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Author: Xiaobing Luo Publisher: John Wiley & Sons ISBN: 1119179297 Category : Technology & Engineering Languages : en Pages : 373
Book Description
A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.
Author: Xiaobing Luo Publisher: John Wiley & Sons ISBN: 1119179297 Category : Technology & Engineering Languages : en Pages : 373
Book Description
A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.
Author: S. M. Sohel Murshed Publisher: BoD – Books on Demand ISBN: 1789848385 Category : Science Languages : en Pages : 154
Book Description
Since conventional cooling techniques are increasing falling short of meeting the ever-growing cooling demands of high heat generating devices, thermal systems, and processes, advanced and innovative cooling technologies are of immense importance to deal with such high thermal management. Hence, this book covers a number of key topics related to advanced cooling approaches, their performance, and applications, including: Evaporative air cooling; Spray impingement cooling; Heat pump-based cooling; Modular cooling for photovoltaic plant; Nucleate pool boiling of refrigerants; Transient flashing spray cooling and application; Compressor cooling systems for industry. The book is aimed at a wide variety of people from graduate students and researchers to manufacturers who are involved or interested in the areas of thermal management systems, cooling technologies, and their applications.
Author: Ho-Ming Tong Publisher: Springer Science & Business Media ISBN: 1441957685 Category : Technology & Engineering Languages : en Pages : 562
Book Description
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Author: Xingcun Colin Tong Publisher: Springer Science & Business Media ISBN: 1441977597 Category : Technology & Engineering Languages : en Pages : 633
Book Description
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Author: Muhannad S. Bakir Publisher: Artech House ISBN: 1596932473 Category : Technology & Engineering Languages : en Pages : 551
Book Description
This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
Author: Vincenzo Bianco Publisher: CRC Press ISBN: 1482254026 Category : Science Languages : en Pages : 473
Book Description
Nanofluids are gaining the attention of scientists and researchers around the world. This new category of heat transfer medium improves the thermal conductivity of fluid by suspending small solid particles within it and offers the possibility of increased heat transfer in a variety of applications. Bringing together expert contributions from
Author: T. L. Bergman Publisher: John Wiley & Sons ISBN: 0470501979 Category : Science Languages : en Pages : 2249
Book Description
Fundamentals of Heat and Mass Transfer, 7th Edition is the gold standard of heat transfer pedagogy for more than 30 years, with a commitment to continuous improvement by four authors having more than 150 years of combined experience in heat transfer education, research and practice. Using a rigorous and systematic problem-solving methodology pioneered by this text, it is abundantly filled with examples and problems that reveal the richness and beauty of the discipline. This edition maintains its foundation in the four central learning objectives for students and also makes heat and mass transfer more approachable with an additional emphasis on the fundamental concepts, as well as highlighting the relevance of those ideas with exciting applications to the most critical issues of today and the coming decades: energy and the environment. An updated version of Interactive Heat Transfer (IHT) software makes it even easier to efficiently and accurately solve problems.
Author: Arthur H. Lefebvre Publisher: CRC Press ISBN: 1498736262 Category : Technology & Engineering Languages : en Pages : 284
Book Description
The second edition of this long-time bestseller provides a framework for designing and understanding sprays for a wide array of engineering applications. The text contains correlations and design tools that can be easily understood and used in relating the design of atomizers to the resulting spray behavior. Written to be accessible to readers with a modest technical background, the emphasis is on application rather than in-depth theory. Numerous examples are provided to serve as starting points for using the information in the book. Overall, this is a thoroughly updated edition that still retains the practical focus and readability of the original work by Arthur Lefebvre.
Author: Y. Tzeng Publisher: Elsevier ISBN: 1483291243 Category : Science Languages : en Pages : 903
Book Description
An intensifying interest from the scientific, technical, and industrial community in the new diamond technology can be attested to by the wide range of contributions in this proceedings volume. The papers discuss topics such as the applications of diamond films and related wide bandgap semiconductors and superhard materials. These materials are rapidly becoming economically significant due to their combination of superior properties: great hardness, high thermal conductivity, chemical inertness, high stiffness, high carrier mobilities, etc. Initial commercial products employing the new diamond technology are already on the market. These include diamond loudspeakers, diamond X-ray windows, diamond bonders, diamond cutting tools, and heads for magnetic disks coated with diamond-like carbon. The developments reported in this volume are important not only in terms of their own markets, but, also because they are expected to enable a wide range of other new products and production methods.
Author: Xiaobing Luo
Author: Xiaobing Luo
Author: S. M. Sohel Murshed
Author: Ho-Ming Tong
Author: Xingcun Colin Tong
Author: Muhannad S. Bakir
Author: Vincenzo Bianco
Author: John W. Schaefer
Author: T. L. Bergman
Author: Arthur H. Lefebvre
Author: Y. Tzeng