Author: L S Tong
Publisher: Routledge
ISBN: 1351463365
Category : Science
Languages : en
Pages : 394
Book Description
Completely updated, this graduate text describes the current state of boiling heat transfer and two-phase flow, in terms through which students can attain a consistent understanding. Prediction of real or potential boiling heat transfer behaviour, both in steady and transient states, is covered to aid engineering design of reliable and effective systems.
Boiling Heat Transfer And Two-Phase Flow
Author: L S Tong
Publisher: Routledge
ISBN: 1351463365
Category : Science
Languages : en
Pages : 394
Book Description
Completely updated, this graduate text describes the current state of boiling heat transfer and two-phase flow, in terms through which students can attain a consistent understanding. Prediction of real or potential boiling heat transfer behaviour, both in steady and transient states, is covered to aid engineering design of reliable and effective systems.
Publisher: Routledge
ISBN: 1351463365
Category : Science
Languages : en
Pages : 394
Book Description
Completely updated, this graduate text describes the current state of boiling heat transfer and two-phase flow, in terms through which students can attain a consistent understanding. Prediction of real or potential boiling heat transfer behaviour, both in steady and transient states, is covered to aid engineering design of reliable and effective systems.
NBS Special Publication
Author:
Publisher:
ISBN:
Category : Weights and measures
Languages : en
Pages : 838
Book Description
Publisher:
ISBN:
Category : Weights and measures
Languages : en
Pages : 838
Book Description
Multiphase Flow Dynamics 3
Author: Nikolay Ivanov Kolev
Publisher: Springer Science & Business Media
ISBN: 3642213723
Category : Technology & Engineering
Languages : en
Pages : 683
Book Description
Multi-phase flows are part of our natural environment such as tornadoes, typhoons, air and water pollution and volcanic activities as well as part of industrial technology such as power plants, combustion engines, propulsion systems, or chemical and biological industry. The industrial use of multi-phase systems requires analytical and numerical strategies for predicting their behavior. .In its fourth extended edition the successful monograph package “Multiphase Flow Daynmics” contains theory, methods and practical experience for describing complex transient multi-phase processes in arbitrary geometrical configurations, providing a systematic presentation of the theory and practice of numerical multi-phase fluid dynamics. In the present third volume methods for describing of the thermal interactions in multiphase dynamics are provided. In addition a large number of valuable experiments is collected and predicted using the methods introduced in this monograph. In this way the accuracy of the methods is revealed to the reader. This fourth edition includes various updates, extensions, improvements and corrections. "The literature in the field of multiphase flows is numerous. Therefore, it is very important to have a comprehensive and systematic overview including useful numerical methods. The volumes have the character of a handbook and accomplish this function excellently. The models are described in detail and a great number of comprehensive examples and some cases useful for testing numerical solutions are included. These two volumes are very useful for scientists and practicing engineers in the fields of technical thermodynamics, chemical engineering, fluid mechanics, and for mathematicians with interest in technical problems. Besides, they can give a good overview of the dynamically developing, complex field of knowledge to students. This monograph is highly recommended,” BERND PLATZER, ZAAM In the present third volume methods for describing of the thermal interactions in multiphase dynamics are provided. In addition a large number of valuable experiments is collected and predicted using the methods introduced in this monograph. In this way the accuracy of the methods is revealed to the reader. This fourth edition includes various updates, extensions, improvements and corrections. "The literature in the field of multiphase flows is numerous. Therefore, it is very important to have a comprehensive and systematic overview including useful numerical methods. The volumes have the character of a handbook and accomplish this function excellently. The models are described in detail and a great number of comprehensive examples and some cases useful for testing numerical solutions are included. These two volumes are very useful for scientists and practicing engineers in the fields of technical thermodynamics, chemical engineering, fluid mechanics, and for mathematicians with interest in technical problems. Besides, they can give a good overview of the dynamically developing, complex field of knowledge to students. This monograph is highly recommended,” BERND PLATZER, ZAAM
Publisher: Springer Science & Business Media
ISBN: 3642213723
Category : Technology & Engineering
Languages : en
Pages : 683
Book Description
