CFD Analysis of Thermal Shadowing and Optimization of Heat Sinks in 3rd Generation Open Compute Server for Single Phase Immersion Cooling Applications PDF Download
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Author: Ravya Dandamudi Publisher: ISBN: Category : Languages : en Pages : 67
Book Description
In today's networking world, utilization of servers and data center has been increasing significantly. Increasing demands of processing and storage of data causes corresponding increase in power density of servers. The data center energy efficiency largely depends on thermal management of servers. Currently, air cooling is the most widely used thermal management technology in data centers. However, air cooling is starting to reach its limits due to very high-powered microprocessors and packaging. To overcome the limitations of air cooling in data centers, operators are moving towards immersion cooling using different dielectric fluids. Thermal shadowing is the effect in which temperature of a cooling medium increases by carrying heat from one server and results in decreasing its heat carrying capacity due to a reduction in the temperature difference between the maximum junction temperature of successive heat sinks and incoming fluid. Thermal Shadowing is a challenge for both air and low velocity oil flow cooling and as such, both air and low velocity dielectric flow cooling technologies need to be optimized to get high energy efficiency. In this study, the impact of Thermal Shadowing between different Dielectric Fluids is compared. The results of dielectric fluids, Mineral Oil and Synthetic Fluid EC100 are compared. The heat sink is a critical part for cooling effectiveness at server level. This work also provides an efficient range of operation for heat sink with computational modelling of third generation open compute server. Optimization of heat sink can allow to cool high-power density servers effectively. A parametric study is conducted, and the thermal efficiency has been optimized.
Author: Ravya Dandamudi Publisher: ISBN: Category : Languages : en Pages : 67
Book Description
In today's networking world, utilization of servers and data center has been increasing significantly. Increasing demands of processing and storage of data causes corresponding increase in power density of servers. The data center energy efficiency largely depends on thermal management of servers. Currently, air cooling is the most widely used thermal management technology in data centers. However, air cooling is starting to reach its limits due to very high-powered microprocessors and packaging. To overcome the limitations of air cooling in data centers, operators are moving towards immersion cooling using different dielectric fluids. Thermal shadowing is the effect in which temperature of a cooling medium increases by carrying heat from one server and results in decreasing its heat carrying capacity due to a reduction in the temperature difference between the maximum junction temperature of successive heat sinks and incoming fluid. Thermal Shadowing is a challenge for both air and low velocity oil flow cooling and as such, both air and low velocity dielectric flow cooling technologies need to be optimized to get high energy efficiency. In this study, the impact of Thermal Shadowing between different Dielectric Fluids is compared. The results of dielectric fluids, Mineral Oil and Synthetic Fluid EC100 are compared. The heat sink is a critical part for cooling effectiveness at server level. This work also provides an efficient range of operation for heat sink with computational modelling of third generation open compute server. Optimization of heat sink can allow to cool high-power density servers effectively. A parametric study is conducted, and the thermal efficiency has been optimized.
Author: Koushik Epuri Publisher: ISBN: Category : Languages : en Pages : 33
Book Description
Air cooling is predominant cooling technique employed in most of the data centers. As the demand for High performance computing (HPC) which deploy large concentration of high-end servers (30 kW to 200 kW per rack) is increasing, it is becoming challenging to cool the systems using air cooling. Liquid cooling has significant advantages over air cooling techniques due to higher heat capacities of fluids. Liquid immersion cooling using dielectric and non-corrosive mineral oils is one of the potential alternative to air cooling methods for high density data centers. In this work, we consider a third generation open compute server optimized for air cooling and find optimal heat sinks for immersion cooling. It is possible to use low profile heatsinks due to the thermal mass of the liquid vs air and thus reduce the server profile and potentially increase the server density in a rack. CFD is used to design the optimal heatsink.
Author: Mangesh Mohan Dhadve Publisher: ISBN: Category : Languages : en Pages : 51
Book Description
In recent years, there have been a phenomenal increase in Artificial Intelligence and Machine Learning that require data collection, mining and using data sets to teach computers certain things to learn, analyze image and speech recognition. Machine Learning tasks require a lot of computing power to carry out numerous calculations. Therefore, most servers are powered by Graphics Processing Units (GPUs) instead of traditional CPUs. GPUs provide more computational throughput per dollar spent than traditional CPUs. Open Compute Servers forum has introduced the state-of-the-art machine learning servers "Big Sur" recently. Big Sur unit consists of 4OU (OpenU) chassis housing eight NVIDIA Tesla M40 GPUs and two CPUs along with SSD storage and hot-swappable fans at the rear. Management of the airflow is a critical requirement in the implementation of air cooling for rack mount servers to ensure that all components, especially critical devices such as CPUs and GPUs, receive adequate flow as per requirement. In addition, component locations within the chassis play a vital role in the passage of airflow and affect the overall system resistance. In this paper, sizeable improvement in chassis ducting is targeted to counteract effects of air diffusion at the rear of air flow duct in "Big Sur" Open Compute machine learning server wherein GPUs are located directly downstream from CPUs. A CFD simulation of the detailed server model is performed with the objective of understanding the effect of air flow bypass on GPU die temperatures and fan power consumption. The cumulative effect was studied by simulations to see improvements in fan power consumption by the server.
