Author: Karl John Larson GeislerPublisher:
ISBN:
Category :
Languages : en
Pages : 806
Book Description
Buoyancy-driven Two Phase Flow and Boiling Heat Transfer in Narrow Vertical Channels
Author: Karl John Larson GeislerPublisher:
ISBN:
Category :
Languages : en
Pages : 806
Book Description
Flow Boiling Heat Transfer in Narrow Vertical Channels
Author: Jianyun ShuaiPublisher: Cuvillier Verlag
ISBN: 3865372406
Category :
Languages : en
Pages : 131
Book Description
Boiling Heat Transfer And Two-Phase Flow
Author: L S TongPublisher: CRC Press
ISBN: 9781560324850
Category : Science
Languages : en
Pages : 582
Book Description
Completely updated, this graduate text describes the current state of boiling heat transfer and two-phase flow, in terms through which students can attain a consistent understanding. Prediction of real or potential boiling heat transfer behaviour, both in steady and transient states, is covered to aid engineering design of reliable and effective systems.
Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research
Author: Madhusudan IyengarPublisher: World Scientific
ISBN: 9814579807
Category : Technology & Engineering
Languages : en
Pages : 471
Book Description
To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.
Encyclopedia Of Thermal Packaging - Set 1: Thermal Packaging Techniques (A 6-volume Set)
Author: Publisher: World Scientific
ISBN: 9814452599
Category : Technology & Engineering
Languages : en
Pages : 1582
Book Description
remove This Encyclopedia comes in 3 sets. To check out Set 2 and Set 3, please visit Set 2: Thermal Packaging Tools and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 1: Thermal Packaging TechniquesThe first set of the Encyclopedia, Thermal Packaging Techniques, focuses on the technology “building blocks” used to assemble a complete thermal management system and provide detailed descriptions of the underlying phenomena, modeling equations, and correlations, as well as guidance for achieving the optimal designs of individual “building blocks” and their insertion in the overall thermal solution. Specific volumes deal with microchannel coolers, cold plates, immersion cooling modules, thermoelectric microcoolers, and cooling devices for solid state lighting systems, as well as techniques and procedures for the experimental characterization of thermal management components. These “building blocks” are the essential elements in the creation of a complete, cost-effective thermal management system.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques (a 6-Volume Set)
Author: Avram Bar-CohenPublisher: World Scientific
ISBN: 9814313785
Category : Technology & Engineering
Languages : en
Pages : 1582
Book Description
Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density achieved by the full range of electronic, microelectronic and nanoelectronic products during the past several decades. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal management on the critical path of nearly every organization dealing with traditional electronic product development, as well as emerging, product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of critical importance in the refinement of traditional products and in the development of products for new applications.The Encyclopedia of Thermal Packaging, compiled into four 5-volume sets (Thermal Packaging Techniques, Thermal Packaging Configurations, Thermal Packaging Tools and Thermal Packaging Applications), will provide comprehensive, one-stop treatment of the techniques, configurations, tools and applications of electronic thermal packaging. Each volume in a set comprises 250–350 pages and is written by world experts in thermal management of electronics.
Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools (A 4-volume Set)
Author: Publisher: World Scientific
ISBN: 9814520241
Category : Technology & Engineering
Languages : en
Pages : 1397
Book Description
remove This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
VDI Heat Atlas
Author: VDI GesellschaftPublisher: Springer Science & Business Media
ISBN: 3540778764
Category : Science
Languages : en
Pages : 1608
Book Description
For more than 50 years, the Springer VDI Heat Atlas has been an indispensable working means for engineers dealing with questions of heat transfer. Featuring 50% more content, this new edition covers most fields of heat transfer in industrial and engineering applications. It presents the interrelationships between basic scientific methods, experimental techniques, model-based analysis and their transfer to technical applications.
Boiling Heat Transfer
Author: R.T. Lahey Jr.Publisher: Elsevier
ISBN: 1483291383
Category : Technology & Engineering
Languages : en
Pages : 629
Book Description
This volume covers the modern developments in boiling heat transfer and two-phase flow, and is intended to provide industrial, government and academic researchers with state-of-the-art research findings in the area of multiphase flow and heat transfer technology. Special attention is given to technology transfer, indicating how recent significant results may be used for practical applications. The chapters give detailed technical material that will be useful to engineers and scientists who work in the field of multiphase flow and heat transfer. The authors of all chapters are members of the CMR at Rensselaer, a research centre specializing in the state-of-the-art in multiphase science.
Flow boiling and condensation in microscale channels
Author: Fabio Toshio KanizawaPublisher: Springer Nature
ISBN: 303068704X
Category : Science
Languages : en
Pages : 290
Book Description
This book covers aspects of multiphase flow and heat transfer during phase change processes, focusing on boiling and condensation in microscale channels. The authors present up-to-date predictive methods for flow pattern, void fraction, pressure drop, heat transfer coefficient and critical heat flux, pointing out the range of operational conditions that each method is valid. The first four chapters are dedicated on the motivation to study multiphase flow and heat transfer during phase change process, and the three last chapters are focused on the analysis of heat transfer process during boiling and condensation. During the description of the models and predictive methods, the trends are discussed and compared with experimental findings.