Direct Liquid Evaporation Chemical Vapor Deposition(DLE-CVD) of Nickel, Manganese and Copper-Based Thin Films for Interconnects in Three-Dimensional Microelectronic Systems PDF Download

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Direct Liquid Evaporation Chemical Vapor Deposition(DLE-CVD) of Nickel, Manganese and Copper-Based Thin Films for Interconnects in Three-Dimensional Microelectronic Systems

Direct Liquid Evaporation Chemical Vapor Deposition(DLE-CVD) of Nickel, Manganese and Copper-Based Thin Films for Interconnects in Three-Dimensional Microelectronic Systems PDF Author: Kecheng Li
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Languages : en
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Book Description
Chapter 2 introduces the advantages of DLE-CVD process and its application in deposition of Nickel, Manganese and Copper based thin films. DLE-CVD process is used to deliver consistent and high vapor concentrations of Nickel, Manganese and Copper precursors to coat nanostructures with high aspect ratios.
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