Arbitrary Modeling of TSVs for 3D Integrated Circuits PDF Download

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Arbitrary Modeling of TSVs for 3D Integrated Circuits

Arbitrary Modeling of TSVs for 3D Integrated Circuits PDF Author: Khaled Salah
Publisher: Springer
ISBN: 3319076116
Category : Technology & Engineering
Languages : en
Pages : 181

Book Description
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
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