Author: John M. Segelken
Publisher:
ISBN:
Category :
Languages : en
Pages : 263
Book Description
Contributions from the 45th Electronic Components and Technology Conference (ECTC)
Index to IEEE Publications
Author: Institute of Electrical and Electronics Engineers
Publisher:
ISBN:
Category : Electric engineering
Languages : en
Pages : 1208
Book Description
Issues for 1973- cover the entire IEEE technical literature.
Publisher:
ISBN:
Category : Electric engineering
Languages : en
Pages : 1208
Book Description
Issues for 1973- cover the entire IEEE technical literature.
ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis
Author:
Publisher: ASM International
ISBN: 1627082735
Category : Technology & Engineering
Languages : en
Pages : 540
Book Description
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Publisher: ASM International
ISBN: 1627082735
Category : Technology & Engineering
Languages : en
Pages : 540
Book Description
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Proceedings
Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 1306
Book Description
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 1306
Book Description
Vertical-Cavity Surface-Emitting Lasers
Author: Julian Cheng
Publisher: CRC Press
ISBN: 9789056992637
Category : Technology & Engineering
Languages : en
Pages : 344
Book Description
Since first coming into existence in the early 90s, the vertical-cavity surface-emitting laser (VCSEL) has made several quantum leaps in performance. The performance of VCSELs now exceeds that of edge-emitting lasers in many respects, and offers a superior optical beam and much easier monolithic integrability. As the VCSEL technology improves further, and their number and variety multiply, their potential applications will likely expand at a rapid pace. Vertical-cavity Surface-Emitting Lasers: Technology and Applications addresses two main objectives. It provides the researcher and device engineer with a reference guide to understanding the physical principles as well as the practical design concepts of VCSELs. Furthermore, it provides the system designer or application engineer with a review of the properties of VCSELs, and an overview of some of the applications in which the VCSEL has already played an important role. This book features contributions from prominent researchers in the field.
Publisher: CRC Press
ISBN: 9789056992637
Category : Technology & Engineering
Languages : en
Pages : 344
Book Description
Since first coming into existence in the early 90s, the vertical-cavity surface-emitting laser (VCSEL) has made several quantum leaps in performance. The performance of VCSELs now exceeds that of edge-emitting lasers in many respects, and offers a superior optical beam and much easier monolithic integrability. As the VCSEL technology improves further, and their number and variety multiply, their potential applications will likely expand at a rapid pace. Vertical-cavity Surface-Emitting Lasers: Technology and Applications addresses two main objectives. It provides the researcher and device engineer with a reference guide to understanding the physical principles as well as the practical design concepts of VCSELs. Furthermore, it provides the system designer or application engineer with a review of the properties of VCSELs, and an overview of some of the applications in which the VCSEL has already played an important role. This book features contributions from prominent researchers in the field.
Conference Proceedings
1996 IEEE LEOS Annual Meeting
Author: Lasers and Electro-optics Society (Institute of Electrical and Electronics Engineers). Meeting
Publisher:
ISBN:
Category : Electrooptics
Languages : en
Pages : 466
Book Description
Publisher:
ISBN:
Category : Electrooptics
Languages : en
Pages : 466
Book Description
Moisture Sensitivity of Plastic Packages of IC Devices
Author: X.J. Fan
Publisher: Springer Science & Business Media
ISBN: 1441957197
Category : Technology & Engineering
Languages : en
Pages : 573
Book Description
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
Publisher: Springer Science & Business Media
ISBN: 1441957197
Category : Technology & Engineering
Languages : en
Pages : 573
Book Description
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
Materials for Advanced Packaging
Author: Daniel Lu
Publisher: Springer
ISBN: 3319450980
Category : Technology & Engineering
Languages : en
Pages : 974
Book Description
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Publisher: Springer
ISBN: 3319450980
Category : Technology & Engineering
Languages : en
Pages : 974
Book Description
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Poly'99
Author:
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 282
Book Description
The 33 papers from the December 1999 workshop report on current knowledge in the field of mechanics, physics and reliability of polymers, particularly those used in plastic packages of integrated circuit (IC) devices. Topics include fracture and damage investigations enhancing the thermo-mechanical reliability of plastic packages, the effect of polymer material properties on wire bonding to MCMs and advanced copper-low-K ICs, evaluation of the moisture sensitivity of molding compounds of IC packages, the influence of visco-elastic polymeric materials on flexural vibrations, application of the probabilistic approach in thermal stress modeling of packaging, and fiber optic sensor evaluation of epoxy-cured fiber optic connectors. No subject index.
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 282
Book Description
The 33 papers from the December 1999 workshop report on current knowledge in the field of mechanics, physics and reliability of polymers, particularly those used in plastic packages of integrated circuit (IC) devices. Topics include fracture and damage investigations enhancing the thermo-mechanical reliability of plastic packages, the effect of polymer material properties on wire bonding to MCMs and advanced copper-low-K ICs, evaluation of the moisture sensitivity of molding compounds of IC packages, the influence of visco-elastic polymeric materials on flexural vibrations, application of the probabilistic approach in thermal stress modeling of packaging, and fiber optic sensor evaluation of epoxy-cured fiber optic connectors. No subject index.