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Book Description
Les technologies de films minces sur isolant apparaissent comme des solutions fiables pour la nano électronique. Elles permettent de dépasser les limites des technologies sur substrat silicium massif, en autorisant de faibles tensions d'utilisation et un gain en énergie significatif. En effet, les transistors à semi-conducteurs à grille métallique (MOSFET) avec un substrat totalement déplété (FDSOI) conduisent à des courants de fuites faible et améliorent la variabilité ce qui permet de diminuer les tensions d'alimentation en particulier pour les applications SRAM. A partir du nœud 14 nm, les transistors peuvent intégrer un canal SiGe, le diélectrique high-k et la grille métallique. Tous ces nouveaux modules de procédés technologiques rendent l'analyse électrique des transistors MOS ainsi que sa corrélation avec la technologie plus compliquées. Ce travail de thèse propose plusieurs nouvelles méthodologies d'extraction automatique et statistique de paramètres pour les empilements MOS FDSOI avancées. Ces méthodologies sont toutes basées sur des mesures de capacité par rapport à la tension (C-V) rendant compte du couplage capacitif entre grille métallique, canal et substrat face arrière. Avec de telles caractéristiques C-V, des méthodologies fiables sont proposées pour l'épaisseur d'oxyde de grille équivalente (EOT), le travail effectif de la grille métallique FDSOI (WFeff), ainsi que d'autres paramètres comme les épaisseurs du canal (tch) et de l'oxyde enterré (tbox) ainsi que l'affinité électronique efficace (Xeff) du substrat face arrière qui inclut les différents effets électrostatique à l'œuvre dans l'oxyde enterré et à ses interfaces. Ces différentes méthodologies ont été validées par des simulations quantiques. La force de l'analyse expérimentale a été de contrôler la cohérence des extractions obtenues sur tout un ensemble de transistors MOS obtenus à partir de variation sur les différentes briques de base et de contrôler la cohérence des paramètres extraits.
Book Description
Les technologies de films minces sur isolant apparaissent comme des solutions fiables pour la nano électronique. Elles permettent de dépasser les limites des technologies sur substrat silicium massif, en autorisant de faibles tensions d'utilisation et un gain en énergie significatif. En effet, les transistors à semi-conducteurs à grille métallique (MOSFET) avec un substrat totalement déplété (FDSOI) conduisent à des courants de fuites faible et améliorent la variabilité ce qui permet de diminuer les tensions d'alimentation en particulier pour les applications SRAM. A partir du nœud 14 nm, les transistors peuvent intégrer un canal SiGe, le diélectrique high-k et la grille métallique. Tous ces nouveaux modules de procédés technologiques rendent l'analyse électrique des transistors MOS ainsi que sa corrélation avec la technologie plus compliquées. Ce travail de thèse propose plusieurs nouvelles méthodologies d'extraction automatique et statistique de paramètres pour les empilements MOS FDSOI avancées. Ces méthodologies sont toutes basées sur des mesures de capacité par rapport à la tension (C-V) rendant compte du couplage capacitif entre grille métallique, canal et substrat face arrière. Avec de telles caractéristiques C-V, des méthodologies fiables sont proposées pour l'épaisseur d'oxyde de grille équivalente (EOT), le travail effectif de la grille métallique FDSOI (WFeff), ainsi que d'autres paramètres comme les épaisseurs du canal (tch) et de l'oxyde enterré (tbox) ainsi que l'affinité électronique efficace (Xeff) du substrat face arrière qui inclut les différents effets électrostatique à l'œuvre dans l'oxyde enterré et à ses interfaces. Ces différentes méthodologies ont été validées par des simulations quantiques. La force de l'analyse expérimentale a été de contrôler la cohérence des extractions obtenues sur tout un ensemble de transistors MOS obtenus à partir de variation sur les différentes briques de base et de contrôler la cohérence des paramètres extraits.
Author: Sorin Cristoloveanu Publisher: Springer Science & Business Media ISBN: 1461522455 Category : Technology & Engineering Languages : en Pages : 389
Book Description
Silicon on Insulator is more than a technology, more than a job, and more than a venture in microelectronics; it is something different and refreshing in device physics. This book recalls the activity and enthu siasm of our SOl groups. Many contributing students have since then disappeared from the SOl horizon. Some of them believed that SOl was the great love of their scientific lives; others just considered SOl as a fantastic LEGO game for adults. We thank them all for kindly letting us imagine that we were guiding them. This book was very necessary to many people. SOl engineers will certainly be happy: indeed, if the performance of their SOl components is not always outstanding, they can now safely incriminate the relations given in the book rather than their process. Martine, Gunter, and Y. S. Chang can contemplate at last the amount of work they did with the figures. Our SOl accomplices already know how much we borrowed from their expertise and would find it indecent to have their detailed contri butions listed. Jean-Pierre and Dimitris incited the book, while sharing their experience in the reliability of floating bodies. Our families and friends now realize the SOl capability of dielectrically isolating us for about two years in a BOX. Our kids encouraged us to start writing. Our wives definitely gave us the courage to stop writing. They had a hard time fighting the symptoms of a rapidly developing SOl allergy.
Author: George K. Celler Publisher: The Electrochemical Society ISBN: 1566775531 Category : Semiconductors Languages : en Pages : 409
Book Description
This issue of ESC Transactions covers recent significant advances in SOI technologies. It will be of interest to materials and device scientists, as well as to process and applications oriented engineers. Several keynote papers introduce and review the main topics. This is followed by contributed papers covering the latest research and implementation results.
