Design And Modeling For 3d Ics And Interposers PDF Download

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Design And Modeling For 3d Ics And Interposers

Design And Modeling For 3d Ics And Interposers PDF Author: Madhavan Swaminathan
Publisher: World Scientific
ISBN: 9814508616
Category : Technology & Engineering
Languages : en
Pages : 379

Book Description
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.
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