Area Array Packaging Handbook PDF Download

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Area Array Packaging Handbook

Area Array Packaging Handbook PDF Author: Ken Gilleo
Publisher: McGraw Hill Professional
ISBN:
Category : Business & Economics
Languages : en
Pages : 832

Book Description
*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)
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