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Aluminum Nitride Thin Films for MEMS Resonators

Aluminum Nitride Thin Films for MEMS Resonators PDF Author: Vanni Lughi
Publisher:
ISBN: 9780542681318
Category :
Languages : en
Pages : 530

Book Description
High quality aluminum nitride films, meeting all the requirements for the fabrication of the resonators, were deposited at low temperature (

Aluminum Nitride Thin Films for MEMS Resonators

Aluminum Nitride Thin Films for MEMS Resonators PDF Author: Vanni Lughi
Publisher:
ISBN: 9780542681318
Category :
Languages : en
Pages : 530

Book Description
High quality aluminum nitride films, meeting all the requirements for the fabrication of the resonators, were deposited at low temperature (

Piezoelectric MEMS Resonators

Piezoelectric MEMS Resonators PDF Author: Harmeet Bhugra
Publisher: Springer
ISBN: 3319286889
Category : Technology & Engineering
Languages : en
Pages : 423

Book Description
This book introduces piezoelectric microelectromechanical (pMEMS) resonators to a broad audience by reviewing design techniques including use of finite element modeling, testing and qualification of resonators, and fabrication and large scale manufacturing techniques to help inspire future research and entrepreneurial activities in pMEMS. The authors discuss the most exciting developments in the area of materials and devices for the making of piezoelectric MEMS resonators, and offer direct examples of the technical challenges that need to be overcome in order to commercialize these types of devices. Some of the topics covered include: Widely-used piezoelectric materials, as well as materials in which there is emerging interest Principle of operation and design approaches for the making of flexural, contour-mode, thickness-mode, and shear-mode piezoelectric resonators, and examples of practical implementation of these devices Large scale manufacturing approaches, with a focus on the practical aspects associated with testing and qualification Examples of commercialization paths for piezoelectric MEMS resonators in the timing and the filter markets ...and more! The authors present industry and academic perspectives, making this book ideal for engineers, graduate students, and researchers.

DC Magnetron Reactive Sputtering of Low Stress AlN Piezoelectric Thin Films for MEMS Application

DC Magnetron Reactive Sputtering of Low Stress AlN Piezoelectric Thin Films for MEMS Application PDF Author: Peter Y. Hsieh
Publisher:
ISBN: 9781423552901
Category :
Languages : en
Pages : 61

Book Description
Microelectromechanical systems (MEMS) often incorporate piezoelectric thin films to actuate and detect motion of mechanical structures. Aluminum nitride is advantageous for MEMS use because it can be deposited at low temperatures, is easily patterned using conventional photo lithographic techniques, and is compatible with CMOS contaminant requirements for silicon IC foundries. In this work, AlN thin films were deposited on silicon for use in a MEMS ultrasonic resonator. The resonator is configured as a gravimetric chemical sensor. A rotatable central composite designed experiment was performed to optimize film properties affecting device performance: film crystallinity, stress, and uniformity. Film property response characterization was conducted with x-ray diffractometry, spectroscopic ellipsometry, and surface profilometry. Optimization of film deposition parameters improved AlN film properties in the MEMS sensors. Film property characterization using response surface methodology indicated microstructural changes due to sputtered particle bombardment of the growing film surface. Surface morphology of the sputtered AlN films was assessed using tapping mode atomic force microscopy and scanning electron microscopy. Energetic particle bombardment of the growing film surface helped to yield dense crystalline films with zone T microstructure. Thermalization of the impinging particle flux resulted in voided films with zone 1 microstructure with inferior film properties. Correlation between film crystallinity and oxygen content was explored with x-ray photoelectron spectrometry. Changes in film microstructure and composition are correlated with variations in deposition parameters. Adatom mobility during film growth appears to play an important role in determining final film properties.

