Addressing On-Chip Power Conversion and Dissipation Issues in Many-Core System-on-a-Chip Based on Conventional Silicon and Emerging Nanotechnologies PDF Download
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Author: Emeshaw Ashenafi Publisher: ISBN: Category : Electronic dissertations Languages : en Pages : 164
Book Description
Integrated circuits (ICs) are moving towards system-on-a-chip (SOC) designs. SOC allows various small and large electronic systems to be implemented in a single chip. This approach enables the miniaturization of design blocks that leads to high density transistor integration, faster response time, and lower fabrication costs. To reap the benefits of SOC and uphold the miniaturization of transistors, innovative power delivery and power dissipation management schemes are paramount. This dissertation focuses on on-chip integration of power delivery systems and managing power dissipation to increase the lifetime of energy storage elements. We explore this problem from two different angels: On-chip voltage regulators and power gating techniques. On-chip voltage regulators reduce parasitic effects, and allow faster and efficient power delivery for microprocessors. Power gating techniques, on the other hand, reduce the power loss incurred by circuit blocks during standby mode. Power dissipation (Ptotal = Pstatic and Pdynamic) in a complementary metal-oxide semiconductor (CMOS) circuit comes from two sources: static and dynamic. A quadratic dependency on the dynamic switching power and a more than linear dependency on static power as a form of gate leakage (subthreshold current) exist. To reduce dynamic power loss, the supply power should be reduced. A significant reduction in power dissipation occurs when portions of a microprocessor operate at a lower voltage level. This reduction in supply voltage is achieved via voltage regulators or converters. Voltage regulators are used to provide a stable power supply to the microprocessor. The conventional off-chip switching voltage regulator contains a passive floating inductor, which is difficult to be implemented inside the chip due to excessive power dissipation and parasitic effects. Additionally, the inductor takes a very large chip area while hampering the scaling process. These limitations make passive inductor based on-chip regulator design very unattractive for SOC integration and multi-/many-core environments. To circumvent the challenges, three alternative techniques based on active circuit elements to replace the passive LC filter of the buck convertor are developed. The first inductorless on-chip switching voltage regulator architecture is based on a cascaded 2nd order multiple feedback (MFB) low-pass filter (LPF). This design has the ability to modulate to multiple voltage settings via pulse with modulation (PWM). The second approach is a supplementary design utilizing a hybrid low drop-out scheme to lower the output ripple of the switching regulator over a wider frequency range. The third design approach allows the integration of an entire power management system within a single chipset by combining a highly efficient switching regulator with an intermittently efficient linear regulator (area efficient), for robust and highly efficient on-chip regulation. The static power (Pstatic) or subthreshold leakage power (Pleak) increases with technology scaling. To mitigate static power dissipation, power gating techniques are implemented. Power gating is one of the popular methods to manage leakage power during standby periods in low-power high-speed IC design. It works by using transistor based switches to shut down part of the circuit block and put them in the idle mode. The efficiency of a power gating scheme involves minimum Ioff and high Ion for the sleep transistor. A conventional sleep transistor circuit design requires an additional header, footer, or both switches to turn off the logic block. This additional transistor causes signal delay and increases the chip area. We propose two innovative designs for next generation sleep transistor designs. For an above threshold operation, we present a sleep transistor design based on fully depleted silicon-on-insulator (FDSOI) device. For a subthreshold circuit operation, we implement a sleep transistor utilizing the newly developed silicon-on ferroelectric-insulator field effect transistor (SOFFET). In both of the designs, the ability to control the threshold voltage via bias voltage at the back gate makes both devices more flexible for sleep transistors design than a bulk MOSFET. The proposed approaches simplify the design complexity, reduce the chip area, eliminate the voltage drop by sleep transistor, and improve power dissipation. In addition, the design provides a dynamically controlled Vt for times when the circuit needs to be in a sleep or switching mode.
