Author: Peter John BjeletichPublisher:
ISBN:
Category :
Languages : en
Pages : 480
Book Description
Characterization of Heteroepitaxial Silicon Germanium Carbon Layers for Metal Oxide Semiconductor Field Effect Transistor (MOSFET) Applications
Author: Peter John BjeletichPublisher:
ISBN:
Category :
Languages : en
Pages : 480
Book Description
Dissertation Abstracts International
Author: Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 794
Book Description
Chemical Abstracts
Author: Low Resistivity Contact Methodologies for Silicon, Silicon Germanium and Silicon Carbon Source/Drain Junctions of Nanoscale CMOS Integrated Circuits
Author: Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
State-of-the-art p-channel metal oxide semiconductor field effect transistors (MOSFETs) employ Si(1-x)Ge(x) source/drain junctions to induce uniaxial compressive strain in the channel region in order to achieve hole mobility enhancement. It is also know that the elec- tron mobility can be enhanced if the MOSFET channel is under uniaxial tension, which can be realized by replacing Si(1-x)Ge(x) with Si(1-y)C(y) epitaxial layers in recessed source/drain regions of n-channel MOSFETs. This dissertation focuses on epitaxy of Si(1-y)C(y) layers and low resistivity contacts on Si, Si(1-x)Ge(x), and Si(1-y)C(y) alloys. While these contacts are of particular importance for future MOSFETs, other devices based on these semiconductors can also benefit from the results presented in this dissertation. The experimental work on Si(1-y)C(y) epitaxiy focused on understanding the impact of various process parameters on carbon incorporation, substitutionality, growth rate, phosphorus incorporation and activation in order to achieve low resistivity Si(1-y)C(y) films with high substitutional carbon levels. It was shown, for the first time, that phosphorus lev- els above 1.3x10^(21) cm^( -3) can be achieved with 1.2% fully substitutional carbon in epitaxial layers. Specific contact resistivity (C) on strained Si(1-x)Ge(x) layers was evaluated using the existent results from the band structure calculations. Previous work on this topic mainly focused on barrier height and the doping density at the interface. In this work, the impact of the tunneling effective mass on specific contact resistivity was calculated for the first time for strained Si(1-x)Ge(x) alloys. It was shown that due to the exponential dependence of contact resistivity on this parameter tunneling effective mass may have a strong impact on contact resistivity. This is especially important for strained alloys in which the tunneling effective mass is dependent on the strain. The contact resistivity was found to decrease with Ge.
Metal Impurities in Silicon- and Germanium-Based Technologies
Author: Cor ClaeysPublisher: Springer
ISBN: 3319939254
Category : Technology & Engineering
Languages : en
Pages : 464
Book Description
This book provides a unique review of various aspects of metallic contamination in Si and Ge-based semiconductors. It discusses all of the important metals including their origin during crystal and/or device manufacturing, their fundamental properties, their characterization techniques and their impact on electrical devices’ performance. Several control and possible gettering approaches are addressed. The book offers a valuable reference guide for all researchers and engineers studying advanced and state-of-the-art micro- and nano-electronic semiconductor devices and circuits. Adopting an interdisciplinary approach, it combines perspectives from e.g. material science, defect engineering, device processing, defect and device characterization, and device physics and engineering.
Metal-oxide-semiconductor Devices Based on Epitaxial Germanium Layers Grown Selectively Directly on Silicon Substrates by Ultra-high-vacuum Chemical Vapor Deposition
Author: Joseph Patrick DonnellyPublisher:
ISBN:
Category : Gate array circuits
Languages : en
Pages : 252
Book Description
This document details experiments attempting to increase the performance of metal-oxide-semiconductor field-effect-transistors (MOSFETs) which are the mainstay of the semiconductor industry. Replacing the silicon channel with an ultra-thin epitaxial germanium layer grown selectively on a silicon (100) bulk wafer is examined in detail. The gate oxide chosen for the germanium devices is a high-k gate oxide, HfO2, and the gate electrode is a metal gate, tantalum-nitride. They demonstrate large improvements in drive current and mobility over identically processed silicon PMOSFETs. In addition to the planar germanium PMOSFETs, a process has been developed for 50nm and smaller germanium P-finFETs and N and P germanium tunnel-FETs. The patterning of sub-30nm wide and 230nm tall three dimensional fins has been done with electron beam lithography and dry plasma etching. The processes to deposit high-k gate oxide and metal gates on the sub-30nm wide fins have been developed. All that remains for the production of these devices is electron beam lithography with a maximum misalignment error of 40nm.
The Application of Strained-silicon/relaxed-silicon Germanium Heterostructures to Metal-oxide-semiconductor Field-effect Transistors
Author: Jeffrey John WelserSilicon, Germanium, and Their Alloys
Author: Gudrun KissingerPublisher: CRC Press
ISBN: 1466586648
Category : Science
Languages : en
Pages : 436
Book Description
Despite the vast knowledge accumulated on silicon, germanium, and their alloys, these materials still demand research, eminently in view of the improvement of knowledge on silicon–germanium alloys and the potentialities of silicon as a substrate for high-efficiency solar cells and for compound semiconductors and the ongoing development of nanodevices based on nanowires and nanodots. Silicon, Germanium, and Their Alloys: Growth, Defects, Impurities, and Nanocrystals covers the entire spectrum of R&D activities in silicon, germanium, and their alloys, presenting the latest achievements in the field of crystal growth, point defects, extended defects, and impurities of silicon and germanium nanocrystals. World-recognized experts are the authors of the book’s chapters, which span bulk, thin film, and nanostructured materials growth and characterization problems, theoretical modeling, crystal defects, diffusion, and issues of key applicative value, including chemical etching as a defect delineation technique, the spectroscopic analysis of impurities, and the use of devices as tools for the measurement of materials quality.
Знамя бригады
Author: Advanced Material and Device Applications with Germanium
Author: Sanghyun LeePublisher: BoD – Books on Demand
ISBN: 1789840317
Category : Science
Languages : en
Pages : 102
Book Description
Germanium is an elemental semiconductor, which played an important role in the birth of the semiconductor but soon was replaced with silicon. However, germanium is poised to make a remarkable comeback in the semiconductor industry. With this increasing attention, this book describes the fundamental aspects of germanium and its applications. The contributing authors are experts in their field with great in-depth knowledge. The authors strongly feel that this contribution might be of interest to readers and help to expand the scope of their knowledge.