Design Fundamentals of High Temperature Composites, Intermetallics, and Metal-ceramics Systems PDF Download

Author: Ray Y. Lin
Publisher: Minerals, Metals, & Materials Society
ISBN:
Category : Science
Languages : en
Pages : 474

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Book Description
Focusing on the physico-chemical fundamentals of advanced material processing, this volume addresses composite interface stability, modeling of interfacial reactions, defects in intermetallic compounds, thermodynamics and kinetics of interfacial reactions, solidification and phase equilibria, fundamentals of high-temperature materials joining, and the relationship between chemical and mechanical stabilities. This is the first time that, collectively, both thermodynamic and kinetic issues are addressed for metal and ceramic composites as well as intermetallics.

Author:
Publisher:
ISBN: 9780873393102
Category :
Languages : en
Pages : 0

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Book Description

Author: Peter Ramm
Publisher: John Wiley & Sons
ISBN: 3527644237
Category : Technology & Engineering
Languages : en
Pages : 435

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Book Description
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.

Author: M.F. Wani
Publisher: Elsevier
ISBN: 9780323916059
Category : Technology & Engineering
Languages : en
Pages : 0

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Book Description
High Temperature Tribology of Ceramics and Ceramic Matrix Composites synthesizes the latest cutting-edge research on various applications of ceramics and ceramic matrix composites in high temperature settings. The book covers the fundamentals of high-temperature tribology, the mechanical behavior of these materials in high temperature settings, and their various tribochemical reactions. Methods for improving friction, wear, and lubrication properties of these materials in high temperature settings are covered at length, as are the fabrication methods of ceramics, CMCs and hard ceramic coatings. Additionally, the book includes insights on the various wear modes of ceramics and CMCs such as adhesion wear, abrasion wear, delamination wear, erosion wear, as well as the formation of oxides and other components at elevated temperatures and their influences on friction and wear performance.

Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 1048

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Book Description

Author: Mahmood Aliofkhazraei
Publisher: BoD – Books on Demand
ISBN: 1789231787
Category : Science
Languages : en
Pages : 228

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Book Description
Intermetallic compounds are usually brittle with high melting points. Their properties are often found among ceramic and metallic materials. In most cases, their hot corrosion resistance and simultaneously hardness are important. One of the main applications of intermetallic compounds is for superalloy turbine blades in which they show appropriate high-temperature-related properties. This book collects new developments about intermetallic compounds and their recent usages.

Author: Zhigang Li
Publisher: CRC Press
ISBN: 0824745760
Category : Science
Languages : en
Pages : 640

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Book Description
Providing proven strategies for solutions to research, development, and production dilemmas, this reference details the instrumentation and underlying principles for utilization of electron microscopy in the manufacturing, automotive, semiconductor, photographic film, pharmaceutical, chemical, mineral, forensic, glass, and pulp and paper industries. The book covers safety, calibration, and troubleshooting techniques, as well as methods in sample preparation and image collection, interpretation, and analysis. It includes contributions from microscopy experts based at major corporations and scientists from universities and major research centers.

Author: Marin Alexe
Publisher: Springer Science & Business Media
ISBN: 9783540210498
Category : Science
Languages : en
Pages : 524

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Book Description
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Author: Russell H. Jones
Publisher: CRC Press
ISBN: 0824746015
Category : Technology & Engineering
Languages : en
Pages : 499

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Book Description
This invaluable reference provides a comprehensive overview of corrosion and environmental effects on metals, intermetallics, glossy metals, ceramics and composites of metals, and ceramics and polymer materials. It surveys numerous options for various applications involving environments and guidance in materials selection and substitution. Exploring a wide range of environments, including aqueous and high-temperature surroundings, Environmental Effects on Engineered Materials examines specific material-environmental interactions; corrosion rates and material limitations; preventive measurements against corrosion; utilization of older materials in recent applications; the use of new materials for existing equipment; and more.

Author: R.W. Davidge
Publisher: Springer Science & Business Media
ISBN: 9401136785
Category : Technology & Engineering
Languages : en
Pages : 352

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Book Description
The last 30 years have seen a steady development in the range of ceramic materials with potential for high temperature engineering applications: in the 60s, self-bonded silicon carbide and reaction-bonded silicon nitride; in the 70s, improved aluminas, sintered silicon carbide and silicon nitrides (including sialons); in the 80s, various toughened Zr0 materials, ceramic matrix composites reinforced with silicon 2 carbide continuous fibres or whiskers. Design methodologies were evolved in the 70s, incorporating the principles of fracture mechanics and the statistical variation and time dependence of strength. These have been used successfully to predict the engineering behaviour of ceramics in the lower range of temperature. In spite of the above, and the underlying thermodynamic arguments for operations at higher temperatures, there has been a disappointing uptake of these materials in industry for high temperature usc. Most of the successful applications are for low to moderate temperatures such as seals and bearings, and metal cutting and shaping. The reasons have been very well documented and include: • Poor predictability and reliability at high temperature. • High costs relative to competing materials. • Variable reproducibility of manufacturing processes. • Lack of sufficiently sensitive non-destructive techniques. With this as background, a Europhysics Industrial Workshop sponsored by the European Physical Society (EPS) was organised by the Netherlands Energy Research Foundation (ECN) and the Institute for Advanced Materials of the Joint Research Centre (JRC) of the EC, at Petten, North Holland, in April 1990 to consider the status of thermomechanical applications of engineering ceramics.