Application of Fracture Mechanics in Electronic Packaging PDF Download

Author: William T. Chen
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 206

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Book Description
Twenty-three technical papers from the November 1997 symposium show how applications of the mechanics of fracture help to maintain the reliability of modern electronic components even while they become faster, smaller, and cheaper.

Author: Tien Y. Wu
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 286

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Book Description
Thirty-one technical papers representing a balance between university research and industrial practice, the results of which advance the quality and reliability of electronic products through fracture mechanics. Among the range of topics discussed at the symposium were: analytical and numerical anal

Author: Shen Liu
Publisher: John Wiley & Sons
ISBN: 0470827807
Category : Technology & Engineering
Languages : en
Pages : 586

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Book Description
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

Author: Y.C. Lee
Publisher: Springer Science & Business Media
ISBN: 1461558034
Category : Science
Languages : en
Pages : 270

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Book Description
About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.

Author: Mckeown
Publisher: CRC Press
ISBN: 9780824770334
Category : Technology & Engineering
Languages : en
Pages : 382

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Book Description
"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."

Author: L.J. Ernst
Publisher: Springer Science & Business Media
ISBN: 9780792372783
Category : Language Arts & Disciplines
Languages : en
Pages : 214

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Book Description
"Benefiting from Thermal and Mechanical Simulation inMicro-Electronics" presents papers from the first internationalconference on this topic, EuroSimE2000. For the first time, peoplefrom the electronics industry, research institutes, software companiesand universities joined together to discuss present and possiblefuture thermal and mechanical related problems and challenges inmicro-electronics; the state-of-the-art methodologies for thermal &mechanical simulation and optimization of micro-electronics; and theperspectives of future simulation and optimization methodologydevelopment.Main areas covered are: - "Benefiting from Thermal and""Mechanical Simulation in Micro-Electronics" is suitable forstudents at graduate level and beyond, and for researchers, designersand specialists in the fields of microelectronics and mechanics.

Author: Zhenhan Yao
Publisher: Springer Science & Business Media
ISBN: 3540482601
Category : Technology & Engineering
Languages : en
Pages : 354

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Book Description
Here are the printed proceedings of EPMESC X, held on August 21-23, 2006 in Sanya, Hainan Island of China. It includes 14 full papers of plenary and semi-plenary lectures and approximately 166 one-page summaries. The accompanying CD-ROM includes all 180 full papers presented at the conference.

Author: Haleh Ardebili
Publisher: William Andrew
ISBN: 0128119799
Category : Technology & Engineering
Languages : en
Pages : 510

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Book Description
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. - Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics - Includes coverage of environmentally friendly 'green encapsulants' - Presents coverage of faults and defects, and how to analyze and avoid them

Author: YongAn Huang
Publisher: Springer
ISBN: 981133627X
Category : Technology & Engineering
Languages : en
Pages : 297

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Book Description
This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.

Author: M. Fuentes
Publisher: Elsevier
ISBN: 0080531997
Category : Technology & Engineering
Languages : en
Pages : 275

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Book Description
This book contains 15 fully peer-reviewed Invited Papers which were presented at the 13th Biennial European Conference on Fracture and is a companion to the CD-ROM http://www.elsevier.com/locate/isbn/008043701xProceedings. The organisers of the ECF 13 opted from the very beginning for an application-orientated conference, and consequently, this book contributes to the understanding of fracture phenomena, and disseminates fracture concepts and their application to the solution of engineering problems to practitioners in a wide range of fields. The fields covered in this book can be broadly classified into: elastic-plastic fracture mechanics, fracture dynamics, fatigue and interactive processes, failure, structural integrity, coatings and materials, with applications to the following industrial sectors: transport, aerospace engineering, civil engineering, pipelines and automotive engineering.