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Author: D.J. Stephenson Publisher: Springer Science & Business Media ISBN: 9401136742 Category : Technology & Engineering Languages : en Pages : 326
Book Description
There is currently great interest in the process of diffusion bonding. The main thrust has been in the joining of advanced materials such as superplastic alloys, metal matrix composites and ceramics and, most importantly, to introduce the process into mass-production operations. Diffusion bonding has also led to reduced manufacturing costs and weight savings in conventional materials and developments in hot isostatic pressing have allowed greater design flexibility. Since the first conference on Diffusion Bonding, held at Cranfield in 1987, considerable advances have been made and it was therefore considered appropriate to organise the Second International Conference on Diffusion Bonding which was held at Cranfield Institute of Technology on 28 and 29 March 1990. The meeting provided a forum for the presentation and discussion of recent developments in Diffusion Bonding and was divided into four main subject areas: steel bonding and quality control, diffusion bonding of aluminium alloys, bonding of high temperature materials and general applications. This structure is retained in the proceedings. DAVID STEPHENSON vii CONTENTS v Preface ......................... .
Author: D.J. Stephenson Publisher: Springer Science & Business Media ISBN: 9401136742 Category : Technology & Engineering Languages : en Pages : 326
Book Description
There is currently great interest in the process of diffusion bonding. The main thrust has been in the joining of advanced materials such as superplastic alloys, metal matrix composites and ceramics and, most importantly, to introduce the process into mass-production operations. Diffusion bonding has also led to reduced manufacturing costs and weight savings in conventional materials and developments in hot isostatic pressing have allowed greater design flexibility. Since the first conference on Diffusion Bonding, held at Cranfield in 1987, considerable advances have been made and it was therefore considered appropriate to organise the Second International Conference on Diffusion Bonding which was held at Cranfield Institute of Technology on 28 and 29 March 1990. The meeting provided a forum for the presentation and discussion of recent developments in Diffusion Bonding and was divided into four main subject areas: steel bonding and quality control, diffusion bonding of aluminium alloys, bonding of high temperature materials and general applications. This structure is retained in the proceedings. DAVID STEPHENSON vii CONTENTS v Preface ......................... .
Author: N.F. Kazakov Publisher: Elsevier ISBN: 1483150550 Category : Technology & Engineering Languages : en Pages : 305
Book Description
Diffusion Beading of Materials is an attempt to pool the experience in vacuum diffusion bonding accumulated by a number of mechanical engineering works, research establishments, and colleges. The book discusses the principal bonding variables and recommended procedures for diffusion bonding in vacuum; the equipment for diffusion bonding and production rate; and the mechanization and automation of equipment. The text also describes the diffusion bonding of steels; the bonding of cast iron and cast iron to steel; and the bonding of dissimilar metals and alloys. The bonding of refractory and active metals and their alloys; the bonding of high-temperature alloys, nickel and nickel alloys; and the bonding of cemented carbides and of a cemented carbide to steel are also considered. The book further tackles the repair and reconditioning by diffusion bonding; the bonding of porous materials; and diffusion metallurgy. The text also encompasses nonmetals and their joining to metals; quality control of diffusion-bonded joints; accident prevention; and cleanliness in vacuum diffusion bonding.
Author: Masayoshi Esashi Publisher: John Wiley & Sons ISBN: 3527823255 Category : Technology & Engineering Languages : en Pages : 528
Book Description
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Author: Robert Edward Monroe Publisher: ISBN: Category : Adhesives Languages : en Pages : 86
Book Description
This report supplies information on joining processes applicable to titanium and its alloys in sheet metal applications, primarily related directly to airframe construction. Although the material presented here does not cover all titanium joining processes, and omits such processes as plasma-arc, submerged-arc, electroslag, flash, and high-frequency resistance welding, the data presented cover materials up to 2-inches thick in some cases and the report should be useful to anyone seeking titanium joining information. The joining processes covered fall into five categories: welding, brazing, metallurgical bonding (diffusion and deformation bonding), adhesive bonding, and mechanical fastening. The fusion welding processes that are discussed in detail include gas tungsten arc, gas metal arc, arc spot, and electron beam. The resistance processes give extended coverage are spot, roll spot, and seam welding. (Author).
