Author: Elon Jahdal Terrell
Publisher:
ISBN:
Category :
Languages : en
Pages : 0
Book Description
Application of a Particle Augmented Mixed Lubrication Model to Chemical Mechanical Polishing
Journal of Tribology
Tribology for Scientists and Engineers
Author: Pradeep L. Menezes
Publisher: Springer Science & Business Media
ISBN: 146141945X
Category : Technology & Engineering
Languages : en
Pages : 940
Book Description
This book describes available tribology technologies and introdces a comprehensive overview of tribology. General, up-to-date knowledge on how tribology is approached in various related areas of research, both experimental and computational is provided.
Publisher: Springer Science & Business Media
ISBN: 146141945X
Category : Technology & Engineering
Languages : en
Pages : 940
Book Description
This book describes available tribology technologies and introdces a comprehensive overview of tribology. General, up-to-date knowledge on how tribology is approached in various related areas of research, both experimental and computational is provided.
Proceedings of the ASME Tribology Division
Author:
Publisher:
ISBN:
Category : Lubrication and lubricants
Languages : en
Pages : 332
Book Description
Publisher:
ISBN:
Category : Lubrication and lubricants
Languages : en
Pages : 332
Book Description
Proceedings of the ASME Tribology Division--2005
Author:
Publisher: American Society of Mechanical Engineers
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 322
Book Description
Publisher: American Society of Mechanical Engineers
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 322
Book Description
Aqueous Lubrication: Natural And Biomimetic Approaches
Author: Nicholas D Spencer
Publisher: World Scientific
ISBN: 9814611808
Category : Medical
Languages : en
Pages : 285
Book Description
Man lubricates mostly with oil. Nature lubricates exclusively with water. Pure water is a poor lubricant, but the addition of proteins, especially glycoproteins, can modify surfaces to make them far more lubricating at slow speeds. Understanding how nature does this, and the physical structures involved, is not only important for the understanding of diseases such as osteoarthritis, but also essential for the successful application of articulating implants, such as hips and knees, as well as the development of medical devices such as catheters and contact lenses. A host of important applications of water-based lubrication are already in place in the personal care and food industries, and further industrial applications of water-based lubrication could have a significant positive impact on the environment.This book is the first of its kind. It brings together the latest research in biological and biomimetic, water-based lubrication and is authored by the world's experts in the field.
Publisher: World Scientific
ISBN: 9814611808
Category : Medical
Languages : en
Pages : 285
Book Description
Man lubricates mostly with oil. Nature lubricates exclusively with water. Pure water is a poor lubricant, but the addition of proteins, especially glycoproteins, can modify surfaces to make them far more lubricating at slow speeds. Understanding how nature does this, and the physical structures involved, is not only important for the understanding of diseases such as osteoarthritis, but also essential for the successful application of articulating implants, such as hips and knees, as well as the development of medical devices such as catheters and contact lenses. A host of important applications of water-based lubrication are already in place in the personal care and food industries, and further industrial applications of water-based lubrication could have a significant positive impact on the environment.This book is the first of its kind. It brings together the latest research in biological and biomimetic, water-based lubrication and is authored by the world's experts in the field.
Applied Mechanics Reviews
Metals Abstracts
Chemical Mechanical Planarization of Microelectronic Materials
Author: Joseph M. Steigerwald
Publisher: John Wiley & Sons
ISBN: 3527617752
Category : Science
Languages : en
Pages : 337
Book Description
Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.
Publisher: John Wiley & Sons
ISBN: 3527617752
Category : Science
Languages : en
Pages : 337
Book Description
Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.
Scientific and Technical Aerospace Reports
Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 960
Book Description
Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 960
Book Description
Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.