Author: IEEE Industry Applications Society. MeetingPublisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 1256
Book Description
Conference Record of the 1989 IEEE Industry Applications Society Annual Meeting
Author: IEEE Industry Applications Society. MeetingPublisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 1256
Book Description
Conference Record of the 1990 IEEE Industry Applications Society Annual Meeting
Author: IEEE Industry Applications Society. MeetingPublisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 1160
Book Description
Power Electronics Handbook
Author: Muhammad H. RashidPublisher: Elsevier
ISBN: 0080467652
Category : Technology & Engineering
Languages : en
Pages : 1189
Book Description
Power electronics, which is a rapidly growing area in terms of research and applications, uses modern electronics technology to convert electric power from one form to another, such as ac-dc, dc-dc, dc-ac, and ac-ac with a variable output magnitude and frequency. Power electronics has many applications in our every day life such as air-conditioners, electric cars, sub-way trains, motor drives, renewable energy sources and power supplies for computers. This book covers all aspects of switching devices, converter circuit topologies, control techniques, analytical methods and some examples of their applications.* 25% new content* Reorganized and revised into 8 sections comprising 43 chapters* Coverage of numerous applications, including uninterruptable power supplies and automotive electrical systems* New content in power generation and distribution, including solar power, fuel cells, wind turbines, and flexible transmission
Bureau of Mines Research
Author: United States. Bureau of MinesPublisher:
ISBN:
Category : Fuel
Languages : en
Pages : 182
Book Description
Conference Record, Industry Applications Society, IEEE-IAS Annual Meeting (1981)
Author: IEEE Industry Applications SocietyPublisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 970
Book Description
Conference Record of the 1992 IEEE Industry Applications Society Annual Meeting
Author: IEEE Industry Applications Society. MeetingPublisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 906
Book Description
Conference Record
Author: IEEE Industry Applications Society. Annual MeetingPublisher:
ISBN:
Category : Electric power
Languages : en
Pages : 624
Book Description
Proceedings of the 1st International Conference on Electronic Engineering and Renewable Energy
Author: Bekkay HajjiPublisher: Springer
ISBN: 9811314055
Category : Technology & Engineering
Languages : en
Pages : 786
Book Description
The proceedings present a selection of refereed papers presented at the 1st International Conference on Electronic Engineering and Renewable Energy (ICEERE 2018) held during 15-17 April 2018, Saidi, Morocco. The contributions from electrical engineers and experts highlight key issues and developments essential to the multifaceted field of electrical engineering systems and seek to address multidisciplinary challenges in Information and Communication Technologies. The book has a special focus on energy challenges for developing the Euro-Mediterranean regions through new renewable energy technologies in the agricultural and rural areas. The book is intended for academia, including graduate students, experienced researchers and industrial practitioners working in the fields of Electronic Engineering and Renewable Energy.
Insulated Gate Bipolar Transistor IGBT Theory and Design
Author: Vinod Kumar KhannaPublisher: John Wiley & Sons
ISBN: 047166099X
Category : Technology & Engineering
Languages : en
Pages : 648
Book Description
A comprehensive and "state-of-the-art" coverage of the design and fabrication of IGBT. All-in-one resource Explains the fundamentals of MOS and bipolar physics. Covers IGBT operation, device and process design, power modules, and new IGBT structures.
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging
Author: Kim S. SiowPublisher: Springer
ISBN: 3319992562
Category : Technology & Engineering
Languages : en
Pages : 292
Book Description
This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.