Author: Mark Patrick McGrathPublisher:
ISBN:
Category :
Languages : en
Pages : 226
Book Description
Development of Liquid Crystalline Polymer (LCP) Surface Mount Packages for Millimeter-wave Applications
Author: Mark Patrick McGrathPublisher:
ISBN:
Category :
Languages : en
Pages : 226
Book Description
Development of Liquid Crystalline Polymer (LCP) Surface Mount Packages for Ka-band Applications
Author: Kunia AiharaDevelopment of Liquid Crystalline Polymer (LCP) Packaging for High Power RF/millimeter-wave Applications
Author: Cheng ChenPublisher:
ISBN: 9781267238436
Category :
Languages : en
Pages :
Book Description
This research project presents the design and development of a high frequency surface mount package (SMT) for high power microwave/millimeter-wave applications using liquid crystalline polymer (LCP). As microwave frequencies, the demand for greater power output is rapidly increasing due to many RF system requirements such as higher data rate, larger cell base station coverage. A package with GaAs 4-Watt amplifier is demonstrated to be able to handle ~10 Watt DC power dissipation. Two methods are used to measure the package thermal resistances. Both temperature results are below the allowable 150°C maximum temperature. The electrical feed-through of the package provides signal path traveling from the device to the printed circuit board (PCB) has been demonstrated individually and using commercial product. At Ka-band feed-through of the package show theoretical insertion loss of less than -0.5dB and actual measurement of -1.5dB. Return loss is less than -10dB all the way up to 46GHz. The sparse via experiment indicates that with 24.4% via number reduction, thermal and electrical results still remain acceptable. Lastly, to utilize the package spacing, two types of class-A amplifiers are designed and measured using the proposed LCP package. The single transistor amplifier has smaller size as it is only consist of the input and output matching networks. The measured and simulation small-signal gain only has 0.27dB difference while the power output differs by 1.01dB.
Microwaves, Millimeter Wave and Terahertz Liquid Crystals
Author: Anyong QingPublisher: Springer Nature
ISBN: 9819989132
Category :
Languages : en
Pages : 283
Book Description
RF and Microwave Microelectronics Packaging
Author: Ken KuangPublisher: Springer Science & Business Media
ISBN: 1441909842
Category : Technology & Engineering
Languages : en
Pages : 295
Book Description
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Advanced Millimeter-wave Technologies
Author: Duixian LiuPublisher: John Wiley & Sons
ISBN: 9780470742952
Category : Technology & Engineering
Languages : en
Pages : 850
Book Description
This book explains one of the hottest topics in wireless and electronic devices community, namely the wireless communication at mmWave frequencies, especially at the 60 GHz ISM band. It provides the reader with knowledge and techniques for mmWave antenna design, evaluation, antenna and chip packaging. Addresses practical engineering issues such as RF material evaluation and selection, antenna and packaging requirements, manufacturing tolerances, antenna and system interconnections, and antenna One of the first books to discuss the emerging research and application areas, particularly chip packages with integrated antennas, wafer scale mmWave phased arrays and imaging Contains a good number of case studies to aid understanding Provides the antenna and packaging technologies for the latest and emerging applications with the emphases on antenna integrations for practical applications such as wireless USB, wireless video, phase array, automobile collision avoidance radar, and imaging
LCP for Microwave Packages and Modules
Author: Anh-Vu H. PhamPublisher: Cambridge University Press
ISBN: 1107003784
Category : Science
Languages : en
Pages : 269
Book Description
A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP) at package, component and system levels, providing a detailed look at everything you need to know to get up-to-speed on the subject, including successful design details, techniques and potential pitfalls.
Electrical Performance of Electronic Packaging
Author: Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages : 394
Book Description
Passive RF Component Technology
Author: Guo'an WangPublisher: Artech House
ISBN: 1608071995
Category : Technology & Engineering
Languages : en
Pages : 306
Book Description
Focusing on novel materials and techniques, this pioneering volume provides you with a solid understanding of the design and fabrication of smart RF passive components. You find comprehensive details on LCP, metal materials, ferrite materials, nano materials, high aspect ratio enabled materials, green materials for RFID, and silicon micromachining techniques. Moreover, this practical book offers expert guidance on how to apply these materials and techniques to design a wide range of cutting-edge RF passive components, from MEMS switch based tunable passives and 3D passives, to metamaterial-based passives and on-chip passives. Supported with over 145 illustrations, this forward-looking resource summarizes the growing trend of smart RF passive component design and serves as a guide to the performance improving and cost-down solutions this technology offers the next generation of wireless communications.
Author: