Author: Claudia Sammer
Publisher: Cool Companies Inc
ISBN: 0973247444
Category : Medical technology
Languages : en
Pages : 78
Book Description
Cool Companies:Medical Devices & Technologies in Alberta, Canada 2010
Author: Claudia Sammer
Publisher: Cool Companies Inc
ISBN: 0973247444
Category : Medical technology
Languages : en
Pages : 78
Book Description
Publisher: Cool Companies Inc
ISBN: 0973247444
Category : Medical technology
Languages : en
Pages : 78
Book Description
Situating Design in Alberta
Author: Isabel Prochner
Publisher: University of Alberta
ISBN: 1772125784
Category : Architecture
Languages : en
Pages : 241
Book Description
Situating Design in Alberta makes the case that design has the potential to drive economic growth, improve quality of life, and promote sustainability in the province and across the country. Contributors bring both scholarly and practice-based perspectives and come from diverse disciplines including architecture, interior design, industrial design, and visual communications. The collection is organized around four main topics—history, education, business, and sustainability—within which the authors explore a wide range of issues. This synergy of different design approaches lends a sense of forward momentum to the field, stimulates reflection about opportunities and challenges for both practitioners and policy makers, and provides a model for future studies in other regions. Contributors: Tim Antoniuk, Ken Bautista, Carlos Fiorentino, Maria Goncharova, Andrea Hirji, Mark Iantkow, Barry Johns, Lyubava Kroll, Courtenay McKay, Skye Oleson-Cormack, Isabel Prochner, Janice Rieger, Elizabeth Schowalter, Megan Strickfaden, Tyler Vreeling, Ron Wickman
Publisher: University of Alberta
ISBN: 1772125784
Category : Architecture
Languages : en
Pages : 241
Book Description
Situating Design in Alberta makes the case that design has the potential to drive economic growth, improve quality of life, and promote sustainability in the province and across the country. Contributors bring both scholarly and practice-based perspectives and come from diverse disciplines including architecture, interior design, industrial design, and visual communications. The collection is organized around four main topics—history, education, business, and sustainability—within which the authors explore a wide range of issues. This synergy of different design approaches lends a sense of forward momentum to the field, stimulates reflection about opportunities and challenges for both practitioners and policy makers, and provides a model for future studies in other regions. Contributors: Tim Antoniuk, Ken Bautista, Carlos Fiorentino, Maria Goncharova, Andrea Hirji, Mark Iantkow, Barry Johns, Lyubava Kroll, Courtenay McKay, Skye Oleson-Cormack, Isabel Prochner, Janice Rieger, Elizabeth Schowalter, Megan Strickfaden, Tyler Vreeling, Ron Wickman
Two-Year Colleges - 2010
Author: Peterson's
Publisher: Peterson's
ISBN: 0768926882
Category : Education
Languages : en
Pages : 562
Book Description
Now Let Us Find the Right One for You. Peterson's has more than 40 years of experience working with students, parents, educators, guidance counselors, and administrators in helping to match the right student with the right college. We do our research. You'll find only the most objective and accurate information in our guides and on Petersons.com. We're with you every step of the way. With Peterson's resources for test prep, financial aid, essay writing, and education exploration, you'll be prepared for success. Cost should never be a barrier to receiving a high-quality education. Peterson's provides the information and guidance you need on tuition, scholarships, and financial aid to make education more affordable. What's Inside? Up-to-date facts and figures on application requirements, tuition, degree programs, student body profiles, faculty, and contacts Quick-Reference Chart to pinpoint colleges that meet your criteria Valuable tips on preparing for and scoring high on standardized tests Expert advice for adult learners and international students Book jacket.