Resonant MEMS

Resonant MEMS PDF Author: Oliver Brand
Publisher: John Wiley & Sons
ISBN: 3527335455
Category : Technology & Engineering
Languages : en
Pages : 512

Book Description
Part of the AMN book series, this book covers the principles, modeling and implementation as well as applications of resonant MEMS from a unified viewpoint. It starts out with the fundamental equations and phenomena that govern the behavior of resonant MEMS and then gives a detailed overview of their implementation in capacitive, piezoelectric, thermal and organic devices, complemented by chapters addressing the packaging of the devices and their stability. The last part of the book is devoted to the cutting-edge applications of resonant MEMS such as inertial, chemical and biosensors, fluid properties sensors, timing devices and energy harvesting systems.

MEMS Aluminum Nitride Technology for Inertial Sensors

MEMS Aluminum Nitride Technology for Inertial Sensors PDF Author: Gabriele Vigevani
Publisher:
ISBN:
Category :
Languages : en
Pages : 390

Book Description
The design and fabrication of MEMS Inertial Sensors (both accelerometers and gyroscopes) made of Aluminum Nitride (AlN) is described in this dissertation. The goal of this work is to design and fabricate inertial sensors based on c-axis oriented AlN polycrystalline thin films. AlN is a post-CMOS compatible piezoelectric material widely used for acoustic resonators, such Bulk Acoustic Wave (BAW) and Lamb Wave Resonators (LWR). In this work we develop the design techniques necessary to obtain inertial sensors with AlN thin film technology. Being able to use AlN as structural material for both acoustic wave resonator and sensing elements is key to achieve the three level integration of RF-MEMS components, sensing elements and CMOS in the same chip. Using AlN as integration platform is particularly suitable for large consumer emerging markets where production costs are the major factor that determine a product success. In order to achieve a platform integration, the first part of this work focuses on the fabrication process: starting from the fabrication technology used for LWR devices, this work shows that by slightly modifying some of the fabrication steps it is possible to obtain MEMS accelerometers and gyroscopes with the same structural layers used for LWR. In the second part of this work, an extensive analysis, performed with analytical and Finite Element Models (FEM), is developed for beam and ring based structures. These models are of great importance as they provide tools to understand the physics of lateral piezoelectric beam actuation and the major limitations of this technology. Based on the models developed for beam based resonators, we propose two designs for Double Ended Tuning Fork (DETF) based accelerometers. In the last part of the dissertation, we show the experimental results and the measurements performed on actual devices. As this work shows analytically and experimentally, there are some fundamental constraints that limit the ultimate sensitivity of piezoelectric sensors based on resonating beam structures. Although the limitations of the structures here considered cannot achieve tactical grade sensitivities, this research proves that it is possible to achieve performances close to those required by large consumer electronics. This work proves that AlN based platforms can be a great opportunity for future developments in IMU and in general for MEMS integrated solutions.

Piezoelectric Aluminum Nitride MEMS Resonators for RF Signal Processing

Piezoelectric Aluminum Nitride MEMS Resonators for RF Signal Processing PDF Author: Philip Jason Stephanou
Publisher:
ISBN:
Category :
Languages : en
Pages : 404

Book Description


Fundamentals of Nanomechanical Resonators

Fundamentals of Nanomechanical Resonators PDF Author: Silvan Schmid
Publisher: Springer Nature
ISBN: 3031296281
Category : Technology & Engineering
Languages : en
Pages : 215

Book Description
Now in an updated second edition, this classroom-tested textbook introduces and summarizes the latest models and skills required to design and optimize nanomechanical resonators, taking a top-down approach that uses macroscopic formulas to model the devices. The authors cover the electrical and mechanical aspects of nanoelectromechanical system (NEMS) devices in six expanded and revised chapters on lumped-element model resonators, continuum mechanical resonators, damping, transduction, responsivity, and measurements and noise. The applied approach found in this book is appropriate for engineering students and researchers working with micro and nanomechanical resonators.

3D and Circuit Integration of MEMS

3D and Circuit Integration of MEMS PDF Author: Masayoshi Esashi
Publisher: John Wiley & Sons
ISBN: 3527823255
Category : Technology & Engineering
Languages : en
Pages : 528

Book Description
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.