Multi-phase flows are part of our natural environment such as tornadoes, typhoons, air and water pollution and volcanic activities as well as part of industrial technology such as power plants, combustion engines, propulsion systems, or chemical and biological industry. The industrial use of multi-phase systems requires analytical and numerical strategies for predicting their behavior. .In its fourth extended edition the successful monograph package “Multiphase Flow Daynmics” contains theory, methods and practical experience for describing complex transient multi-phase processes in arbitrary geometrical configurations, providing a systematic presentation of the theory and practice of numerical multi-phase fluid dynamics. In the present third volume methods for describing of the thermal interactions in multiphase dynamics are provided. In addition a large number of valuable experiments is collected and predicted using the methods introduced in this monograph. In this way the accuracy of the methods is revealed to the reader. This fourth edition includes various updates, extensions, improvements and corrections. "The literature in the field of multiphase flows is numerous. Therefore, it is very important to have a comprehensive and systematic overview including useful numerical methods. The volumes have the character of a handbook and accomplish this function excellently. The models are described in detail and a great number of comprehensive examples and some cases useful for testing numerical solutions are included. These two volumes are very useful for scientists and practicing engineers in the fields of technical thermodynamics, chemical engineering, fluid mechanics, and for mathematicians with interest in technical problems. Besides, they can give a good overview of the dynamically developing, complex field of knowledge to students. This monograph is highly recommended,” BERND PLATZER, ZAAM In the present third volume methods for describing of the thermal interactions in multiphase dynamics are provided. In addition a large number of valuable experiments is collected and predicted using the methods introduced in this monograph. In this way the accuracy of the methods is revealed to the reader. This fourth edition includes various updates, extensions, improvements and corrections. "The literature in the field of multiphase flows is numerous. Therefore, it is very important to have a comprehensive and systematic overview including useful numerical methods. The volumes have the character of a handbook and accomplish this function excellently. The models are described in detail and a great number of comprehensive examples and some cases useful for testing numerical solutions are included. These two volumes are very useful for scientists and practicing engineers in the fields of technical thermodynamics, chemical engineering, fluid mechanics, and for mathematicians with interest in technical problems. Besides, they can give a good overview of the dynamically developing, complex field of knowledge to students. This monograph is highly recommended,” BERND PLATZER, ZAAM
The MEMS Handbook
Author: Mohamed Gad-el-Hak
Publisher: CRC Press
ISBN: 9781420050905
Category : Technology & Engineering
Languages : en
Pages : 1386
Book Description
The revolution is well underway. Our understanding and utilization of microelectromechanical systems (MEMS) are growing at an explosive rate with a worldwide market approaching billions of dollars. In time, microdevices will fill the niches of our lives as pervasively as electronics do right now. But if these miniature devices are to fulfill their mammoth potential, today's engineers need a thorough grounding in the underlying physics, modeling techniques, fabrication methods, and materials of MEMS. The MEMS Handbook delivers all of this and more. Its team of authors-unsurpassed in their experience and standing in the scientific community- explore various aspects of MEMS: their design, fabrication, and applications as well as the physical modeling of their operations. Designed for maximum readability without compromising rigor, it provides a current and essential overview of this fledgling discipline.
Publisher: CRC Press
ISBN: 9781420050905
Category : Technology & Engineering
Languages : en
Pages : 1386
Book Description
The revolution is well underway. Our understanding and utilization of microelectromechanical systems (MEMS) are growing at an explosive rate with a worldwide market approaching billions of dollars. In time, microdevices will fill the niches of our lives as pervasively as electronics do right now. But if these miniature devices are to fulfill their mammoth potential, today's engineers need a thorough grounding in the underlying physics, modeling techniques, fabrication methods, and materials of MEMS. The MEMS Handbook delivers all of this and more. Its team of authors-unsurpassed in their experience and standing in the scientific community- explore various aspects of MEMS: their design, fabrication, and applications as well as the physical modeling of their operations. Designed for maximum readability without compromising rigor, it provides a current and essential overview of this fledgling discipline.