Publisher: Peterson's
ISBN: 0768926882
Category : Education
Languages : en
Pages : 562
Book Description
Now Let Us Find the Right One for You. Peterson's has more than 40 years of experience working with students, parents, educators, guidance counselors, and administrators in helping to match the right student with the right college. We do our research. You'll find only the most objective and accurate information in our guides and on Petersons.com. We're with you every step of the way. With Peterson's resources for test prep, financial aid, essay writing, and education exploration, you'll be prepared for success. Cost should never be a barrier to receiving a high-quality education. Peterson's provides the information and guidance you need on tuition, scholarships, and financial aid to make education more affordable. What's Inside? Up-to-date facts and figures on application requirements, tuition, degree programs, student body profiles, faculty, and contacts Quick-Reference Chart to pinpoint colleges that meet your criteria Valuable tips on preparing for and scoring high on standardized tests Expert advice for adult learners and international students Book jacket.
Associations Canada
Author:
Publisher:
ISBN:
Category : Associations, institutions, etc
Languages : en
Pages : 1978
Book Description
Publisher:
ISBN:
Category : Associations, institutions, etc
Languages : en
Pages : 1978
Book Description
V Latin American Congress on Biomedical Engineering CLAIB 2011 May 16-21, 2011, Habana, Cuba
Author: José Folgueras Méndez
Publisher: Springer Science & Business Media
ISBN: 3642211984
Category : Technology & Engineering
Languages : en
Pages : 1363
Book Description
This volume presents the proceedings of the CLAIB 2011, held in the Palacio de las Convenciones in Havana, Cuba, from 16 to 21 May 2011. The conferences of the American Congress of Biomedical Engineering are sponsored by the International Federation for Medical and Biological Engineering (IFMBE), Society for Engineering in Biology and Medicine (EMBS) and the Pan American Health Organization (PAHO), among other organizations and international agencies and bringing together scientists, academics and biomedical engineers in Latin America and other continents in an environment conducive to exchange and professional growth.
Publisher: Springer Science & Business Media
ISBN: 3642211984
Category : Technology & Engineering
Languages : en
Pages : 1363
Book Description
This volume presents the proceedings of the CLAIB 2011, held in the Palacio de las Convenciones in Havana, Cuba, from 16 to 21 May 2011. The conferences of the American Congress of Biomedical Engineering are sponsored by the International Federation for Medical and Biological Engineering (IFMBE), Society for Engineering in Biology and Medicine (EMBS) and the Pan American Health Organization (PAHO), among other organizations and international agencies and bringing together scientists, academics and biomedical engineers in Latin America and other continents in an environment conducive to exchange and professional growth.
Technology for Patient Safety at Veterans Hospitals
Author: United States. Congress. House. Committee on Science, Space, and Technology (2011). Subcommittee on Research and Technology
Publisher:
ISBN:
Category : Hospital patients
Languages : en
Pages : 256
Book Description
Publisher:
ISBN:
Category : Hospital patients
Languages : en
Pages : 256
Book Description
Country Trade Sourcebook
UNESCO Science Report 2010
Author: Unesco
Publisher: UNESCO
ISBN: 9231041320
Category : Political Science
Languages : en
Pages : 541
Book Description
Analyses the current state of science around the globe as well the trends that have emerged since the previous report published in 2005.
Publisher: UNESCO
ISBN: 9231041320
Category : Political Science
Languages : en
Pages : 541
Book Description
Analyses the current state of science around the globe as well the trends that have emerged since the previous report published in 2005.
Business America
Author:
Publisher:
ISBN:
Category : Business
Languages : en
Pages : 36
Book Description
Includes articles on international business opportunities.
Publisher:
ISBN:
Category : Business
Languages : en
Pages : 36
Book Description
Includes articles on international business opportunities.
Mems Packaging
Author: Yung-cheng Lee
Publisher: World Scientific
ISBN: 9813229373
Category : Technology & Engineering
Languages : en
Pages : 363
Book Description
MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.
Publisher: World Scientific
ISBN: 9813229373
Category : Technology & Engineering
Languages : en
Pages : 363
Book Description
MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.