Author: W. T. Matzen
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 250
Book Description
Advanced Fabrication Processes for Functional Electronic Blocks ; Final Report Part 2, Period Covering : Oct. 1962-Apr. 1965
Author: W. T. Matzen
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 250
Book Description
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 250
Book Description
Advanced Fabrication Processes for Functional Electronic Blocks ; Final Report Part 1, Period Covering : Oct. 1962-Apr. 1965
Author: W. T. Matzen
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 115
Book Description
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 115
Book Description
Advanced Fabrication Processes for Functional Electronic Blocks ; Final Report, Period Covering : Dec. 1963 to April 1965
Author: W. T. Matzen
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 115
Book Description
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 115
Book Description
Advanced Fabrication Processes for Functional Electronic Blocks ; First Interim Report Covering Period 2 December 1963 to 1 March 1964
Author: W. T. Matzen
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 72
Book Description
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 72
Book Description
Advanced Fabrication Processes for Functional Electronic Blocks ; Interim Engineering Report No. 4, Period Covering : 2 Sept. 1964-2 Dec. 1964
Author: W. T. Matzen
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 68
Book Description
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 68
Book Description
Advanced Fabrication Processes for Functional Electronic Blocks ; 3rd Interim Engineering Report
Author: W. T. Matzen
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 65
Book Description
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 65
Book Description
Advanced Fabrication Processes for Functional Electronic Blocks
Author: W. T. Matzen
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 81
Book Description
A study of the exponential voltage-current behavior of a certain reverse biased NPN transistor was initiated. Investigations of the silicon adaptive element were continued. Emphasis shifted from an optical to a thermal adaptive element. Design of the thermally stabilized dc amplifier is progressing. Device evaluation and design refinements are included. Development of an RC active filter for use as a bandpass amplifier is continuing. Performance tests of breadboard models were made and data is presented. Preliminary design work was completed for a 40 cps thermal oscillator. A high input impedance audio amplifier was designed. Performance tests of a breadboard model were made and photomasks for the integrated circuits are in process. (Author).
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 81
Book Description
A study of the exponential voltage-current behavior of a certain reverse biased NPN transistor was initiated. Investigations of the silicon adaptive element were continued. Emphasis shifted from an optical to a thermal adaptive element. Design of the thermally stabilized dc amplifier is progressing. Device evaluation and design refinements are included. Development of an RC active filter for use as a bandpass amplifier is continuing. Performance tests of breadboard models were made and data is presented. Preliminary design work was completed for a 40 cps thermal oscillator. A high input impedance audio amplifier was designed. Performance tests of a breadboard model were made and photomasks for the integrated circuits are in process. (Author).
Advanced Fabrication Process for Functional Electronic Blocks
Author: W. T. MATZEN
Publisher:
ISBN:
Category :
Languages : en
Pages : 73
Book Description
Studies of the silicon adaptive element were continued. Primary effort has been toward the development of transparent conductive contacts. A study of the Seeback effect for application as a thermal sensor in thermal-electrical FEB's was initiated. Theoretical and experimental analyses are included. Design of the TemperatureStabilized Substrate was completed and devices are in process. Development of the thermal-feedback video amplifier was completed. Performance data is presented. Investigations of an RC active filter for use as a bandpass amplifier are continuing. Detailed design criteria are presented along with experimental results for both breadboard and integrated versions of the amplifier. (Author).
Publisher:
ISBN:
Category :
Languages : en
Pages : 73
Book Description
Studies of the silicon adaptive element were continued. Primary effort has been toward the development of transparent conductive contacts. A study of the Seeback effect for application as a thermal sensor in thermal-electrical FEB's was initiated. Theoretical and experimental analyses are included. Design of the TemperatureStabilized Substrate was completed and devices are in process. Development of the thermal-feedback video amplifier was completed. Performance data is presented. Investigations of an RC active filter for use as a bandpass amplifier are continuing. Detailed design criteria are presented along with experimental results for both breadboard and integrated versions of the amplifier. (Author).
Bulletin of the Atomic Scientists
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 116
Book Description
The Bulletin of the Atomic Scientists is the premier public resource on scientific and technological developments that impact global security. Founded by Manhattan Project Scientists, the Bulletin's iconic "Doomsday Clock" stimulates solutions for a safer world.
Publisher:
ISBN:
Category :
Languages : en
Pages : 116
Book Description
The Bulletin of the Atomic Scientists is the premier public resource on scientific and technological developments that impact global security. Founded by Manhattan Project Scientists, the Bulletin's iconic "Doomsday Clock" stimulates solutions for a safer world.
Electronic Packaging
Author: J. W. Klapheke
Publisher:
ISBN:
Category : Packaging
Languages : en
Pages : 104
Book Description
This annotated bibliography of selected reports, journal articles, and manufacturers' literature on electronic packaging provides a literature basis for electronic packaging engineers to design moer reliable, maintainable, and adaptable electronic equipment for aerospace application. Subject indexing is provided by properties and environmental effects on packaging materials, discrete parts to module packaging, module packing to assembly, housing and mounting, packaging products, and interconnection techniques. Author and corporate author indexes are included. (Author, modified) INCLUDED. (Author, modified-PL).
Publisher:
ISBN:
Category : Packaging
Languages : en
Pages : 104
Book Description
This annotated bibliography of selected reports, journal articles, and manufacturers' literature on electronic packaging provides a literature basis for electronic packaging engineers to design moer reliable, maintainable, and adaptable electronic equipment for aerospace application. Subject indexing is provided by properties and environmental effects on packaging materials, discrete parts to module packaging, module packing to assembly, housing and mounting, packaging products, and interconnection techniques. Author and corporate author indexes are included. (Author, modified) INCLUDED. (Author, modified-PL).