Development of Silicon Photonic Multi Chip Module Transceivers PDF Download

Author: Nathan Casey Abrams
Publisher:
ISBN:
Category :
Languages : en
Pages :

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Book Description
The designs and results of higher order modulation format modulators, both microring based and Mach Zehnder based, are discussed. High order modulators offer a path towards scaling transceiver total throughput without having to increase the channel counts or component bandwidth. Together, the work in these two sections supports the development of silicon photonic transceivers to aid in the adoption of silicon photonics into data generating systems.

Author: Daryl Inniss
Publisher: Morgan Kaufmann
ISBN: 0128029927
Category : Computers
Languages : en
Pages : 228

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Book Description
Silicon photonics uses chip-making techniques to fabricate photonic circuits. The emerging technology is coming to market at a time of momentous change. The need of the Internet content providers to keep scaling their data centers is becoming increasing challenging, the chip industry is facing a future without Moore’s law, while telcos must contend with a looming capacity crunch due to continual traffic growth. Each of these developments is significant in its own right. Collectively, they require new thinking in the design of chips, optical components, and systems. Such change also signals new business opportunities and disruption. Notwithstanding challenges, silicon photonics’ emergence is timely because it is the future of several industries. For the optical industry, the technology will allow designs to be tackled in new ways. For the chip industry, silicon photonics will become the way of scaling post-Moore’s law. New system architectures enabled by silicon photonics will improve large-scale computing and optical communications. Silicon Photonics: Fueling the Next Information Revolution outlines the history and status of silicon photonics. The book discusses the trends driving the datacom and telecom industries, the main but not the only markets for silicon photonics. In particular, developments in optical transport and the data center are discussed as are the challenges. The book details the many roles silicon photonics will play, from wide area networks down to the chip level. Silicon photonics is set to change the optical components and chip industries; this book explains how. Captures the latest research assessing silicon photonics development and prospects Demonstrates how silicon photonics addresses the challenges of managing bandwidth over distance and within systems Explores potential applications of SiP, including servers, datacenters, and Internet of Things

Author: Tony Hey
Publisher: CRC Press
ISBN: 1000855635
Category : Science
Languages : en
Pages : 426

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Book Description
The last lecture course that Nobel Prize winner Richard P. Feynman gave to students at Caltech from 1983 to 1986 was not on physics but on computer science. The first edition of the Feynman Lectures on Computation, published in 1996, provided an overview of standard and not-so-standard topics in computer science given in Feynman’s inimitable style. Although now over 20 years old, most of the material is still relevant and interesting, and Feynman’s unique philosophy of learning and discovery shines through. For this new edition, Tony Hey has updated the lectures with an invited chapter from Professor John Preskill on “Quantum Computing 40 Years Later”. This contribution captures the progress made toward building a quantum computer since Feynman’s original suggestions in 1981. The last 25 years have also seen the “Moore’s law” roadmap for the IT industry coming to an end. To reflect this transition, John Shalf, Senior Scientist at Lawrence Berkeley National Laboratory, has contributed a chapter on “The Future of Computing beyond Moore’s Law”. The final update for this edition is an attempt to capture Feynman’s interest in artificial intelligence and artificial neural networks. Eric Mjolsness, now a Professor of Computer Science at the University of California Irvine, was a Teaching Assistant for Feynman’s original lecture course and his research interests are now the application of artificial intelligence and machine learning for multi-scale science. He has contributed a chapter called “Feynman on Artificial Intelligence and Machine Learning” that captures the early discussions with Feynman and also looks toward future developments. This exciting and important work provides key reading for students and scholars in the fields of computer science and computational physics.