Author: Sorin Cristoloveanu Publisher: Springer Science & Business Media ISBN: 9780792395485 Category : Technology & Engineering Languages : en Pages : 414
Book Description
Silicon on Insulator is more than a technology, more than a job, and more than a venture in microelectronics; it is something different and refreshing in device physics. This book recalls the activity and enthu siasm of our SOl groups. Many contributing students have since then disappeared from the SOl horizon. Some of them believed that SOl was the great love of their scientific lives; others just considered SOl as a fantastic LEGO game for adults. We thank them all for kindly letting us imagine that we were guiding them. This book was very necessary to many people. SOl engineers will certainly be happy: indeed, if the performance of their SOl components is not always outstanding, they can now safely incriminate the relations given in the book rather than their process. Martine, Gunter, and Y. S. Chang can contemplate at last the amount of work they did with the figures. Our SOl accomplices already know how much we borrowed from their expertise and would find it indecent to have their detailed contri butions listed. Jean-Pierre and Dimitris incited the book, while sharing their experience in the reliability of floating bodies. Our families and friends now realize the SOl capability of dielectrically isolating us for about two years in a BOX. Our kids encouraged us to start writing. Our wives definitely gave us the courage to stop writing. They had a hard time fighting the symptoms of a rapidly developing SOl allergy.
Author: Dieter K. Schroder Publisher: John Wiley & Sons ISBN: 0471739065 Category : Technology & Engineering Languages : en Pages : 800
Book Description
This Third Edition updates a landmark text with the latest findings The Third Edition of the internationally lauded Semiconductor Material and Device Characterization brings the text fully up-to-date with the latest developments in the field and includes new pedagogical tools to assist readers. Not only does the Third Edition set forth all the latest measurement techniques, but it also examines new interpretations and new applications of existing techniques. Semiconductor Material and Device Characterization remains the sole text dedicated to characterization techniques for measuring semiconductor materials and devices. Coverage includes the full range of electrical and optical characterization methods, including the more specialized chemical and physical techniques. Readers familiar with the previous two editions will discover a thoroughly revised and updated Third Edition, including: Updated and revised figures and examples reflecting the most current data and information 260 new references offering access to the latest research and discussions in specialized topics New problems and review questions at the end of each chapter to test readers' understanding of the material In addition, readers will find fully updated and revised sections in each chapter. Plus, two new chapters have been added: Charge-Based and Probe Characterization introduces charge-based measurement and Kelvin probes. This chapter also examines probe-based measurements, including scanning capacitance, scanning Kelvin force, scanning spreading resistance, and ballistic electron emission microscopy. Reliability and Failure Analysis examines failure times and distribution functions, and discusses electromigration, hot carriers, gate oxide integrity, negative bias temperature instability, stress-induced leakage current, and electrostatic discharge. Written by an internationally recognized authority in the field, Semiconductor Material and Device Characterization remains essential reading for graduate students as well as for professionals working in the field of semiconductor devices and materials. An Instructor's Manual presenting detailed solutions to all the problems in the book is available from the Wiley editorial department.
Author: Tibor Grasser Publisher: Springer Nature ISBN: 3030375005 Category : Technology & Engineering Languages : en Pages : 724
Book Description
This book summarizes the state-of-the-art, regarding noise in nanometer semiconductor devices. Readers will benefit from this leading-edge research, aimed at increasing reliability based on physical microscopic models. Authors discuss the most recent developments in the understanding of point defects, e.g. via ab initio calculations or intricate measurements, which have paved the way to more physics-based noise models which are applicable to a wider range of materials and features, e.g. III-V materials, 2D materials, and multi-state defects. Describes the state-of-the-art, regarding noise in nanometer semiconductor devices; Enables readers to design more reliable semiconductor devices; Offers the most up-to-date information on point defects, based on physical microscopic models.
Author: Samares Kar Publisher: The Electrochemical Society ISBN: 1566778220 Category : Science Languages : en Pages : 621
Book Description
The issue of ECS Transactions will cover comprehensively all the aspects of high-k material physics and technology: Diverse High Mobility Substrates, High-k Materials, Metal Gate Electrode Materials, Deposition Techniques, Bulk Material Properties, Flat-Band Voltage Issues and Control, Interfaces, Gate Stack Reliability, Electrical, Chemical, and Physical Chatracterization, Novel Applications, High-k and Diverse Insulators for Photonics, High-k Processing/ Manufacturing.
Author: Ming Fu Li Publisher: World Scientific ISBN: 1908978384 Category : Technology & Engineering Languages : en Pages : 529
Book Description
This unique volume assembles the author's scientific and engineering achievements of the past three decades in the areas of (1) semiconductor physics and materials, including topics in deep level defects and band structures, (2) CMOS devices, including the topics in device technology, CMOS device reliability, and nano CMOS device quantum modeling, and (3) Analog Integrated circuit design. It reflects the scientific career of a semiconductor researcher educated in China during the 20th century. The book can be referenced by research scientists, engineers, and graduate students working in the areas of solid state and semiconductor physics and materials, electrical engineering and semiconductor devices, and chemical engineering./a
Author: Blend Mohamad
Author: Blend Mohamad
Author: Sorin Cristoloveanu
Author: 
Author: George K. Celler
Author: Sorin Cristoloveanu
Author: Dieter K. Schroder
Author: Tibor Grasser
Author: Samares Kar
Author: Ji'an Chen
Author: Ming Fu Li