Author: H. L. HvimsPublisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Electrically Conductive Adhesives for SMT
Author: H. L. HvimsMiljøvenlig elektronikproduktion
Author: Henrik L. HuimsPublisher:
ISBN: 9788773981054
Category :
Languages : da
Pages : 250
Book Description
Adhesives as Solder Replacement for SMT
Author: Henrik L. HvimsElectrically Conductive Adhesives
Author: Rajesh GomatamPublisher: BRILL
ISBN: 9004165924
Category : Technology & Engineering
Languages : en
Pages : 434
Book Description
This book is based on two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to the logic of electrically conductive adhesives. The contains a total of 21 papers (reflecting overviews and original research).
Electrical Conductive Adhesives with Nanotechnologies
Author: Yi (Grace) LiPublisher: Springer Science & Business Media
ISBN: 0387887830
Category : Technology & Engineering
Languages : en
Pages : 445
Book Description
“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.
Conductive Adhesives for Surface Mount (smt) Printed Circuit Board (pcb) Assembly
Author: Minhyon JeonPublisher:
ISBN:
Category : Adhesives
Languages : en
Pages : 210
Book Description
Adhesives Technology for Electronic Applications
Author: James J. LicariPublisher: William Andrew
ISBN: 1437778909
Category : Technology & Engineering
Languages : en
Pages : 415
Book Description
Approx.512 pages Approx.512 pages
Advanced Adhesives in Electronics
Author: M O AlamPublisher: Elsevier
ISBN: 0857092898
Category : Technology & Engineering
Languages : en
Pages : 279
Book Description
Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author: Ephraim SuhirPublisher: Springer Science & Business Media
ISBN: 0387329897
Category : Technology & Engineering
Languages : en
Pages : 1471
Book Description
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Electronics Manufacturing
Author: John H. LauPublisher: McGraw Hill Professional
ISBN:
Category : Education
Languages : en
Pages : 680
Book Description
An engineer's guidebook demonstrating non-toxic electronics manufacturing processes