Author: Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Application of Chemical-mechanical Polishing to Planarization of Surface-micromachined Devices
Author: Application of Chemical-mechanical Polishing to Planarization of Surface-micromachined Devises
Author: Publisher:
ISBN:
Category :
Languages : en
Pages : 6
Book Description
Chemical-Mechanical Polishing (CMP) has emerged as an enabling technology for manufacturing multi-level metal interconnects used in high-density Integrated Circuits (IC). In this work we present extension of CMP from sub-micron IC manufacturing to fabrication of complex surface-micromachined Micro-ElectroMechanical Systems (MEMS). This planarization technique alleviates processing problems associated with fabrication of multi-level polysilicon structures, eliminates design constraints linked with non-planar topography, and provides an avenue for integrating different process technologies. We discuss the CMP process and present examples of the use of CMP in fabricating MEMS devices such as microengines, pressures sensors, and proof masses for accelerometers along with its use for monolithically integrating MEMS devices with microelectronics.
The History of the Norman Conquest of England: The preliminary history to the election of Eadward the Confessor
Author: Edward Augustus FreemanPublisher:
ISBN:
Category : Great Britain
Languages : en
Pages :
Book Description
Proceedings of the Symposium on Microstructures and Microfabricated Systems IV
Author: Henry G. HughesPublisher: The Electrochemical Society
ISBN: 9781566772068
Category : Science
Languages : en
Pages : 286
Book Description
Microelectronic Applications of Chemical Mechanical Planarization
Author: Yuzhuo LiPublisher: John Wiley & Sons
ISBN: 9780470180891
Category : Technology & Engineering
Languages : en
Pages : 760
Book Description
An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.
Chemical-mechanical Polishing
Author: Soon Kang HuangPublisher:
ISBN:
Category : Grinding and polishing
Languages : en
Pages : 172
Book Description
MEMS and Microstructures in Aerospace Applications
Author: Robert OsianderPublisher: CRC Press
ISBN: 1420027743
Category : Technology & Engineering
Languages : en
Pages : 400
Book Description
The promise of MEMS for aerospace applications has been germinating for years, and current advances bring the field to the very cusp of fruition. Reliability is chief among the challenges limiting the deployment of MEMS technologies in space, as the requirement of zero failure during the mission is quite stringent for this burgeoning field. MEMS and Microstructures in Aerospace Applications provides all the necessary tools to overcome these obstacles and take MEMS from the lab bench to beyond the exosphere. The book begins with an overview of MEMS development and provides several demonstrations of past and current examples of MEMS in space. From this platform, the discussion builds to fabrication technologies; the effect of space environmental factors on MEMS devices; and micro technologies for space systems, instrumentation, communications, thermal control, guidance navigation and control, and propulsion. Subsequent chapters explore factors common to all of the described systems, such as MEMS packaging, handling and contamination control, material selection for specific applications, reliability practices for design and application, and assurance practices. Edited and contributed by an outstanding team of leading experts from industry, academia, and national laboratories, MEMS and Microstructures in Aerospace Applications illuminates the path toward qualifying and integrating MEMS devices and instruments into future space missions and developing innovative satellite systems.
Micromachined Devices and Components
Author: Use of Chemical Mechanical Polishing in Micromachining
Author: Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
A process for removing topography effects during fabrication of micromachines. A sacrificial oxide layer is deposited over a level containing functional elements with etched valleys between the elements such that the sacrificial layer has sufficient thickness to fill the valleys and extend in thickness upwards to the extent that the lowest point on the upper surface of the oxide layer is at least as high as the top surface of the functional elements in the covered level. The sacrificial oxide layer is then polished down and planarized by chemical-mechanical polishing. Another layer of functional elements is then formed upon this new planarized surface.
Micro Electro Mechanical System Design
Author: James J. AllenPublisher: CRC Press
ISBN: 1420027751
Category : Technology & Engineering
Languages : en
Pages : 492
Book Description
It is challenging at best to find a resource that provides the breadth of information necessary to develop a successful micro electro mechanical system (MEMS) design. Micro Electro Mechanical System Design is that resource. It is a comprehensive, single-source guide that explains the design process by illustrating the full range of issues involved,