Author: Madeleine Glick
Publisher: Elsevier
ISBN: 032391831X
Category : Technology & Engineering
Languages : en
Pages : 523

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Book Description
Integrated Photonics for Data Communications Applications reviews the key concepts, design principles, performance metrics and manufacturing processes from advanced photonic devices to integrated photonic circuits. The book presents an overview of the trends and commercial needs of data communication in data centers and high-performance computing, with contributions from end users presenting key performance indicators. In addition, the fundamental building blocks are reviewed, along with the devices (lasers, modulators, photodetectors and passive devices) that are the individual elements that make up the photonic circuits. These chapters include an overview of device structure and design principles and their impact on performance. Following sections focus on putting these devices together to design and fabricate application-specific photonic integrated circuits to meet performance requirements, along with key areas and challenges critical to the commercial manufacturing of photonic integrated circuits and the supply chains being developed to support innovation and market integration are discussed. This series is led by Dr. Lionel Kimerling Executive at AIM Photonics Academy and Thomas Lord Professor of Materials Science and Engineering at MIT and Dr. Sajan Saini Education Director at AIM Photonics Academy at MIT. Each edited volume features thought-leaders from academia and industry in the four application area fronts (data communications, high-speed wireless, smart sensing, and imaging) and addresses the latest advances. Includes contributions from leading experts and end-users across academia and industry working on the most exciting research directions of integrated photonics for data communications applications Provides an overview of data communication-specific integrated photonics starting from fundamental building block devices to photonic integrated circuits to manufacturing tools and processes Presents key performance metrics, design principles, performance impact of manufacturing variations and operating conditions, as well as pivotal performance benchmarks

Author: Lorenzo Pavesi
Publisher: Springer Science & Business Media
ISBN: 3642105033
Category : Science
Languages : en
Pages : 540

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Book Description
This book is volume III of a series of books on silicon photonics. It reports on the development of fully integrated systems where many different photonics component are integrated together to build complex circuits. This is the demonstration of the fully potentiality of silicon photonics. It contains a number of chapters written by engineers and scientists of the main companies, research centers and universities active in the field. It can be of use for all those persons interested to know the potentialities and the recent applications of silicon photonics both in microelectronics, telecommunication and consumer electronics market.

Author: Norbert Grote
Publisher: Springer Science & Business Media
ISBN: 9783540669777
Category : Technology & Engineering
Languages : en
Pages : 496

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Book Description
Optoelectronic devices and fibre optics are the basis of cutting-edge communication systems. This monograph deals with the various components of these systems, including lasers, amplifiers, modulators, converters, filters, sensors, and more.

Author: John H. Lau
Publisher: Springer
ISBN: 9811372241
Category : Technology & Engineering
Languages : en
Pages : 368

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Book Description
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

Author: Paul R. Prucnal
Publisher: CRC Press
ISBN: 1498725244
Category : Science
Languages : en
Pages : 412

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Book Description
This book sets out to build bridges between the domains of photonic device physics and neural networks, providing a comprehensive overview of the emerging field of "neuromorphic photonics." It includes a thorough discussion of evolution of neuromorphic photonics from the advent of fiber-optic neurons to today’s state-of-the-art integrated laser neurons, which are a current focus of international research. Neuromorphic Photonics explores candidate interconnection architectures and devices for integrated neuromorphic networks, along with key functionality such as learning. It is written at a level accessible to graduate students, while also intending to serve as a comprehensive reference for experts in the field.

Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 42

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Book Description
Substantial progress is reported on the development of a novel photonic multi-chip module technology, and on the passive optical components that provide parallel chip to chip interconnections within the module. This progress includes extensive characterization of a compact optical power bus to distribute an optical array of readout beams to a set of modulators; novel design and algorithm development, successful fabrication, and characterization of diffractive optical elements (DOE's) for use in ultra-compact, short length and propagation interconnection systems; the analysis of photonic multi-chip module design and performance parameters; and the preliminary investigation of applications for such multi-chip modules. Directly related work on flip chip bonding between silicon (detection and signal processing) chips and GaAs-based (modulator array and VCSEL array) chips, and on the design and test of FET-SEED spatial light modulator array chips has also been accomplished. Different operational wavelengths and module design variations potentially allow either of these smart pixel spatial light modulator approaches to be used for the optical input/output functions within the photonic multi-chip module.

Author: Tolga Tekin
Publisher: Woodhead Publishing
ISBN: 008100513X
Category : Computers
Languages : en
Pages : 431

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Book Description
Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers. Summarizes the state-of-the-art in this emerging field Presents a comprehensive review of all the key aspects of deploying optical interconnects in data centers, from materials and components, to circuit boards and methods for integration Contains contributions that are drawn from leading international experts on the topic