Advances in Heat Transfer
Author: Young I. Cho
Publisher: Academic Press
ISBN: 0123815290
Category : Science
Languages : en
Pages : 459
Book Description
Advances in Heat Transfer fills the information gap between regularly scheduled journals and university-level textbooks by providing in-depth review articles over a broader scope than in journals or texts. The articles, which serve as a broad review for experts in the field, will also be of great interest to non-specialists who need to keep up-to-date with the results of the latest research. This serial is essential reading for all mechanical, chemical and industrial engineers working in the field of heat transfer, graduate schools or industry. Provides an overview of review articles on topics of current interest Bridges the gap between academic researchers and practitioners in industry A long-running and prestigious series
Publisher: Academic Press
ISBN: 0123815290
Category : Science
Languages : en
Pages : 459
Book Description
Advances in Heat Transfer fills the information gap between regularly scheduled journals and university-level textbooks by providing in-depth review articles over a broader scope than in journals or texts. The articles, which serve as a broad review for experts in the field, will also be of great interest to non-specialists who need to keep up-to-date with the results of the latest research. This serial is essential reading for all mechanical, chemical and industrial engineers working in the field of heat transfer, graduate schools or industry. Provides an overview of review articles on topics of current interest Bridges the gap between academic researchers and practitioners in industry A long-running and prestigious series
Nuclear Science Abstracts
Two-phase Flows and Heat Transfer
Encyclopedia Of Thermal Packaging - Set 1: Thermal Packaging Techniques (A 6-volume Set)
Author:
Publisher: World Scientific
ISBN: 9814452599
Category : Technology & Engineering
Languages : en
Pages : 1582
Book Description
remove This Encyclopedia comes in 3 sets. To check out Set 2 and Set 3, please visit Set 2: Thermal Packaging Tools and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 1: Thermal Packaging TechniquesThe first set of the Encyclopedia, Thermal Packaging Techniques, focuses on the technology “building blocks” used to assemble a complete thermal management system and provide detailed descriptions of the underlying phenomena, modeling equations, and correlations, as well as guidance for achieving the optimal designs of individual “building blocks” and their insertion in the overall thermal solution. Specific volumes deal with microchannel coolers, cold plates, immersion cooling modules, thermoelectric microcoolers, and cooling devices for solid state lighting systems, as well as techniques and procedures for the experimental characterization of thermal management components. These “building blocks” are the essential elements in the creation of a complete, cost-effective thermal management system.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
Publisher: World Scientific
ISBN: 9814452599
Category : Technology & Engineering
Languages : en
Pages : 1582
Book Description
remove This Encyclopedia comes in 3 sets. To check out Set 2 and Set 3, please visit Set 2: Thermal Packaging Tools and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 1: Thermal Packaging TechniquesThe first set of the Encyclopedia, Thermal Packaging Techniques, focuses on the technology “building blocks” used to assemble a complete thermal management system and provide detailed descriptions of the underlying phenomena, modeling equations, and correlations, as well as guidance for achieving the optimal designs of individual “building blocks” and their insertion in the overall thermal solution. Specific volumes deal with microchannel coolers, cold plates, immersion cooling modules, thermoelectric microcoolers, and cooling devices for solid state lighting systems, as well as techniques and procedures for the experimental characterization of thermal management components. These “building blocks” are the essential elements in the creation of a complete, cost-effective thermal management system.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques (a 6-Volume Set)
Author: Avram Bar-Cohen
Publisher: World Scientific
ISBN: 9814313785
Category : Technology & Engineering
Languages : en
Pages : 1582
Book Description
Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density achieved by the full range of electronic, microelectronic and nanoelectronic products during the past several decades. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal management on the critical path of nearly every organization dealing with traditional electronic product development, as well as emerging, product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of critical importance in the refinement of traditional products and in the development of products for new applications.The Encyclopedia of Thermal Packaging, compiled into four 5-volume sets (Thermal Packaging Techniques, Thermal Packaging Configurations, Thermal Packaging Tools and Thermal Packaging Applications), will provide comprehensive, one-stop treatment of the techniques, configurations, tools and applications of electronic thermal packaging. Each volume in a set comprises 250–350 pages and is written by world experts in thermal management of electronics.
Publisher: World Scientific
ISBN: 9814313785
Category : Technology & Engineering
Languages : en
Pages : 1582
Book Description
Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density achieved by the full range of electronic, microelectronic and nanoelectronic products during the past several decades. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal management on the critical path of nearly every organization dealing with traditional electronic product development, as well as emerging, product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of critical importance in the refinement of traditional products and in the development of products for new applications.The Encyclopedia of Thermal Packaging, compiled into four 5-volume sets (Thermal Packaging Techniques, Thermal Packaging Configurations, Thermal Packaging Tools and Thermal Packaging Applications), will provide comprehensive, one-stop treatment of the techniques, configurations, tools and applications of electronic thermal packaging. Each volume in a set comprises 250–350 pages and is written by world experts in thermal management of electronics.
Thermo-Hydraulics of Nuclear Reactors
Author: Christopher Earls Brennen
Publisher: Cambridge University Press
ISBN: 1107139600
Category : Science
Languages : en
Pages : 173
Book Description
This book provides a summary of thermo-hydraulic analyses and design principles of nuclear reactors for electricity generation. It includes summaries of the causes for the three major nuclear power generation accidents, Three Mile Island, Chernobyl and Fukushima, and the major improvements to reactor safety that grew out of those accidents.
Publisher: Cambridge University Press
ISBN: 1107139600
Category : Science
Languages : en
Pages : 173
Book Description
This book provides a summary of thermo-hydraulic analyses and design principles of nuclear reactors for electricity generation. It includes summaries of the causes for the three major nuclear power generation accidents, Three Mile Island, Chernobyl and Fukushima, and the major improvements to reactor safety that grew out of those accidents.