Aluminum Nitride Thin Films - Deposition for Fabrication, Characterization and Fabrication of Surface Acoustic Wave Devices

Aluminum Nitride Thin Films - Deposition for Fabrication, Characterization and Fabrication of Surface Acoustic Wave Devices PDF Author: Charlee Fansler
Publisher:
ISBN: 9783836469722
Category : Technology & Engineering
Languages : en
Pages : 124

Book Description
Aluminum Nitride (AlN) thin films can be used for many device applications; for example, Surface Acoustic Wave (SAW) devices, microelectromechanical systems (MEMS) applications, and packaging applications. In this work, AlN is the critical layer in the fabrication process. One challenge is reliable deposition over wafer size substrates. The method of interest for deposition is pulsed DC sputtering. The (002) plane is the desired plane for its piezoelectric properties. The surface roughness of the deposited AlN is low and adheres well to the substrate. An AlN layer was deposited on a UNCD/Si substrate. Al was deposited on the AlN layer to form the IDTs (interdigital transducers) for SAW devices. SAW devices were fabricated on quartz - ST substrate. To verify the SAW devices work, they were tested using a network analyzer. This book discusses these results and parameters for AlN film deposition, film properties and implications for devices. This book would be beneficial for professionals, scientists, engineers, and graduate students in science and engineering working in the areas of wide bandgap semi-conductors, nitrides and piezoelectric materials and various acoustic wave devices.

Future Medical Engineering Based on Bionanotechnology

Future Medical Engineering Based on Bionanotechnology PDF Author: Masayoshi Esashi
Publisher: Imperial College Press
ISBN: 1860948804
Category : Technology & Engineering
Languages : en
Pages : 1140

Book Description
Combining engineering and medicine research projects with biological applications, the contributions in this volume constitute the efforts of both distinguished scientists and young investigators in various fields of biomedical engineering at Tohoku University, one of Japan''s leading scientific research universities. The Tohoku University 21st Century COE Program OC Future Medical Engineering Based on BionanotechnologyOCO is OCo out of 113 programmes chosen by the Ministry of Education, Culture, Sports, Science and Technology in 2002 OCo the only one program devoted to biomedical engineering. This book comprises the proceedings of the final closing symposium to be held in January 2007, and summarizes all the efforts of the program in a comprehensive manner. In total, more than 100 authors from the engineering and medical schools of Tohoku University have contributed to this volume, through which readers can understand all the research results carried out under the umbrella of the program. Sample Chapter(s). Chapter 1: An Electrochemical Microsystem for Manipulating Living Cells (910 KB). Contents: Cellular Function and Molecular Operation: Progress of Our Research in Auditory Mechnaics (H Wada); Generation of Stable Chinese Hamster Ovary Cell Lines Expressing the Motor Protein Prestin (K Iida et al.); Protection of Outer Hair Cells from Traumatic Noise by Conditioning with Heat Stress (M Murakoshi et al.); Time-Lapse Observation of Neural Epithelium Cell Behavior in Slice Culture (N Nakamura et al.); Nano-Medicine: Development of Novel Medical Engineering Using Micro-Nanomachining (M Esashi); Biomimetic Artificial Myocardium Using Nano Technology (T Yambe); MEMS-Based Fuel Cell for Portable Medical Applications (K-B Min et al.); Lithium Niobate Bulk Micromachining for Medical Sensors (A Randles et al.); Imaging of the Biological Molecule and Structure: Brain Imaging of Quality of Life Using Positron Emission Tomography (M Itoh & M Tashiro); Human Brain Metabolic Changes Induced by Actual Car-Driving (M Jeong et al.); Automatic Medical Image Registration Using Mutual Information (K Kumagai et al.); The Comparison of Brain Structure Between Exercised and Non-Exercised Students (H Sensui et al.); Medical Informatics: Computational Approaches to Hemodynamics Analysis from Micro to Macro Scales (T Yamaguchi); A Fluid-Solid Interaction Study of the Pulse Wave Velocity in Uniform Arteries (T Fukui et al.); CFD Tools in Engineering Design Studies and Medical Sciences (P S Kulkarni); Evaluation of an Index for Cardiac Function During Assitance with a Rotary Blood Pump (D Ogawa et al.); and other papers. Readership: Postgraduate students and researchers in biomedical engineering."