gontrand
Publisher: Bentham Science Publishers
ISBN: 1608058263
Category : Technology & Engineering
Languages : en
Pages : 225

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Book Description
The number of transistors in integrated circuits doubles every two years, as stipulated by Moore’s law, and this has been the driving force for the huge development of the microelectronics industry in the past 50 years – currently advanced to the nanometric scale. This e-book is dedicated to electronic noises and parasites, accounting for issues involving substrate coupling and interconnections, in the perspective of the 3D integration: a second track for enhancing integration, also compatible with Moore’s law. This reference explains the modeling of 3D circuits without delving into the latest advances, but highlights crucial problems, for instance electro-thermo-mechanical problems, which could be addressed through 3D modeling. The book also explains electromagnetic interferences , at different modeling levels (device and circuit) oriented towards 3D integration technologies. It also covers substrate noise, such as disturbances of digital blocks, power bounces, phase noise in oscillators, both at the device level, such as carriers or field fluctuations, and circuit levels. The entanglement between interconnect and substrate is also discussed. This e-book serves as a reference for advanced graduates or researchers in the field of micro and nano electronics interested in topics relevant to electromagnetic interference or the ‘noise’ domain, at device or circuit and system levels

Author: Xing-Chang Wei
Publisher: CRC Press
ISBN: 1315305852
Category : Computers
Languages : en
Pages : 251

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Book Description
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.

Author: Mei Song Tong
Publisher: John Wiley & Sons
ISBN: 1119284880
Category : Science
Languages : en
Pages : 528

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Book Description
A comprehensive, step-by-step reference to the Nyström Method for solving Electromagnetic problems using integral equations Computational electromagnetics studies the numerical methods or techniques that solve electromagnetic problems by computer programming. Currently, there are mainly three numerical methods for electromagnetic problems: the finite-difference time-domain (FDTD), finite element method (FEM), and integral equation methods (IEMs). In the IEMs, the method of moments (MoM) is the most widely used method, but much attention is being paid to the Nyström method as another IEM, because it possesses some unique merits which the MoM lacks. This book focuses on that method—providing information on everything that students and professionals working in the field need to know. Written by the top researchers in electromagnetics, this complete reference book is a consolidation of advances made in the use of the Nyström method for solving electromagnetic integral equations. It begins by introducing the fundamentals of the electromagnetic theory and computational electromagnetics, before proceeding to illustrate the advantages unique to the Nyström method through rigorous worked out examples and equations. Key topics include quadrature rules, singularity treatment techniques, applications to conducting and penetrable media, multiphysics electromagnetic problems, time-domain integral equations, inverse scattering problems and incorporation with multilevel fast multiple algorithm. Systematically introduces the fundamental principles, equations, and advantages of the Nyström method for solving electromagnetic problems Features the unique benefits of using the Nyström method through numerical comparisons with other numerical and analytical methods Covers a broad range of application examples that will point the way for future research The Nystrom Method in Electromagnetics is ideal for graduate students, senior undergraduates, and researchers studying engineering electromagnetics, computational methods, and applied mathematics. Practicing engineers and other industry professionals working in engineering electromagnetics and engineering mathematics will also find it to be incredibly helpful.

Author: Philip Garrou
Publisher: John Wiley & Sons
ISBN: 352762306X
Category : Technology & Engineering
Languages : en
Pages : 798

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Book Description
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.

Author: Vasilis F. Pavlidis
Publisher: Newnes
ISBN: 0124104843
Category : Technology & Engineering
Languages : en
Pages : 770

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Book Description
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization

Author: Albert Ruehli
Publisher: John Wiley & Sons
ISBN: 1119078393
Category : Technology & Engineering
Languages : en
Pages : 465

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Book Description
Bridges the gap between electromagnetics and circuits by addressing electrometric modeling (EM) using the Partial Element Equivalent Circuit (PEEC) method This book provides intuitive solutions to electromagnetic problems by using the Partial Element Equivalent Circuit (PEEC) method. This book begins with an introduction to circuit analysis techniques, laws, and frequency and time domain analyses. The authors also treat Maxwell's equations, capacitance computations, and inductance computations through the lens of the PEEC method. Next, readers learn to build PEEC models in various forms: equivalent circuit models, non-orthogonal PEEC models, skin-effect models, PEEC models for dielectrics, incident and radiate field models, and scattering PEEC models. The book concludes by considering issues like stability and passivity, and includes five appendices some with formulas for partial elements. Leads readers to the solution of a multitude of practical problems in the areas of signal and power integrity and electromagnetic interference Contains fundamentals, applications, and examples of the PEEC method Includes detailed mathematical derivations Circuit Oriented Electromagnetic Modeling Using the PEEC Techniques is a reference for students, researchers, and developers who work on the physical layer modeling of IC interconnects and Packaging, PCBs, and high speed links.