Author: Bahman Zohuri Publisher: Springer ISBN: 3319298410 Category : Technology & Engineering Languages : en Pages : 539
Book Description
This book provides a practical study of modern heat pipe engineering, discussing how it can be optimized for use on a wider scale. An introduction to operational and design principles, this book offers a review of heat and mass transfer theory relevant to performance, leading into and exploration of the use of heat pipes, particularly in high-heat flux applications and in situations in which there is any combination of non-uniform heat loading, limited airflow over the heat generating components, and space or weight constraints. Key implementation challenges are tackled, including load-balancing, materials characteristics, operating temperature ranges, thermal resistance, and operating orientation. With its presentation of mathematical models to calculate heat transfer limitations and temperature gradient of both high- and low-temperature heat pipes, the book compares calculated results with the available experimental data. It also includes a series of computer programs developed by the author to support presented data, aid design, and predict performance.
Author: Puligandla Viswanadham Publisher: American Society of Mechanical Engineers ISBN: 9780791859667 Category : Technology & Engineering Languages : en Pages : 0
Book Description
ASME Press Book Series on Electronic Packaging. Series Editor: Dereje Agonafer. This book provides the basic essentials and fundamentals of electronic packaging technology. It introduces the language and terminology, as well as the basic building blocks of information processing technology such as: a) printed wiring boards and laminates, b) various types of components and packages, c) materials and processes, d) fundamentals of reliability and relevant reliability enhancement methods, and e) typical failures observed are described. A fully tested semiconductor device is the starting point for this text. Thus, no background in the semiconductor design or fabrication is assumed. The reader is exposed to the interaction and convergence of various disciplines such as chemistry, physics, materials science, metallurgy, process engineering in the fabrication of an electronic appliance. The reader is also made aware of the emerging trends in electronic packaging to prepare him or her for the near-term miniaturization and integration of technology trends.
Author: Tomas Brezina Publisher: Springer Science & Business Media ISBN: 3642050220 Category : Technology & Engineering Languages : en Pages : 456
Book Description
Mechatronics is a synergic discipline integrating precise mechanics, electrotechnics, electronics and IT technologies. The main goal of mechatronical approach to design of complex products is to achieve new quality of their utility value at reasonable price. Successful accomplishment of this task would not be possible without application of advanced software and hardware tools for simulation of design, technologies and production control and also for simulation of behavior of these products in order to provide the highest possible level of spatial and functional integration of the final product. This book brings a review of the current state of the art in mechatronics, as presented at the 8th International Conference Mechatronics 2009, organized by the Brno Technical University, Faculty of Mechanical Engineering, Czech Republic. The specific topics of the conference are Modelling and Simulation, Metrology & Diagnostics, Sensorics & Photonics, Control & Robotics, MEMS Design & Mechatronic Products, Production Machines and Biomechanics. The selected contributions provide an insight into the current development of these scientific disciplines, present the new results of research and development and indicate the trends of development in the interdisciplinary field of mechatronic systems. Therefore, the book provides the latest and helpful information both for the R&D specialists and for the designers working in mechatronics and related fields.
Author: Bhavani Prasad Dewan Sandur Publisher: ProQuest ISBN: 9780542810671 Category : Mechanical engineering Languages : en Pages :
Book Description
This thesis focuses on carrying out a parametric study of stacking memory and the logic processor on the same substrate. In present technologies, logic processor and memory packages are located side-by-side on the board or they are packaged separately and then stacked on top of each other (Package-on-package [PoP]). Mixing memory and logic processor in the same stack has advantage and challenges, but requires the integration ability of economies-of-scale. The technology needed for packaging memory and logic dice on the same substrate is completely different as compared to packaging only memory dice or logic dice, or, packaging memory and logic separately and creating a single functional package [PoP]. Geometries needed were generated by using Pro/EngineerRTM Wildfire(TM) 2.0 as a Computer-Aided-Design (CAD) tool and were transferred to ANSYSRTM Workbench(TM) 10.0, where meshed analysis was conducted. Package architectures evaluated were rotated stack, staggered stack utilizing redistributed pads, and stacking with spacers, while all other parameters were held constant. The values of these parameters were determined to give a junction temperature of 100°C, which is an unacceptable value due to wafer level electromigration. A discussion is presented as to what parameters need to be adjusted in order to meet the required thermal design specification. In that light, a list of solutions consisting of increasing the heat transfer co-efficient on top of the package, the use of underfill, improved thermal conductivity of the PCB, and the use of a copper heat spreader were evaluated. Results are evaluated in the light of market segment requirements. (Abstract shortened by UMI.).
Author: Ravya Dandamudi
Author: Ravya Dandamudi
Author: Koushik Epuri![CFD Simulation and Design Optimization to Improve Cooling Performance of Open Compute 'Big Sur' Server (Reprinted with ASME Permission) [13] PDF](https://books.google.com/books/content/images/frontcover/dFZCzwEACAAJ?fife=w80-h100)
Author: Mangesh Mohan Dhadve
Author: Deepak Bazaz
Author: Bahman Zohuri
Author: United States. Federal Aviation Administration
Author: Puligandla Viswanadham
Author: Tomas Brezina
Author: Bhavani Prasad Dewan Sandur
Author: