Author: Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 730
Book Description
Advanced Metallization Conference in ...
Author: Advanced Metallization Conference 1999 (AMC 1999): Volume 15
Author: Mihal E. GrossPublisher: Mrs Conference Proceedings
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 806
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Advanced Metallization Conference 2004 (AMC 2004)
Author: Darrell ErbPublisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 922
Book Description
2016 IEEE International Interconnect Technology Conference/Advanced Metallization Conference (IITC/AMC)
Author: Publisher:
ISBN: 9781509003860
Category : Interconnects (Integrated circuit technology)
Languages : en
Pages :
Book Description
Advanced Metallization Conference 2002 (AMC 2002)
Author: Advanced Metallization Conference in 1998 (AMC 1998): Volume 14
Author: Gurtej S. SandhuPublisher: Materials Research Society
ISBN: 9781558994843
Category : Technology & Engineering
Languages : en
Pages : 0
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Advanced Metallization Conference 2008 (AMC 2008):
Author: Mehul NaikPublisher: Materials Research Society
ISBN: 9781605111254
Category : Technology & Engineering
Languages : en
Pages : 769
Book Description
The Advanced Metallization Conference - held in San Diego, California, and Tokyo, Japan - marked its 25th anniversary in 2008. These two sister conferences form a unique 'one conference at two sites' that focuses on the latest R&D and manufacturing results, as well as real-world integration and reliability data on the application of metallization and related technologies for advanced IC devices. Scientists and engineers from around the world came to listen and present state-of-the-art work in the field of ULSI interconnect technology including metallization, dielectrics, integration, packaging, design and vertical integration. A keynote address by Gary Patton, vice president, IBM Systems and Technology Group, on 'Leading-edge Silicon Technology through Innovation and Collaboration', is featured. Additional topics include: integration; metallization; materials and characterization; CMP and cleaning; 3D integration and packaging; low-k materials; and reliability and yield.
Advanced Metallization Conference 2007 (AMC 2007): Volume 23
Author: Andrew J. McKerrowPublisher: Materials Research Society
ISBN: 9781558999923
Category : Technology & Engineering
Languages : en
Pages : 0
Book Description
The Advanced Metallization Conference - held in Albany, New York, and Tokyo, Japan - marked its 24th anniversary in 2007. These two sister conferences form a unique "one conference at two sites" that focuses on latest R&D and manufacturing results, as well as real-world integration and reliability data on the application of metallization and related technologies for advanced IC devices. Scientists and engineers from around the world came to listen and present state-of-the-art work in the field of ULSI interconnect technology including metallization, dielectrics, integration, packaging, design and vertical integration. Great progress has been made in ULSI metallization, but new challenges in performance, reliability and integration are expected as dimension continues to shrink. The importance of continued basic research in nanoscience and technology, using either metal wires or new materials such as carbon nanotubes, was declared key to the future of ULSI interconnects.
Advanced Metallization Conference 2003
Author: 与洋·太田Advanced Metallization Conference 2011
Author: Publisher:
ISBN: 9781618394262
Category : Metallic films
Languages : en
Pages : 142
Book Description