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Contributions from the 44th Electronic Components and Technology Conference (ECTC)

Author: Robert A. Boudreau
Publisher:
ISBN:
Category :
Languages : en
Pages : 119

Book Description

Contributions from the 44th Electronic Components and Technology Conference (ECTC)

Author: Robert A. Boudreau
Publisher:
ISBN:
Category :
Languages : en
Pages : 119

Book Description

Contributions from the 44th Electronic Components and Technology Conference (ECTC).

Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 0

Book Description

Index to IEEE Publications

Author: Institute of Electrical and Electronics Engineers
Publisher:
ISBN:
Category : Electric engineering
Languages : en
Pages : 1468

Book Description
Issues for 1973- cover the entire IEEE technical literature.

Proceedings

Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 1220

Book Description

The International Journal of Microcircuits and Electronic Packaging

Author:
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages : 582

Book Description

ITHERM

Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 566

Book Description

Index of Conference Proceedings

Author: British Library. Document Supply Centre
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 844

Book Description

Materials for Advanced Packaging

Author: Daniel Lu
Publisher: Springer
ISBN: 3319450980
Category : Technology & Engineering
Languages : en
Pages : 974

Book Description
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Semiconductor Packaging

Author: Andrea Chen
Publisher: CRC Press
ISBN: 1439862079
Category : Technology & Engineering
Languages : en
Pages : 216

Book Description
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

Science Citation Index

Author:
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 2910

Book Description
Vols. for 1964- have guides and journal lists.