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Author: J. Paul Guyer, P.E., R.A. Publisher: Guyer Partners ISBN: Category : Technology & Engineering Languages : en Pages : 51
Book Description
Introductory technical guidance for electrical engineers and construction managers interested in electrical design of electronic equipment buildings. Here is what is discussed: 1. DEFINITION OF BONDING, 2. PURPOSES OF BONDING, 3. RESISTANCE CRITERIA, 4. DIRECT BONDS, 5. INDIRECT BONDS, 6. SURFACE PREPARATION, 7. COMPLETION OF THE BOND, 8. BOND CORROSION, 9. WORKMANSHIP, 10. SUMMARY OF GUIDELINES.
Author: J. Paul Guyer, P.E., R.A. Publisher: Guyer Partners ISBN: Category : Technology & Engineering Languages : en Pages : 51
Book Description
Introductory technical guidance for electrical engineers and construction managers interested in electrical design of electronic equipment buildings. Here is what is discussed: 1. DEFINITION OF BONDING, 2. PURPOSES OF BONDING, 3. RESISTANCE CRITERIA, 4. DIRECT BONDS, 5. INDIRECT BONDS, 6. SURFACE PREPARATION, 7. COMPLETION OF THE BOND, 8. BOND CORROSION, 9. WORKMANSHIP, 10. SUMMARY OF GUIDELINES.
Author: Anders Nilsson Publisher: Elsevier ISBN: 0080551912 Category : Science Languages : en Pages : 533
Book Description
Molecular surface science has made enormous progress in the past 30 years. The development can be characterized by a revolution in fundamental knowledge obtained from simple model systems and by an explosion in the number of experimental techniques. The last 10 years has seen an equally rapid development of quantum mechanical modeling of surface processes using Density Functional Theory (DFT). Chemical Bonding at Surfaces and Interfaces focuses on phenomena and concepts rather than on experimental or theoretical techniques. The aim is to provide the common basis for describing the interaction of atoms and molecules with surfaces and this to be used very broadly in science and technology. The book begins with an overview of structural information on surface adsorbates and discusses the structure of a number of important chemisorption systems. Chapter 2 describes in detail the chemical bond between atoms or molecules and a metal surface in the observed surface structures. A detailed description of experimental information on the dynamics of bond-formation and bond-breaking at surfaces make up Chapter 3. Followed by an in-depth analysis of aspects of heterogeneous catalysis based on the d-band model. In Chapter 5 adsorption and chemistry on the enormously important Si and Ge semiconductor surfaces are covered. In the remaining two Chapters the book moves on from solid-gas interfaces and looks at solid-liquid interface processes. In the final chapter an overview is given of the environmentally important chemical processes occurring on mineral and oxide surfaces in contact with water and electrolytes. - Gives examples of how modern theoretical DFT techniques can be used to design heterogeneous catalysts - This book suits the rapid introduction of methods and concepts from surface science into a broad range of scientific disciplines where the interaction between a solid and the surrounding gas or liquid phase is an essential component - Shows how insight into chemical bonding at surfaces can be applied to a range of scientific problems in heterogeneous catalysis, electrochemistry, environmental science and semiconductor processing - Provides both the fundamental perspective and an overview of chemical bonding in terms of structure, electronic structure and dynamics of bond rearrangements at surfaces
Author: J. Paul Guyer, P.E., R.A. Publisher: Guyer Partners ISBN: Category : Technology & Engineering Languages : en Pages : 30
Book Description
Introductory technical guidance for electrical engineers interested in electrical design for electronic equipment rooms and buildings such as data processing, computer operation and communication facilities. Here is what is discussed: 1. GENERAL 2. ELECTRICAL POWER REQUIREMENTS 3. LIGHTING SYSTEMS 4. GROUNDING. BONDING, AND SHIELDING 5. HEMP PROTECTION 6. ENERGY CONSERVATION 7. FIRE ALARM AND DETECTION SYSTEMS.
Author: Department of Department of Defense Publisher: ISBN: 9781986310178 Category : Languages : en Pages : 396
Book Description
MIL-HDBK-419A 29 DECEMBER 1987 Volume 2 of 2 Applications Unfortunately, few Military Handbooks address the need for defense against electromagnetic pulse (EMP) and cybersecurity. While EMP has been thought of as a remote possibility (who in his right mind is going to launch a nuclear weapon of any kind against the U.S.?) Advances in non-nuclear EMP, miniaturization of electronics and autonomous drones suddenly brings EMP into the role of the possible. No longer would an adversary need to risk retaliation when a drone from an unknown source attacks a vital facility. The information in this book is part of the solution to the question "How do we defend against EMP?" List of Applicable EMP and Cybersecurity Publications: MIL-STD-188-125-1 High-altitude electromagnetic pulse (HEMP) Protection For Ground-Based C4I Facilities Performing Critical, Time-Urgent Missions MIL-STD-188-124A Grounding, Bonding and Shielding for Common Long Haul/Tactical Communication Systems MIL-HDBK -1195 Radio Frequency Shielded Enclosures TOP 01-2-620 High-Altitude Electromagnetic Pulse (HEMP) Testing MIL-HDBK-1012/1 Electronic Facilities Engineering MIL-HDBK-1013/1A Design Guidelines for Physical Security of Facilities
Author: J. Paul Guyer, P.E., R.A. Publisher: Guyer Partners ISBN: Category : Technology & Engineering Languages : en Pages : 53
Book Description
Introductory technical guidance for electrical engineers and other professional engineers and construction managers interested in electromagnetic pulse protection for electronic equipment in buildings. Here is what is discussed: 1. INTRODUCTION. 2. EMP GENERATION, 3. HEMP INTERACTION WITH SYSTEMS, 4. PROTECTION AGAINST HEMP.
Author: J. Paul Guyer, P.E., R.A. Publisher: Guyer Partners ISBN: Category : Technology & Engineering Languages : en Pages : 287
Book Description
Introductory technical guidance for mechanical and electrical engineers and construction managers interested in design and construction of mechanical and electrical systems for hospitals and medical and dental clinics. Here is what is discussed: 1. ELECTRICAL SYSTEMS 2. COMMUNICATION SYSTEMS 3. FOOD SERVICE 4. HVAC SYSTEMS 5. PLUMBING AND GAS 6. MECHANICAL/ELECTRICAL EQUIPMENT SOUND DATA 7. TELECOMMUNICATION CABLING 8. HANDICAPPED ACCESSIBILITY - PLUMBING.
Author: J. Paul Guyer, P.E., R.A. Publisher: Guyer Partners ISBN: Category : Technology & Engineering Languages : en Pages : 365
Book Description
Introductory technical guidance for electrical engineers and construction managers interested in design and construction of electrical and communication systems for hospitals and medical clinics. Here is what is discussed: 1. ELECTRICAL SYSTEMS 2. COMMUNICATION SYSTEMS 3. EQUIPMENT SOUND DATA 4. TELECOMMUNICATIONS CABLING.
Author: J Paul Guyer Publisher: Independently Published ISBN: Category : Languages : en Pages : 56
Book Description
Introductory technical guidance for electrical engineers and construction managers interested in electrical design of electronic equipment buildings. Here is what is discussed: 1. DEFINITION OF BONDING, 2. PURPOSES OF BONDING, 3. RESISTANCE CRITERIA, 4. DIRECT BONDS, 5. INDIRECT BONDS, 6. SURFACE PREPARATION, 7. COMPLETION OF THE BOND, 8. BOND CORROSION, 9. WORKMANSHIP, 10. SUMMARY OF GUIDELINES.
Author: Anna Rudawska Publisher: Academic Press ISBN: 0128170115 Category : Technology & Engineering Languages : en Pages : 292
Book Description
Surface Treatment in Bonding Technology provides valuable advice on surface treatment methods, modern measuring devices, and the appropriate experimentation techniques that are essential to create strong joints with a reliable service life. The book's focus is on the detailed and up-to-date analysis of surface treatment methods for metallic and polymer substrates. An analysis of factors affecting the surface preparation stage, together with advice on selection, is also provided. Essential theory is combined with experimentation techniques and industry practice to provide a guide that is both practical and academically rigorous. Including a general introduction to bonding, as well as coverage of mechanical, chemical and electrochemical methods, this book is the ideal primer for anyone working with or researching adhesive bonding. - Provides detailed descriptions of surface treatments and their mechanisms that will help readers build a deep understanding of these fundamental techniques - Includes a thorough survey of recent advances in research in surface treatments of metals and polymers - Provides technical advice on experimental testing methods throughout the book
Author: Preeti S Chauhan Publisher: Springer Science & Business Media ISBN: 1461457610 Category : Technology & Engineering Languages : en Pages : 254
Book Description
This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.
Author: J. Paul Guyer, P.E., R.A.
Author: J. Paul Guyer, P.E., R.A.
Author: Anders Nilsson
Author: J. Paul Guyer, P.E., R.A.
Author: Department of Department of Defense
Author: J. Paul Guyer, P.E., R.A.
Author: J. Paul Guyer, P.E., R.A.
Author: J. Paul Guyer, P.E., R.A.
Author: J Paul Guyer
Author: Anna Rudawska
Author: Preeti S Chauhan