ECTC 2016 PDF Download

Author:
Publisher:
ISBN: 9781509012039
Category :
Languages : en
Pages :

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Author: Yan Li
Publisher: Springer Nature
ISBN: 9811570906
Category : Technology & Engineering
Languages : en
Pages : 629

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Book Description
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.

Author:
Publisher:
ISBN: 9781509012046
Category :
Languages : en
Pages :

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Author: Mahmood Aliofkhazraei
Publisher: BoD – Books on Demand
ISBN: 1789231787
Category : Science
Languages : en
Pages : 228

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Book Description
Intermetallic compounds are usually brittle with high melting points. Their properties are often found among ceramic and metallic materials. In most cases, their hot corrosion resistance and simultaneously hardness are important. One of the main applications of intermetallic compounds is for superalloy turbine blades in which they show appropriate high-temperature-related properties. This book collects new developments about intermetallic compounds and their recent usages.

Author: Xin Zhang
Publisher: Springer Nature
ISBN: 9819904595
Category : Technology & Engineering
Languages : en
Pages : 221

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Book Description
A power converter is a device used in electrical engineering, power engineering, and the electric power sector to convert electric energy from one form to another, such as converting between AC and DC, changing voltage or frequency, or a combination of these. It is used in a variety of applications, such as industrial drives, power supply, energy generating equipment, consumer goods, electrical vehicles/aeroplanes/ships, smart grids and more.This book will open a door for engineers to design the power converters via the artificial intelligence (AI) method. It begins by reviewing current AI technology in power converters. The book then introduces customized AI algorithms for power converters that take into account the particular characteristics of power converters. The book then presents a set of AI-based design methodologies for power devices, including DC/DC converters, resonant DC/DC converters, bidirectional DC/DC converters, DC/AC inverters, and AC/DC rectifiers. This is the first book to cover all you need to know about using AI to create power converters, including a literature review, algorithm, and circuit design.

Author: John H. Lau
Publisher: Springer
ISBN: 9811088845
Category : Technology & Engineering
Languages : en
Pages : 319

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Book Description
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.

Author: IEEE Staff
Publisher:
ISBN: 9781509012053
Category :
Languages : en
Pages :

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premier components, packaging and technology conference

Author: Riko Radojcic
Publisher: Springer
ISBN: 3319525484
Category : Technology & Engineering
Languages : en
Pages : 192

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Book Description
This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore’s Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.

Author: John H. Lau
Publisher: Springer Nature
ISBN: 9811999171
Category : Technology & Engineering
Languages : en
Pages : 542

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Book Description
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Author: John H. Lau
Publisher: Springer Nature
ISBN: 9811539200
Category : Technology & Engineering
Languages : en
Pages : 545

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Book Description
This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.