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Author: Fengyuan Sun Publisher: Editions Publibook ISBN: 2753903298 Category : Languages : en Pages : 178
Book Description
The proposal of doubling the number of transistors on an IC chip (with minimum costs and subtle innovations) every 24 months by Gordon Moore in 1965 (the so-called called Moore's law) has been the most powerful driver for the emphasis of the microelectronics industry in the past 50 years. This law enhances lithography scaling and integration, in 2D, of all functions on a single chip, increasingly through system-on-chip (SOC). On the other hand, the integration of all these functions can be achieved through 3D integrations . Generally speaking, 3D integration consists of 3D IC packaging, 3D IC integration, and 3D Si integration. They are different and mostly the TSV (through-silicon via) separates 3D IC packaging from 3D IC/Si integrations since the latter two uses TSVs, but 3D IC packaging does not. TSV (with a new concept that every chip or interposer could have two surfaces with circuits) is the heart of 3D IC/Si integrations. Continued technology scaling together with the integration of disparate technologies in a single chip means that device performance continues to outstrip interconnect and packaging capabilities, and hence there exist many difficult engineering challenges, most notably in power management, noise isolation, and intra and inter-chip communication. 3D Si integration is the right way to go and compete with Moore's law (more than Moore versus more Moore). However, it is still a long way to go. In this book, Fengyuan SUN proposes new substrate network extraction techniques. Using this latter, the substrate coupling and loss in IC's can be analyzed. He implements some Green/TLM (Transmission Line Matrix) algorithms in MATLAB. It permits to extract impedances between any number of embedded contacts or/and TSVS. He does investigate models of high aspect ratio TSV, on both analytical and numerical methods electromagnetic simulations. This model enables to extract substrate and TSV impedance, S parameters and parasitic elements, considering the variable resistivity of the substrate. It is full compatible with SPICE-like solvers and should allow an investigation in depth of TSV impact on circuit performance.
Author: Fengyuan Sun Publisher: Editions Publibook ISBN: 2753903298 Category : Languages : en Pages : 178
Book Description
The proposal of doubling the number of transistors on an IC chip (with minimum costs and subtle innovations) every 24 months by Gordon Moore in 1965 (the so-called called Moore's law) has been the most powerful driver for the emphasis of the microelectronics industry in the past 50 years. This law enhances lithography scaling and integration, in 2D, of all functions on a single chip, increasingly through system-on-chip (SOC). On the other hand, the integration of all these functions can be achieved through 3D integrations . Generally speaking, 3D integration consists of 3D IC packaging, 3D IC integration, and 3D Si integration. They are different and mostly the TSV (through-silicon via) separates 3D IC packaging from 3D IC/Si integrations since the latter two uses TSVs, but 3D IC packaging does not. TSV (with a new concept that every chip or interposer could have two surfaces with circuits) is the heart of 3D IC/Si integrations. Continued technology scaling together with the integration of disparate technologies in a single chip means that device performance continues to outstrip interconnect and packaging capabilities, and hence there exist many difficult engineering challenges, most notably in power management, noise isolation, and intra and inter-chip communication. 3D Si integration is the right way to go and compete with Moore's law (more than Moore versus more Moore). However, it is still a long way to go. In this book, Fengyuan SUN proposes new substrate network extraction techniques. Using this latter, the substrate coupling and loss in IC's can be analyzed. He implements some Green/TLM (Transmission Line Matrix) algorithms in MATLAB. It permits to extract impedances between any number of embedded contacts or/and TSVS. He does investigate models of high aspect ratio TSV, on both analytical and numerical methods electromagnetic simulations. This model enables to extract substrate and TSV impedance, S parameters and parasitic elements, considering the variable resistivity of the substrate. It is full compatible with SPICE-like solvers and should allow an investigation in depth of TSV impact on circuit performance.
Author: Centre national de la recherche scientifique (France). Recherche coopérative sur programme no 567 Publisher: ISBN: Category : Control theory Languages : fr Pages : 928
Author: Roderic S. Lakes Publisher: CRC Press ISBN: 1351355643 Category : Technology & Engineering Languages : en Pages : 476
Book Description
Viscoelastic Solids covers the mathematical theory of viscoelasticity and physical insights, causal mechanisms, and practical applications. The book: presents a development of the theory, addressing both transient and dynamic aspects as well as emphasizing linear viscoelasticity synthesizes the structure of the theory with the aim of developing physical insight illustrates the methods for the solution of stress analysis problems in viscoelastic objects explores experimental methods for the characterization of viscoelastic materials describes the phenomenology of viscoelasticity in a variety of materials, including polymers, metals, high damping alloys, rock, piezoelectric materials, cellular solids, dense composite materials, and biological materials analyzes high damping and extremely low damping provides the theory of viscoelastic composite materials, including examples of various types of structure and the relationships between structure and mechanical properties contains examples on the use of viscoelastic materials in preventing and alleviating human suffering Viscoelastic Solids also demonstrates the use of viscoelasticity for diverse applications, such as earplugs, gaskets, computer disks, satellite stability, medical diagnosis, injury prevention, vibration abatement, tire performance, sports, spacecraft explosions, and music.
