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Author: Julian Robinson Publisher: ISBN: Category : Design Languages : en Pages : 216
Book Description
An examination of costume, sex customs and symbolism from codpieces and penile sheaths to high-heeled shoes and French knickers, uniforms and bondage gear, wedding dresses, tail coats and jeans. Fine illustrations. Robinson, ousted for teaching his version of fashion and textiles, dedicates this learned and witty book "to the chairman and principal of the Sydney College of the Arts for their generous financial settlement..." Annotation copyrighted by Book News, Inc., Portland, OR
Author: Julian Robinson Publisher: ISBN: Category : Design Languages : en Pages : 216
Book Description
An examination of costume, sex customs and symbolism from codpieces and penile sheaths to high-heeled shoes and French knickers, uniforms and bondage gear, wedding dresses, tail coats and jeans. Fine illustrations. Robinson, ousted for teaching his version of fashion and textiles, dedicates this learned and witty book "to the chairman and principal of the Sydney College of the Arts for their generous financial settlement..." Annotation copyrighted by Book News, Inc., Portland, OR
Author: D. A. Dean Publisher: CRC Press ISBN: 146657478X Category : Medical Languages : en Pages : 646
Book Description
Pharmaceutical packaging requires a greater knowledge of materials and a greater intensity of testing than most other packed products, not to mention a sound knowledge of pharmaceutical products and an understanding of regulatory requirements. Structured to meet the needs of the global market, this volume provides an assessment of a wide range of i
Author: Sharon Lamb, Ed.D. Publisher: St. Martin's Press ISBN: 1429906324 Category : Family & Relationships Languages : en Pages : 342
Book Description
The stereotype-laden message, delivered through clothes, music, books, and TV, is essentially a continuous plea for girls to put their energies into beauty products, shopping, fashion, and boys. This constant marketing, cheapening of relationships, absence of good women role models, and stereotyping and sexualization of girls is something that parents need to first understand before they can take action. Lamb and Brown teach parents how to understand these influences, give them guidance on how to talk to their daughters about these negative images, and provide the tools to help girls make positive choices about the way they are in the world. In the tradition of books like Reviving Ophelia, Odd Girl Out, Queen Bees and Wannabees that examine the world of girls, this book promises to not only spark debate but help parents to help their daughters.
Author: Beth Keser Publisher: John Wiley & Sons ISBN: 1119314135 Category : Technology & Engineering Languages : en Pages : 576
Book Description
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.
Author: Rao Tummala Publisher: McGraw Hill Professional ISBN: 0071500596 Category : Technology & Engineering Languages : en Pages : 979
Book Description
LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing
Author: Julian Robinson
Author: Julian Robinson
Author: D. A. Dean
Author: Sharon Lamb, Ed.D.
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Author: United States. Patent and Trademark Office
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Author: Beth Keser
Author: Michael Colmer
Author: Rao Tummala