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Author: Milton Ohring Publisher: Academic Press ISBN: 0080575528 Category : Technology & Engineering Languages : en Pages : 759
Book Description
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Author: Milton Ohring Publisher: Academic Press ISBN: 0080575528 Category : Technology & Engineering Languages : en Pages : 759
Book Description
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Author: John Moalli Publisher: William Andrew ISBN: 081551865X Category : Technology & Engineering Languages : en Pages : 351
Book Description
This book contains analysis of reasons that cause products to fail. General methods of product failure evaluation give powerful tools in product improvement. Such methods, discussed in the book, include practical risk analysis, failure mode and effect analysis, preliminary hazard analysis, progressive failure analysis, fault tree analysis, mean time between failures, Wohler curves, finite element analysis, cohesive zone model, crack propagation kinetics, time-temperature collectives, quantitative characterization of fatigue damage, and fracture maps. Methods of failure analysis are critical to for material improvement and they are broadly discussed in this book. Fractography of plastics is relatively a new field which has many commonalities with fractography of metals. Here various aspects of fractography of plastics and metals are compared and contrasted. Fractography application in studies of static and cycling loading of ABS is also discussed. Other methods include SEM, SAXS, FTIR, DSC, DMA, GC/MS, optical microscopy, fatigue behavior, multiaxial stress, residual stress analysis, punch resistance, creep-rupture, impact, oxidative induction time, craze testing, defect analysis, fracture toughness, activation energy of degradation.Many references are given in this book to real products and real cases of their failure. The products discussed include office equipment, automotive compressed fuel gas system, pipes, polymer blends, blow molded parts, layered, cross-ply and continuous fiber composites, printed circuits, electronic packages, hip implants, blown and multilayered films, construction materials, component housings, brake cups, composite pressure vessels, swamp coolers, electrical cables, plumbing fittings, medical devices, medical packaging, strapping tapes, balloons, marine coatings, thermal switches, pressure relief membranes, pharmaceutical products, window profiles, and bone cements.
Author: Publisher: ASM International ISBN: 9780871702852 Category : Technology & Engineering Languages : en Pages : 1234
Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author: Publisher: ISBN: Category : Computer networks Languages : en Pages : 32
Book Description
High performance computing (HPC) has historically played a major role in the ability of the United States to develop and deploy superior weapons, warfighting capabilities, and mission support systems. Under the auspices of the Director, Defense Research and Engineering (DDR & E), the Department of Defense (DoD) High Performance Computing Modernization Program (HPCMP) is the focused modernization effort within the DoD to acquire, manage, and sustain modern HPC resources in support of defense science and technology, and developmental test and evaluation. The HPCMP is rapidly evolving past its initial program development and procurement start up phase and is increasing focus on application of HPC technology and resources to priority defense requirements. This plan describes some of the accomplishments achieved by the program in Fiscal Year (FY) 1997 and outlines the major strategies and milestones we expect to achieve over the next two years. The overriding goal of the program is to exploit HPC technology for military advantage across battlespace. The strategy to achieve this goal is to acquire and sustain world class high performance computing and network capabilities for use by defense scientists and engineers.
Author: Preeti Maheshwari Publisher: New Age International ISBN: 9788122417944 Category : Electronic apparatus and appliances Languages : en Pages : 230
Book Description
This Concise And Comprehensive Text Will Present The Students With A Single Book Containing All The Essential Theories On The Subject. Using An Interdisciplinary Approach, The Book Encompasses The Three Main Aspects Of The Subject, Namely, Electronic Material, Component And Processes.Throughout The Book, Stress Has Been Given On Fundamental Concepts Through Illustrative Examples. It Is Kept In Consideration To Use Simple And Lucid Language Keeping In View The Different Language Background Of Students.The Book Is Primarily Aimed At Serving The Acute Demand Of The Students Of Ece, Ee, Eic, Electrical Engg. And Diploma, Searching Useful Matter On Electronic Materials, Components And Processes . The Book Covers Each And Every Topic As Per The Syllabus Of University Of Rajasthan, Of Third Semester B.E./B.Tech. Courses, But With Its Wide Coverage And Easily Comprehensible Style, The Book Would Also Be Immensely Useful For Engineering Undergraduates Of Other Indian Technical Universities.
Author: Mohamed Gad-el-Hak Publisher: CRC Press ISBN: 9781420050905 Category : Technology & Engineering Languages : en Pages : 1386
Book Description
The revolution is well underway. Our understanding and utilization of microelectromechanical systems (MEMS) are growing at an explosive rate with a worldwide market approaching billions of dollars. In time, microdevices will fill the niches of our lives as pervasively as electronics do right now. But if these miniature devices are to fulfill their mammoth potential, today's engineers need a thorough grounding in the underlying physics, modeling techniques, fabrication methods, and materials of MEMS. The MEMS Handbook delivers all of this and more. Its team of authors-unsurpassed in their experience and standing in the scientific community- explore various aspects of MEMS: their design, fabrication, and applications as well as the physical modeling of their operations. Designed for maximum readability without compromising rigor, it provides a current and essential overview of this fledgling discipline.
Author: C. W. Douglass Publisher: ISBN: Category : Weapons systems Languages : en Pages : 36
Book Description
The scope of the Air Force materials research effort encompasses all advanced system requirements, as reflected by analysis of their mission profile, for which materials capability does not exist. To portray the vital role of materials, a review is made of serveral typical advance system concepts. The most critical materials problems, as represented by primary system components within the major areas of primary and secondary structure, environmental protection, electronics and energy transfer systems are discussed. (Author).
Author: Milton Ohring
Author: Milton Ohring
Author: John Moalli
Author: Defense Documentation Center (U.S.)
Author: J. M. Blocher
Author: 
Author: 
Author: Preeti Maheshwari
Author: 
Author: Mohamed Gad-el-Hak
Author: C. W. Douglass