Author: Petar Djuric Publisher: Academic Press ISBN: 0128136782 Category : Computers Languages : en Pages : 868
Book Description
Cooperative and Graph Signal Processing: Principles and Applications presents the fundamentals of signal processing over networks and the latest advances in graph signal processing. A range of key concepts are clearly explained, including learning, adaptation, optimization, control, inference and machine learning. Building on the principles of these areas, the book then shows how they are relevant to understanding distributed communication, networking and sensing and social networks. Finally, the book shows how the principles are applied to a range of applications, such as Big data, Media and video, Smart grids, Internet of Things, Wireless health and Neuroscience. With this book readers will learn the basics of adaptation and learning in networks, the essentials of detection, estimation and filtering, Bayesian inference in networks, optimization and control, machine learning, signal processing on graphs, signal processing for distributed communication, social networks from the perspective of flow of information, and how to apply signal processing methods in distributed settings. - Presents the first book on cooperative signal processing and graph signal processing - Provides a range of applications and application areas that are thoroughly covered - Includes an editor in chief and associate editor from the IEEE Transactions on Signal Processing and Information Processing over Networks who have recruited top contributors for the book
Author: Claude Cohen-Tannoudji Publisher: John Wiley & Sons ISBN: 3527345558 Category : Science Languages : en Pages : 790
Book Description
This new, third volume of Cohen-Tannoudji's groundbreaking textbook covers advanced topics of quantum mechanics such as uncorrelated and correlated identical particles, the quantum theory of the electromagnetic field, absorption, emission and scattering of photons by atoms, and quantum entanglement. Written in a didactically unrivalled manner, the textbook explains the fundamental concepts in seven chapters which are elaborated in accompanying complements that provide more detailed discussions, examples and applications. * Completing the success story: the third and final volume of the quantum mechanics textbook written by 1997 Nobel laureate Claude Cohen-Tannoudji and his colleagues Bernard Diu and Franck Laloë * As easily comprehensible as possible: all steps of the physical background and its mathematical representation are spelled out explicitly * Comprehensive: in addition to the fundamentals themselves, the books comes with a wealth of elaborately explained examples and applications Claude Cohen-Tannoudji was a researcher at the Kastler-Brossel laboratory of the Ecole Normale Supérieure in Paris where he also studied and received his PhD in 1962. In 1973 he became Professor of atomic and molecular physics at the Collège des France. His main research interests were optical pumping, quantum optics and atom-photon interactions. In 1997, Claude Cohen-Tannoudji, together with Steven Chu and William D. Phillips, was awarded the Nobel Prize in Physics for his research on laser cooling and trapping of neutral atoms. Bernard Diu was Professor at the Denis Diderot University (Paris VII). He was engaged in research at the Laboratory of Theoretical Physics and High Energy where his focus was on strong interactions physics and statistical mechanics. Franck Laloë was a researcher at the Kastler-Brossel laboratory of the Ecole Normale Supérieure in Paris. His first assignment was with the University of Paris VI before he was appointed to the CNRS, the French National Research Center. His research was focused on optical pumping, statistical mechanics of quantum gases, musical acoustics and the foundations of quantum mechanics.
Author: Cetin Kaya Koc Publisher: Springer Science & Business Media ISBN: 0387718176 Category : Technology & Engineering Languages : en Pages : 528
Book Description
This book is for engineers and researchers working in the embedded hardware industry. This book addresses the design aspects of cryptographic hardware and embedded software. The authors provide tutorial-type material for professional engineers and computer information specialists.
Author: Alexandre Sanfelice Bazanella Publisher: Springer Science & Business Media ISBN: 9400723008 Category : Technology & Engineering Languages : en Pages : 222
Book Description
Data-Based Controller Design presents a comprehensive analysis of data-based control design. It brings together the different data-based design methods that have been presented in the literature since the late 1990’s. To the best knowledge of the author, these data-based design methods have never been collected in a single text, analyzed in depth or compared to each other, and this severely limits their widespread application. In this book these methods will be presented under a common theoretical framework, which fits also a large family of adaptive control methods: the MRAC (Model Reference Adaptive Control) methods. This common theoretical framework has been developed and presented very recently. The book is primarily intended for PhD students and researchers - senior or junior - in control systems. It should serve as teaching material for data-based and adaptive control courses at the graduate level, as well as for reference material for PhD theses. It should also be useful for advanced engineers willing to apply data-based design. As a matter of fact, the concepts in this book are being used, under the author’s supervision, for developing new software products in a automation company. The book will present simulation examples along the text. Practical applications of the concepts and methodologies will be presented in a specific chapter.
Author: Fengyuan Sun
Author: Fengyuan Sun
Author: Electre
Author: Centre national de la recherche scientifique (France). Recherche coopérative sur programme no 567
Author: International Association for Analog Computation
Author: Roderic S. Lakes
Author: Petar Djuric
Author: 
Author: Claude Cohen-Tannoudji
Author: Cetin Kaya Koc
Author: Alexandre Sanfelice Bazanella