Author: Glenn H. ChapmanPublisher:
ISBN:
Category :
Languages : en
Pages : 107
Book Description
Contributions from the Seventh IEEE International Conference on Wafer Scale Integration
Author: Glenn H. ChapmanWafer Scale Integration
Author: Joe E. BrewerSeventh Annual IEEE International Conference on Wafer Scale Integration, San Francisco, California, USA
Author: Glenn ChapmanPublisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN:
Category : Integrated circuits
Languages : en
Pages : 400
Book Description
International Conference on Wafer Scale Integration : Proceedings, San Francisco, California, USA.
Author: Proceedings
Author: Vijay K. JainPublisher:
ISBN: 9780780306769
Category : Integrated circuits
Languages : en
Pages : 363
Book Description
"Wafer Scale Integration, International Conference On".
Author: International Conference on Wafer Scale Integration. Proceedings ; 2
Author: International Conference on Wafer Scale Integration. Proceedings ; 1
Author: Soft Configurable Wafer Scale Integration
Author: M. G. BlattPublisher:
ISBN:
Category : Fault-tolerant computing
Languages : en
Pages : 258
Book Description
The redundancy models constrain wafer yield by system requirements such as the minimum number of working circuit units, and whether these working units are distributed evenly around the wafer. Choice of redundancy model significantly affects the resulting wafer yield."
Index to IEEE Publications
Author: Institute of Electrical and Electronics EngineersPublisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 1292
Book Description