Author: Emeshaw Ashenafi Publisher: ISBN: Category : Electronic dissertations Languages : en Pages : 164
Book Description
Integrated circuits (ICs) are moving towards system-on-a-chip (SOC) designs. SOC allows various small and large electronic systems to be implemented in a single chip. This approach enables the miniaturization of design blocks that leads to high density transistor integration, faster response time, and lower fabrication costs. To reap the benefits of SOC and uphold the miniaturization of transistors, innovative power delivery and power dissipation management schemes are paramount. This dissertation focuses on on-chip integration of power delivery systems and managing power dissipation to increase the lifetime of energy storage elements. We explore this problem from two different angels: On-chip voltage regulators and power gating techniques. On-chip voltage regulators reduce parasitic effects, and allow faster and efficient power delivery for microprocessors. Power gating techniques, on the other hand, reduce the power loss incurred by circuit blocks during standby mode. Power dissipation (Ptotal = Pstatic and Pdynamic) in a complementary metal-oxide semiconductor (CMOS) circuit comes from two sources: static and dynamic. A quadratic dependency on the dynamic switching power and a more than linear dependency on static power as a form of gate leakage (subthreshold current) exist. To reduce dynamic power loss, the supply power should be reduced. A significant reduction in power dissipation occurs when portions of a microprocessor operate at a lower voltage level. This reduction in supply voltage is achieved via voltage regulators or converters. Voltage regulators are used to provide a stable power supply to the microprocessor. The conventional off-chip switching voltage regulator contains a passive floating inductor, which is difficult to be implemented inside the chip due to excessive power dissipation and parasitic effects. Additionally, the inductor takes a very large chip area while hampering the scaling process. These limitations make passive inductor based on-chip regulator design very unattractive for SOC integration and multi-/many-core environments. To circumvent the challenges, three alternative techniques based on active circuit elements to replace the passive LC filter of the buck convertor are developed. The first inductorless on-chip switching voltage regulator architecture is based on a cascaded 2nd order multiple feedback (MFB) low-pass filter (LPF). This design has the ability to modulate to multiple voltage settings via pulse with modulation (PWM). The second approach is a supplementary design utilizing a hybrid low drop-out scheme to lower the output ripple of the switching regulator over a wider frequency range. The third design approach allows the integration of an entire power management system within a single chipset by combining a highly efficient switching regulator with an intermittently efficient linear regulator (area efficient), for robust and highly efficient on-chip regulation. The static power (Pstatic) or subthreshold leakage power (Pleak) increases with technology scaling. To mitigate static power dissipation, power gating techniques are implemented. Power gating is one of the popular methods to manage leakage power during standby periods in low-power high-speed IC design. It works by using transistor based switches to shut down part of the circuit block and put them in the idle mode. The efficiency of a power gating scheme involves minimum Ioff and high Ion for the sleep transistor. A conventional sleep transistor circuit design requires an additional header, footer, or both switches to turn off the logic block. This additional transistor causes signal delay and increases the chip area. We propose two innovative designs for next generation sleep transistor designs. For an above threshold operation, we present a sleep transistor design based on fully depleted silicon-on-insulator (FDSOI) device. For a subthreshold circuit operation, we implement a sleep transistor utilizing the newly developed silicon-on ferroelectric-insulator field effect transistor (SOFFET). In both of the designs, the ability to control the threshold voltage via bias voltage at the back gate makes both devices more flexible for sleep transistors design than a bulk MOSFET. The proposed approaches simplify the design complexity, reduce the chip area, eliminate the voltage drop by sleep transistor, and improve power dissipation. In addition, the design provides a dynamically controlled Vt for times when the circuit needs to be in a sleep or switching mode.
Author: David Flynn Publisher: Springer Science & Business Media ISBN: 0387718192 Category : Technology & Engineering Languages : en Pages : 303
Book Description
This book provides a practical guide for engineers doing low power System-on-Chip (SoC) designs. It covers various aspects of low power design from architectural issues and design techniques to circuit design of power gating switches. In addition to providing a theoretical basis for these techniques, the book addresses the practical issues of implementing them in today's designs with today's tools.
Author: Ibrahim (Abe) M. Elfadel Publisher: Springer ISBN: 3319204815 Category : Technology & