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Author: Paolo Mele Publisher: ISBN: 9781536160864 Category : Zinc oxide thin films Languages : en Pages : 0
Book Description
Zinc oxide (ZnO) is an n-type semiconductor with versatile applications such as optical devices in ultraviolet region, piezoelectric transducers, transparent electrode for solar cells and gas sensors. This book "ZnO Thin Films: Properties, Performance and Applications" gives a deep insight in the intriguing science of zinc oxide thin films. It is devoted to cover the most recent advances and reviews the state of the art of ZnO thin films applications involving energy harvesting, microelectronics, magnetic devices, photocatalysis, photovoltaics, optics, thermoelectricity, piezoelectricity, electrochemistry, temperature sensing. It serves as a fundamental information source on the techniques and methodologies involved in zinc oxide thin films growth, characterization, post-deposition plasma treatments and device processing. This book will be invaluable to the experts to consolidate their knowledge and provide insight and inspiration to beginners wishing to learn about zinc oxide thin films.
Author: Paolo Mele Publisher: ISBN: 9781536160864 Category : Zinc oxide thin films Languages : en Pages : 0
Book Description
Zinc oxide (ZnO) is an n-type semiconductor with versatile applications such as optical devices in ultraviolet region, piezoelectric transducers, transparent electrode for solar cells and gas sensors. This book "ZnO Thin Films: Properties, Performance and Applications" gives a deep insight in the intriguing science of zinc oxide thin films. It is devoted to cover the most recent advances and reviews the state of the art of ZnO thin films applications involving energy harvesting, microelectronics, magnetic devices, photocatalysis, photovoltaics, optics, thermoelectricity, piezoelectricity, electrochemistry, temperature sensing. It serves as a fundamental information source on the techniques and methodologies involved in zinc oxide thin films growth, characterization, post-deposition plasma treatments and device processing. This book will be invaluable to the experts to consolidate their knowledge and provide insight and inspiration to beginners wishing to learn about zinc oxide thin films.
Author: Farid Medjdoub Publisher: CRC Press ISBN: 1482220040 Category : Technology & Engineering Languages : en Pages : 372
Book Description
Addresses a Growing Need for High-Power and High-Frequency Transistors Gallium Nitride (GaN): Physics, Devices, and Technology offers a balanced perspective on the state of the art in gallium nitride technology. A semiconductor commonly used in bright light-emitting diodes, GaN can serve as a great alternative to existing devices used in microelectronics. It has a wide band gap and high electron mobility that gives it special properties for applications in optoelectronic, high-power, and high-frequency devices, and because of its high off-state breakdown strength combined with excellent on-state channel conductivity, GaN is an ideal candidate for switching power transistors. Explores Recent Progress in High-Frequency GaN Technology Written by a panel of academic and industry experts from around the globe, this book reviews the advantages of GaN-based material systems suitable for high-frequency, high-power applications. It provides an overview of the semiconductor environment, outlines the fundamental device physics of GaN, and describes GaN materials and device structures that are needed for the next stage of microelectronics and optoelectronics. The book details the development of radio frequency (RF) semiconductor devices and circuits, considers the current challenges that the industry now faces, and examines future trends. In addition, the authors: Propose a design in which multiple LED stacks can be connected in a series using interband tunnel junction (TJ) interconnects Examine GaN technology while in its early stages of high-volume deployment in commercial and military products Consider the potential use of both sunlight and hydrogen as promising and prominent energy sources for this technology Introduce two unique methods, PEC oxidation and vapor cooling condensation methods, for the deposition of high-quality oxide layers A single-source reference for students and professionals, Gallium Nitride (GaN): Physics, Devices, and Technology provides an overall assessment of the semiconductor environment, discusses the potential use of GaN-based technology for RF semiconductor devices, and highlights the current and emerging applications of GaN.
Author: Jaime Alberto Zamudio Flores Publisher: kassel university press GmbH ISBN: 3862193640 Category : Gallium nitride Languages : en Pages : 257
Book Description
This work presents a comprehensive modeling strategy for advanced large-size AlGaN/GaN HEMTs. A 22-element equivalent circuit with 12 extrinsic elements, including 6 capacitances, serves as small-signal model and as basis for a large-signal model. ANalysis of such capacitances leads to original equations, employed to form capacitance ratios. BAsic assumptions of existing parameter extractions for 22-element equivalent circuits are perfected: A) Required capacitance ratios are evaluated with device's top-view images. B) Influences of field plates and source air-bridges on these ratios are considered. The large-signal model contains a gate charge's non-quasi-static model and a dispersive-IDS model. THe extrinsic-to-intrinsic voltage transformation needed to calculate non-quasi-static parameters from small-signal parameters is improved with a new description for the measurement's boundary bias points. ALl IDS-model parameters, including time constants of charge-trapping and self-heating, are extracted using pulsed-DC IV and IDS-transient measurements, highlighting the modeling strategy's empirical character.
Author: Hongyu Yu Publisher: CRC Press ISBN: 1351767615 Category : Science Languages : en Pages : 298
Book Description
GaN is considered the most promising material candidate in next-generation power device applications, owing to its unique material properties, for example, bandgap, high breakdown field, and high electron mobility. Therefore, GaN power device technologies are listed as the top priority to be developed in many countries, including the United States, the European Union, Japan, and China. This book presents a comprehensive overview of GaN power device technologies, for example, material growth, property analysis, device structure design, fabrication process, reliability, failure analysis, and packaging. It provides useful information to both students and researchers in academic and related industries working on GaN power devices. GaN wafer growth technology is from Enkris Semiconductor, currently one of the leading players in commercial GaN wafers. Chapters 3 and 7, on the GaN transistor fabrication process and GaN vertical power devices, are edited by Dr. Zhihong Liu, who has been working on GaN devices for more than ten years. Chapters 2 and 5, on the characteristics of polarization effects and the original demonstration of AlGaN/GaN heterojunction field-effect transistors, are written by researchers from Southwest Jiaotong University. Chapters 6, 8, and 9, on surface passivation, reliability, and package technologies, are edited by a group of researchers from the Southern University of Science and Technology of China.
Author: Gaudenzio Meneghesso Publisher: Springer ISBN: 331977994X Category : Technology & Engineering Languages : en Pages : 242
Book Description
This book demonstrates to readers why Gallium Nitride (GaN) transistors have a superior performance as compared to the already mature Silicon technology. The new GaN-based transistors here described enable both high frequency and high efficiency power conversion, leading to smaller and more efficient power systems. Coverage includes i) GaN substrates and device physics; ii) innovative GaN -transistors structure (lateral and vertical); iii) reliability and robustness of GaN-power transistors; iv) impact of parasitic on GaN based power conversion, v) new power converter architectures and vi) GaN in switched mode power conversion. Provides single-source reference to Gallium Nitride (GaN)-based technologies, from the material level to circuit level, both for power conversions architectures and switched mode power amplifiers; Demonstrates how GaN is a superior technology for switching devices, enabling both high frequency, high efficiency and lower cost power conversion; Enables design of smaller, cheaper and more efficient power supplies.
Author: Eldad Bahat-Treidel Publisher: Cuvillier Verlag ISBN: 3736940947 Category : Science Languages : en Pages : 221
Book Description
Gallium nitride (GaN)-based High Electron Mobility Transistors (HEMTs) for high voltage, high power switching and regulating for space applications are studied in this work. Efficient power switching is associated with operation in high OFF-state blocking voltage while keeping the ON-state resistance, the dynamic dispersion and leakage currents as low as possible. The potential of such devices to operate at high voltages is limited by a chain of factors such as subthreshold leakages and the device geometry. Blocking voltage enhancement is a complicated problem that requires parallel methods for solution; epitaxial layers design, device structural and geometry design, and suitable semiconductor manufacturing technique. In this work physical-based device simulation as an engineering tool was developed. An overview on GaN-based HEMTs physical based device simulation using Silvaco-“ATLAS” is given. The simulation is utilized to analyze, give insight to the modes of operation of the device and for design and evaluation of innovative concepts. Physical-based models that describe the properties of the semiconductor material are introduced. A detailed description of the specific AlGaN/GaN HEMT structure definition and geometries are given along with the complex fine meshing requirements. Nitride-semiconductor specific material properties and their physical models are reviewed focusing on the energetic band structure, epitaxial strain tensor calculation in wurtzite materials and build-in polarization models. Special attention for thermal conductivity, carriers’ mobility and Schottky-gate-reverse-bias-tunneling is paid. Empirical parameters matching and adjustment of models parameters to match the experimental device measured results are discussed. An enhancement of breakdown voltage in AlxGa1-xN/GaN HEMT devices by increasing the electron confinement in the transistor channel using a low Al content AlyGa1-yN back-barrier layer structure is systematically studied. It is shown that the reduced sub-threshold drain-leakage current through the buffer layer postpones the punch-through and therefore shifts the breakdown of the device to higher voltages. It is also shown that the punch-through voltage (VPT) scales up with the device dimensions (gate to drain separation). An optimized electron confinement results both, in a scaling of breakdown voltage with device geometry and a significantly reduced sub-threshold drain and gate leakage currents. These beneficial properties are pronounced even further if gate recess technology is applied for device fabrication. For the systematic study a large variations of back-barrier epitaxial structures were grown on sapphire, n-type 4H-SiC and semi-insulating 4H-SiC substrates. The devices with 5 μm gate-drain separation grown on n-SiC owning Al0.05Ga0.95N and Al0.10Ga0.90N back-barrier exhibit 304 V and 0.43 m × cm2 and 342 V and 0.41 m × cm2 respectively. To investigate the impact of AlyGa1-yN back-barrier on the device properties the devices were characterized in DC along with microwave mode and robustness DC-step-stress test. Physical-based device simulations give insight in the respective electronic mechanisms and to the punch-through process that leads to device breakdown. Systematic study of GaN-based HEMT devices with insulating carbon-doped GaN back-barrier for high voltage operation is also presented. Suppression of the OFF-state sub-threshold drain leakage-currents enables breakdown voltage enhancement over 1000 V with low ON-state resistance. The devices with 5 μm gate-drain separation on SI-SiC and 7 μm gate-drain separation on n-SiC exhibit 938 V and 0.39 m × cm2 and 942 V and 0.39 m × cm2 respectively. Power device figure of merit of ~2.3 × 109 V2/-cm2 was calculated for these devices. The impacts of variations of carbon doping concentration, GaN channel thickness and substrates are evaluated. Trade-off considerations in ON-state resistance and of current collapse are addressed. A novel GaN-based HEMTs with innovative planar Multiple-Grating-Field-Plates (MGFPs) for high voltage operation are described. A synergy effect with additional electron channel confinement by using a heterojunction AlGaN back-barrier is demonstrated. Suppression of the OFF-state sub-threshold gate and drain leakage-currents enables breakdown voltage enhancement over 700 V and low ON-state resistance of 0.68 m × cm2. Such devices have a minor trade-off in ON-state resistance, lag factor, maximum oscillation frequency and cut-off frequency. Systematic study of the MGFP design and the effect of Al composition in the back-barrier are described. Physics-based device simulation results give insight into electric field distribution and charge carrier concentration depending on field-plate design. The GaN superior material breakdown strength properties are not always a guarantee for high voltage devices. In addition to superior epitaxial growth design and optimization for high voltage operation the device geometrical layout design and the device manufacturing process design and parameters optimization are important criteria for breakdown voltage enhancement. Smart layout prevent immature breakdown due to lateral proximity of highly biased interconnects. Optimization of inter device isolation designed for high voltage prevents substantial subthreshold leakage. An example for high voltage test device layout design and an example for critical inter-device insulation manufacturing process optimization are presented. While major efforts are being made to improve the forward blocking performance, devices with reverse blocking capability are also desired in a number of applications. A novel GaN-based HEMT with reverse blocking capability for Class-S switch-mode amplifiers is introduced. The high voltage protection is achieved by introducing an integrated recessed Schottky contact as a drain electrode. Results from our Schottky-drain HEMT demonstrate an excellent reverse blocking with minor trade-off in the ON-state resistance for the complete device. The excellent quality of the forward diode characteristics indicates high robustness of the recess process. The reverse blocking capability of the diode is better than –110 V. Physical-based device simulations give insight in the respective electronic mechanisms. Zusammenfassung In dieser Arbeit wurden Galliumnitrid (GaN)-basierte Hochspannungs-HEMTs (High Electron Mobility Transistor) für Hochleistungsschalt- und Regelanwendungen in der Raumfahrt untersucht. Effizientes Leistungsschalten erfordert einen Betrieb bei hohen Sperrspannungen gepaart mit niedrigem Einschaltwiderstand, geringer dynamischer Dispersion und minimalen Leckströmen. Dabei wird das aus dem Halbleitermaterial herrührende Potential für extrem spannungsfeste Transistoren aufgrund mehrerer Faktoren aus dem lateralen und dem vertikalen Bauelementedesign oft nicht erreicht. Physikalisch-basierte Simulationswerkzeuge für die Bauelemente wurden daher entwickelt. Die damit durchgeführte Analyse der unterschiedlichen Transistorbetriebszustände ermöglichte das Entwickeln innovativer Bauelementdesignkonzepte. Das Erhöhen der Bauelementsperrspannung erfordert parallele und ineinandergreifende Lösungsansätze für die Epitaxieschichten, das strukturelle und das geometrische Design und für die Prozessierungstechnologie. Neuartige Bauelementstrukturen mit einer rückseitigen Kanalbarriere (back-barrier) aus AlGaN oder Kohlenstoff-dotierem GaN in Kombination mit neuartigen geometrischen Strukturen wie den Mehrfachgitterfeldplatten (MGFP, Multiple-Grating-Field-Plate) wurden untersucht. Die elektrische Gleichspannungscharakterisierung zeigte dabei eine signifikante Verringerung der Leckströme im gesperrten Zustand. Dies resultierte bei nach wie vor sehr kleinem Einschaltwiderstand in einer Durchbruchspannungserhöhung um das etwa Zehnfache auf über 1000 V. Vorzeitige Spannungsüberschläge aufgrund von Feldstärkenspitzen an Verbindungsmetallisierungen werden durch ein geschickt gestaltetes Bauelementlayout verhindert. Eine Optimierung der Halbleiterisolierung zwischen den aktiven Strukturen führte auch im kV-Bereich zu vernachlässigbaren Leckströme. Während das Hauptaugenmerk der Arbeit auf der Erhöhung der Spannungsfestigkeit im Vorwärtsbetrieb des Transistors lag, ist für einige Anwendung auch ein rückwärtiges Sperren erwünscht. Für Schaltverstärker im S-Klassenbetrieb wurde ein neuartiger GaN-HEMT entwickelt, dessen rückwärtiges Sperrverhalten durch einen tiefgelegten Schottkykontakt als Drainelektrode hervorgerufen wird. Eine derartige Struktur ergab eine rückwärtige Spannungsfestigkeit von über 110 V.
Author: Patrick Fay Publisher: Springer ISBN: 3030202089 Category : Technology & Engineering Languages : en Pages : 308
Book Description
This book brings together recent research by scientists and device engineers working on both aggressively-scaled conventional transistors as well as unconventional high-frequency device concepts in the III-N material system. Device concepts for mm-wave to THz operation based on deeply-scaled HEMTs, as well as distributed device designs based on plasma-wave propagation in polarization-induced 2DEG channels, tunneling, and hot-carrier injection are discussed in detail. In addition, advances in the underlying materials science that enable these demonstrations, and advancements in metrology that permit the accurate characterization and evaluation of these emerging device concepts are also included. Targeting readers looking to push the envelope in GaN-based electronics device research, this book provides a current, comprehensive treatment of device concepts and physical phenomenology suitable for applying GaN and related materials to emerging ultra-high-frequency applications. Offers readers an integrated treatment of the state of the art in both conventional (i.e., HEMT) scaling as well as unconventional device architectures suitable for amplification and signal generation in the mm-wave and THz regime using GaN-based devices, written by authors that are active and widely-known experts in the field; Discusses both conventional scaled HEMTs (into the deep mm-wave) as well as unconventional approaches to address the mm-wave and THz regimes; Provides “vertically integrated” coverage, including materials science that enables these recent advances, as well as device physics & design, and metrology techniques; Includes fundamental physics, as well as numerical simulations and experimental realizations.
Author: Dirk Ehrentraut Publisher: Springer Science & Business Media ISBN: 3642048307 Category : Science Languages : en Pages : 337
Book Description
This book discusses the important technological aspects of the growth of GaN single crystals by HVPE, MOCVD, ammonothermal and flux methods for the purpose of free-standing GaN wafer production.
Author: Paolo Mele
Author: Paolo Mele
Author: Farid Medjdoub
Author: K. Shenai
Author: Jaime Alberto Zamudio Flores
Author: Hongyu Yu
Author: Gaudenzio Meneghesso
Author: Eldad Bahat-Treidel
Author: Florian Peter Pribahsnik
Author: Patrick Fay
Author: Dirk Ehrentraut