Author:
Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 816
Book Description
Proceedings of the ... International Symposium on Microelectronics
Author:
Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 816
Book Description
Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 816
Book Description
Proceedings 1999 International Symposium on Microelectronics
Author:
Publisher:
ISBN:
Category : Electronic ceramics
Languages : en
Pages : 836
Book Description
This text comprises the proceedings of the 1999 International Symposium on Microelectronics.
Publisher:
ISBN:
Category : Electronic ceramics
Languages : en
Pages : 836
Book Description
This text comprises the proceedings of the 1999 International Symposium on Microelectronics.
Proceedings 2001
Journal of Thermophysics and Heat Transfer
Author:
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 1216
Book Description
This journal is devoted to the advancement of the science and technology of thermophysics and heat transfer through the dissemination of original research papers disclosing new technical knowledge and exploratory developments and applications based on new knowledge. It publishes papers that deal with the properties and mechanisms involved in thermal energy transfer and storage in gases, liquids, and solids or combinations thereof. These studies include conductive, convective, and radiative modes alone or in combination and the effects of the environment.
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 1216
Book Description
This journal is devoted to the advancement of the science and technology of thermophysics and heat transfer through the dissemination of original research papers disclosing new technical knowledge and exploratory developments and applications based on new knowledge. It publishes papers that deal with the properties and mechanisms involved in thermal energy transfer and storage in gases, liquids, and solids or combinations thereof. These studies include conductive, convective, and radiative modes alone or in combination and the effects of the environment.
The International Journal of Microcircuits and Electronic Packaging
Author:
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages : 582
Book Description
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages : 582
Book Description
Proceedings of the Second International Symposium on Advances in Wind & Structures (AWAS'02)
Dissertation Abstracts International
Author:
Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 794
Book Description
Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 794
Book Description
International Aerospace Abstracts
Heat Transfer and Fluid Flow in Minichannels and Microchannels
Author: Satish Kandlikar
Publisher: Elsevier
ISBN: 9780080445274
Category : Science
Languages : en
Pages : 492
Book Description
&Quot;This book explores flow through passages with hydraulic diameters from about 1 [mu]m to 3 mm, covering the range of minichannels and microchannels. Design equations along with solved examples and practice problems are also included to serve the needs of practicing engineers and students in a graduate course."--BOOK JACKET.
Publisher: Elsevier
ISBN: 9780080445274
Category : Science
Languages : en
Pages : 492
Book Description
&Quot;This book explores flow through passages with hydraulic diameters from about 1 [mu]m to 3 mm, covering the range of minichannels and microchannels. Design equations along with solved examples and practice problems are also included to serve the needs of practicing engineers and students in a graduate course."--BOOK JACKET.
Handbook of Thermal Science and Engineering
Author:
Publisher: Springer
ISBN: 9783319266947
Category : Science
Languages : en
Pages : 0
Book Description
This Handbook provides researchers, faculty, design engineers in industrial R&D, and practicing engineers in the field concise treatments of advanced and more-recently established topics in thermal science and engineering, with an important emphasis on micro- and nanosystems, not covered in earlier references on applied thermal science, heat transfer or relevant aspects of mechanical/chemical engineering. Major sections address new developments in heat transfer, transport phenomena, single- and multiphase flows with energy transfer, thermal-bioengineering, thermal radiation, combined mode heat transfer, coupled heat and mass transfer, and energy systems. Energy transport at the macro-scale and micro/nano-scales is also included. The internationally recognized team of authors adopt a consistent and systematic approach and writing style, including ample cross reference among topics, offering readers a user-friendly knowledgebase greater than the sum of its parts, perfect for frequent consultation. The Handbook of Thermal Science and Engineering is ideal for academic and professional readers in the traditional and emerging areas of mechanical engineering, chemical engineering, aerospace engineering, bioengineering, electronics fabrication, energy, and manufacturing concerned with the influence thermal phenomena.
Publisher: Springer
ISBN: 9783319266947
Category : Science
Languages : en
Pages : 0
Book Description
This Handbook provides researchers, faculty, design engineers in industrial R&D, and practicing engineers in the field concise treatments of advanced and more-recently established topics in thermal science and engineering, with an important emphasis on micro- and nanosystems, not covered in earlier references on applied thermal science, heat transfer or relevant aspects of mechanical/chemical engineering. Major sections address new developments in heat transfer, transport phenomena, single- and multiphase flows with energy transfer, thermal-bioengineering, thermal radiation, combined mode heat transfer, coupled heat and mass transfer, and energy systems. Energy transport at the macro-scale and micro/nano-scales is also included. The internationally recognized team of authors adopt a consistent and systematic approach and writing style, including ample cross reference among topics, offering readers a user-friendly knowledgebase greater than the sum of its parts, perfect for frequent consultation. The Handbook of Thermal Science and Engineering is ideal for academic and professional readers in the traditional and emerging areas of mechanical engineering, chemical engineering, aerospace engineering, bioengineering, electronics fabrication, energy, and manufacturing concerned with the influence thermal phenomena.