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Author: Pengfei Zhao Publisher: Springer ISBN: 9811076294 Category : Technology & Engineering Languages : en Pages : 932
Book Description
This book includes a selection of reviewed papers presented at the 49th Conference of the International Circle of Educational Institutes for Graphic Arts Technology and Management & 8th China Academic Conference on Printing and Packaging, which was held on May 14-16, 2017 in Beijing, China. The conference was jointly organized by the Beijing Institute of Graphic Communication, China Academy of Printing Technology, and International Circle of Educational Institutes for Graphic Arts Technology and Management. With eight keynote talks and 200 presented papers on graphic communication and packaging technologies, the event attracted more than 400 scientists. The proceedings cover the latest advances in color science and technology; image processing technology; digital media technology; digital process management technology in packaging; packaging, etc., and will be of interest to university researchers, R&D engineers and graduate students in the graphic arts, packaging, color science, image science, material science, computer science, digital media and network technology.
Author: Pengfei Zhao Publisher: Springer ISBN: 9811076294 Category : Technology & Engineering Languages : en Pages : 932
Book Description
This book includes a selection of reviewed papers presented at the 49th Conference of the International Circle of Educational Institutes for Graphic Arts Technology and Management & 8th China Academic Conference on Printing and Packaging, which was held on May 14-16, 2017 in Beijing, China. The conference was jointly organized by the Beijing Institute of Graphic Communication, China Academy of Printing Technology, and International Circle of Educational Institutes for Graphic Arts Technology and Management. With eight keynote talks and 200 presented papers on graphic communication and packaging technologies, the event attracted more than 400 scientists. The proceedings cover the latest advances in color science and technology; image processing technology; digital media technology; digital process management technology in packaging; packaging, etc., and will be of interest to university researchers, R&D engineers and graduate students in the graphic arts, packaging, color science, image science, material science, computer science, digital media and network technology.
Author: Wendy Jedlicka Publisher: John Wiley & Sons ISBN: 111910386X Category : Design Languages : en Pages : 370
Book Description
Packaging Sustainability Take the lead with sustainable package design solutions The classic role of packaging is to “Protect, Inform, and Sell.” Today, packaging must do all that—but with minimal eco-impact. Packaging Sustainability: Tools, Systems, and Strategies for Innovative Package Design is a comprehensive guide to thinking outside the box to create practical, cost-effective, and eco-responsible packaging. With a broad range of contributions from pioneers of sustainability, Packaging Sustainability not only describes the concepts of sustainability but reveals the logic behind them, providing you with the tools to sift through and adapt to the ever changing barrage of materials, services, regulations, and mandates. The book: Enables the designer to make smart, informed decisions at all points throughout the packaging design process Offers a comprehensive overview of sustainable packaging design issues from leading practitioners, designers, engineers, marketers, psychologists, and ecologists Describes materials and processes in current use and helps the reader understand how they interconnect With solid information and actionable ideas, Packaging Sustainability gives you all the tools for maximizing a product’s shelf impact—while minimizing its ecological footprint.
Author: Publisher: ISBN: Category : Languages : en Pages : 44
Book Description
Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Author: Yuantao Guo Publisher: Routledge ISBN: 1134149905 Category : Business & Economics Languages : en Pages : 291
Book Description
From the 1970s to the 1990s, China implemented a wide array of industrial policies to build up indigenous big business groups in their attempts to ‘catch-up’ with the industries of the developed world. With its entry into the WTO, China is under huge pressure to pursue the market-friendly policies advocated by the advanced economies. This is the first book in English that applies the theories of big business, catch-up and state intervention to the Chinese brewing industry. Having gathered first-hand research in China, Yuantao Guo analyzes the relationship between big business, competition and state intervention in the context of developing economies, demonstrating the implications of the industrial concentration and value chain integration of the global big business revolution for catch-up by developing world industries, considering to what extent state intervention can allow them to meet the competitive challenge. Examining these themes in relation to the Chinese brewing industry, Yuantao Guo uses detailed case studies of the Yanjing and Tsingtao breweries in order to detail the struggles that Chinese brewers have faced. This book makes a significant contribution to modern day discussions on globalization.
Author: Hong Meng Publisher: John Wiley & Sons ISBN: 3527845712 Category : Technology & Engineering Languages : en Pages : 389
Book Description
Flexible Electronic Packaging and Encapsulation Technology A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposes Guidelines for designing high-performance packaging materials with novel structures An authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.
Author: Pengfei Zhao
Author: Pengfei Zhao
Author: Wendy Jedlicka
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Author: Yuantao Guo
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Author: Hong Meng
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Author: IBP USA