Advances in Slurry Technology PDF Download

Author: Trevor Frank Jones
Publisher: BoD – Books on Demand
ISBN: 180356668X
Category : Science
Languages : en
Pages : 232

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Book Description
Written by experts from around the world, this book presents a comprehensive overview of slurry technology. The editor is grounded in the science of dilute concentrations of coarse particles in horizontal ducts, including settling distributions, critical deposition, swirling flow, and the two-layer model. This volume includes ten chapters that address such topics as process modelling, measurement (including non-Newtonian rheology), high-concentration conveying, vertical transport of fine-particle slurries, rheometry of sludges, pipe wear, and wastewater applications. There is also a chapter on an application at the fringe of our subject: fluidisation.

Author: Robert Visintainer
Publisher: Springer Nature
ISBN: 3031254406
Category : Science
Languages : en
Pages : 494

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Book Description
This book is based on the industry leading short course of the same name hosted by the GIW Industries Hydraulic Laboratory and founded by Dr. Roland Clift and Graeme Addie, who together with Dr. Ken Wilson continued its development and authored the first edition of this textbook. This fourth edition has been extensively updated by the international team of engineers and authors who inherited this legacy and continue its development to the present day. Focusing on the hydraulic design of slurry pipelines, the pumps that power them, and the interactions between pumps and systems, it retains the classroom tested balance of theoretical development and practical engineering which have made it a slurry transport classic. The topics covered are important to slurry system engineers for the optimization of new designs, as well as the operators of existing systems, who may need to calculate and plan for changing conditions from day to day. Updates to the fourth edition include: · Careful formulation of the theoretical concepts, providing greater clarity of slurry flow dynamics, including a new chapter on the principles and characterization of slurry flows. · Expansion of the 4-Component Models for settling slurry pipeline flow and pump solids effect, based on an extensive series of full-sized tests. · An expanded treatment of complex slurries, including a broader discussion of non-Newtonian fluids and their interaction with coarse particles. · A new chapter on test methods, presenting an overview of slurry system instrumentation, modern techniques for characterizing slurry rheology, and practical advice for planning and executing a slurry test. · An overview of advances in the computational modeling of slurries, including an in-depth parametric study of slurry pump wear and operating cost. The authors highlight methods for achieving energy efficiency, which are crucial to the effective use of scarce resources, given the foundational role of slurry transport systems in the energy intensive industries of mining and dredging. Key concepts are supported with case studies and worked examples. Slurry Transport Using Centrifugal Pumps, fourth edition, is both methodical and in-depth. It is ideal as a teaching tool for classroom or self-directed learning domains, and valuable as a design guide for engineer practitioners at all experience levels.

Author: Iraj Zandi
Publisher: Elsevier
ISBN: 1483151298
Category : Technology & Engineering
Languages : en
Pages : 323

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Book Description
Advances in Solid-Liquid Flow in Pipes and its Application focuses on solid-liquid interactions. The selection first takes a look at hydraulic transport of bulky materials and role of lift in the radial migration of particles in a pipe flow. Topics include the technological and economical considerations of transporting materials; lift model and the equations of motion; coefficients of lift and drag; and calculated behavior of particles in a pipe flow. The book then discusses particle and fluid velocities of turbulent flows of suspensions of neutrally buoyant particles; phase-separation phenomena in iso-density, two-phase flows; and transient flow of solid-liquid mixtures in pipes. The text discusses pipeline transportation of coke in petroleum products, including slurry components, hydraulic tests, and hydraulic characteristics of slurry. The book then evaluates the use of heavy media in the pipeline transport of particulate solids. Comparison of pressure gradients and equipment and experimental procedures are highlighted. The selection is a valuable reference for readers interested in solid-liquid interactions.