Author: Paul Flowers Publisher: ISBN: 9781947172623 Category : Chemistry Languages : en Pages : 0
Book Description
Chemistry 2e is designed to meet the scope and sequence requirements of the two-semester general chemistry course. The textbook provides an important opportunity for students to learn the core concepts of chemistry and understand how those concepts apply to their lives and the world around them. The book also includes a number of innovative features, including interactive exercises and real-world applications, designed to enhance student learning. The second edition has been revised to incorporate clearer, more current, and more dynamic explanations, while maintaining the same organization as the first edition. Substantial improvements have been made in the figures, illustrations, and example exercises that support the text narrative. Changes made in Chemistry 2e are described in the preface to help instructors transition to the second edition.
Author: Walter Brockmann Publisher: John Wiley & Sons ISBN: 3527318984 Category : Technology & Engineering Languages : en Pages : 433
Book Description
Both solid knowledge of the basics as well as expert knowledge is needed to create rigid, long-lasting and material-specific adhesions in the industrial or trade sectors. Information that is extremely difficult and time-consuming to find in the current literature. Written by specialists in various disciplines from both academia and industry, this handbook is the very first to provide such comprehensive knowledge in a compact and well-structured form. Alongside such traditional fields as the properties, chemistry and characteristic behavior of adhesives and adhesive joints, it also treats in detail current practical questions and the manifold applications for adhesives.
Author: Eduardo Andre Sousa Marques Publisher: John Wiley & Sons ISBN: 3527348697 Category : Technology & Engineering Languages : en Pages : 274
Book Description
Introduction to Adhesive Bonding A step-by-step introduction to basic principles and practical applications of adhesive bonding, designed for students and professionals alike Adhesive bonding—the process of joining two surfaces using glues, epoxies, plastic agents, and other adhesives—is a major technique with wide applications in industries as a diverse as aerospace, footwear manufacturing, and food packaging. Adhesive bonding holds several advantages over conventional joining techniques, such as uniform stress concentrations, protection of the bonded surfaces or joints, and the ability to join a variety of different materials and irregular surfaces. Introduction to Adhesive Bonding provides an accessible overview of the principles and common applications of adhesive bonding. Using a systematic approach, the authors thoroughly explain each step necessary to achieve a successful adhesive bond, including surface preparation, bonding agent selection, design and construction of bonded joints, health and safety considerations, and quality control. Readers are provided with both the theoretical foundation and practical information required to plan and complete their own adhesive bonding projects. This comprehensive yet reader-friendly volume: Highlights the inherent advantages of adhesive bonding in various applications Describes the use of adhesive bonding in the development of novel and advanced projects in different industries Features numerous real-world examples of adhesive bonding in areas such as the transportation industry, civil engineering, medical applications, and sports equipment Discusses how adhesives enable development of new products and constructions of reduced weight and size Identifies important limitations and durability concerns of the use of adhesives in specific applications Introduction to Adhesive Bonding is an ideal textbook for undergraduate or graduate Engineering and Chemistry programs, and a useful reference for researchers and industry professionals working in fields such as Engineering, Surface and Polymer Chemistry, and Materials Science.
Author: Mahadzir Ishak Publisher: BoD – Books on Demand ISBN: 9535125966 Category : Technology & Engineering Languages : en Pages : 286
Book Description
Joining and welding are two of the most important processes in manufacturing. These technologies have vastly improved and are now extensively used in numerous industries. This book covers a wide range of topics, from arc welding (GMAW and GTAW), FSW, laser and hybrid welding, and magnetic pulse welding on metal joining to the application of joining technologies for textile products. The analysis of temperature and phase transformation is also incorporated. This book also discusses the issue of dissimilar joint between metal and ceramic, as well as the technology of diffusion bonding.
Author: Michael F. Ashby Publisher: Elsevier ISBN: 1483297217 Category : Technology & Engineering Languages : en Pages : 380
Book Description
Provides a thorough explanation of the basic properties of materials; of how these can be controlled by processing; of how materials are formed, joined and finished; and of the chain of reasoning that leads to a successful choice of material for a particular application. The materials covered are grouped into four classes: metals, ceramics, polymers and composites. Each class is studied in turn, identifying the families of materials in the class, the microstructural features, the processes or treatments used to obtain a particular structure and their design applications. The text is supplemented by practical case studies and example problems with answers, and a valuable programmed learning course on phase diagrams.
Author: D.J. Stephenson
Author: D.J. Stephenson
Author: N.F. Kazakov
Author: The Minerals, Metals & Materials Society
Author: Masayoshi Esashi
Author: Robert Edward Monroe
Author: Paul Flowers
Author: Walter Brockmann
Author: Eduardo Andre Sousa Marques
Author: Mahadzir Ishak
Author: Michael F. Ashby