Author: Publisher:
ISBN:
Category : Electric connectors
Languages : en
Pages :
Book Description
Annual Connectors and Interconnection Technology Symposium Proceedings
Author: Annual Connector & Interconnection Technology Symposium
Author: Fifteenth Annual Connectors and Interconnections Symposium Proceedings, Nov. 1 and 2, 1982, Franklin Plaza Hotel, Philadelphia, Pa
Author: The Communications Handbook
Author: Jerry D. GibsonPublisher: CRC Press
ISBN: 1420041169
Category : Technology & Engineering
Languages : en
Pages : 1611
Book Description
For more than six years, The Communications Handbook stood as the definitive, one-stop reference for the entire field. With new chapters and extensive revisions that reflect recent technological advances, the second edition is now poised to take its place on the desks of engineers, researchers, and students around the world. From fundamental theory to state-of-the-art applications, The Communications Handbook covers more areas of specialty with greater depth that any other handbook available. Telephony Communication networks Optical communications Satellite communications Wireless communications Source compression Data recording Expertly written, skillfully presented, and masterfully compiled, The Communications Handbook provides a perfect balance of essential information, background material, technical details, and international telecommunications standards. Whether you design, implement, buy, or sell communications systems, components, or services, you'll find this to be the one resource you can turn to for fast, reliable, answers.
New Serial Titles
Author: Publisher:
ISBN:
Category : Periodicals
Languages : en
Pages : 1748
Book Description
A union list of serials commencing publication after Dec. 31, 1949.
Electrical Contacts
Author: Paul G. SladePublisher: CRC Press
ISBN: 9780824719340
Category : Technology & Engineering
Languages : en
Pages : 1116
Book Description
Covering the choice, attachment, and testing of contact materials, Electrical Contacts introduces a thorough discussion on making electric contact and contact interface conduction, presents a general outline of, and measurement techniques for, important corrosion mechanisms, discusses the results of contact wear when plug-in connections are made and broken, investigates the effect of thin noble metal plating on electronic connections, relates crucial considerations for making high- and low-power contact joints, details arcing effects on contacts including contact erosion, welding, and contamination, and contains nearly 2800 references, tables, equations, drawings, and photographs.
Microelectronics Packaging Handbook
Author: Rao TummalaPublisher: Springer Science & Business Media
ISBN: 9780412084515
Category : Computers
Languages : en
Pages : 662
Book Description
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
NIST Monograph
Author: Fiber Optic Connectors
Author: IGIC, Inc. StaffPublisher: Information Gatekeepers Inc
ISBN: 9781568510682
Category : Technology & Engineering
Languages : en
Pages : 560
Book Description
Composite Materials
Author: Deborah D.L. ChungPublisher: Springer Science & Business Media
ISBN: 1447137329
Category : Technology & Engineering
Languages : en
Pages : 297
Book Description
Composite Materials is a modern reference book, tutorial in style, covering functions of composites relating to applications in electronic packaging, thermal management, smart structures and other timely technologies rarely covered in existing books on composites. It also treats materials with polymer, metal, cement, carbon and ceramics matrices, contrasting with others that emphasise polymer-matrix composites. This functional approach will be useful to both practitioners and students. A good selection of example problems, solutions and figures, together with a new and vibrant approach, provides a valuable reference source for all engineers working with composite materials.