Author: Yoshio Nishi
Publisher: Elsevier
ISBN: 0857098098
Category : Computers
Languages : en
Pages : 456

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Book Description
New solutions are needed for future scaling down of nonvolatile memory. Advances in Non-volatile Memory and Storage Technology provides an overview of developing technologies and explores their strengths and weaknesses. After an overview of the current market, part one introduces improvements in flash technologies, including developments in 3D NAND flash technologies and flash memory for ultra-high density storage devices. Part two looks at the advantages of designing phase change memory and resistive random access memory technologies. It looks in particular at the fabrication, properties, and performance of nanowire phase change memory technologies. Later chapters also consider modeling of both metal oxide and resistive random access memory switching mechanisms, as well as conductive bridge random access memory technologies. Finally, part three looks to the future of alternative technologies. The areas covered include molecular, polymer, and hybrid organic memory devices, and a variety of random access memory devices such as nano-electromechanical, ferroelectric, and spin-transfer-torque magnetoresistive devices. Advances in Non-volatile Memory and Storage Technology is a key resource for postgraduate students and academic researchers in physics, materials science, and electrical engineering. It is a valuable tool for research and development managers concerned with electronics, semiconductors, nanotechnology, solid-state memories, magnetic materials, organic materials, and portable electronic devices. Provides an overview of developing nonvolatile memory and storage technologies and explores their strengths and weaknesses Examines improvements to flash technology, charge trapping, and resistive random access memory Discusses emerging devices such as those based on polymer and molecular electronics, and nanoelectromechanical random access memory (RAM)

Author: Toshiro Doi
Publisher: William Andrew
ISBN: 1437778593
Category : Science
Languages : en
Pages : 330

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Book Description
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan

Author: Tatsuki Ohji
Publisher: John Wiley & Sons
ISBN: 1119321700
Category : Technology & Engineering
Languages : en
Pages : 128

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Book Description
This issue contains 9 papers from The American Ceramic Society’s 40th International Conference on Advanced Ceramics and Composites, held in Daytona Beach, Florida, January 24-29, 2016. This issue includes papers presented in the 10th International Symposium on Advanced Processing and Manufacturing Technologies for Structural and Multifunctional Materials and Systems (Symposium 8), Additive Manufacturing and 3D Printing Technologies (Focused Session 4), and Field Assisted Sintering (Focused Session 5).

Author: Tatsuki Ohji
Publisher: John Wiley & Sons
ISBN: 9780470456217
Category : Technology & Engineering
Languages : en
Pages : 249

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Book Description
This volume provides a one-stop resource, compiling current research on advanced processing and manufacturing technologies for structural and multifunctional materials. It is a collection of papers from The American Ceramic Society s 32nd International Conference on Advanced Ceramics and Composites, January 27-February 1, 2008. Topics include advanced processing and manufacturing technologies for a wide variety of non-oxide and oxide based structural ceramics, ultra-high temperature ceramics and composites, particulate and fiber reinforced composites, and multifunctional materials. This is a valuable, up-to-date resource for researchers in the field.

Author: Tatsuki Ohji
Publisher: John Wiley & Sons
ISBN: 1119211689
Category : Technology & Engineering
Languages : en
Pages : 187

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Book Description
The Ceramic Engineering and Science Proceeding has been published by The American Ceramic Society since 1980. This series contains a collection of papers dealing with issues in both traditional ceramics (i.e., glass, whitewares, refractories, and porcelain enamel) and advanced ceramics. Topics covered in the area of advanced ceramic include bioceramics, nanomaterials, composites, solid oxide fuel cells, mechanical properties and structural design, advanced ceramic coatings, ceramic armor, porous ceramics, and more.

Author: Yunn-Shiuan Liao
Publisher: Trans Tech Publications Ltd
ISBN: 303813399X
Category : Technology & Engineering
Languages : en
Pages : 1050

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Book Description
Volume is indexed by Thomson Reuters CPCI-S (WoS). Abrasive machining is one of the oldest technologies, and continues to have a far-reaching impact on a broad spectrum of industries. In particular, there is an ever-increasing demand by modern manufacturing for advanced abrasive techniques and other precision machining technologies. As well as abrasive-related technologies, electrical discharge machining (EDM), glass molding, machine tool systems, green manufacturing, laser-beam machining, tribology, advanced cutting methods, etc. are addressed here. The more than 167 presentations contributed by workers from all over the world will make this volume essential reading.

Author: Babu Suryadevara
Publisher: Woodhead Publishing
ISBN: 0128218193
Category : Technology & Engineering
Languages : en
Pages : 650

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Book Description
Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP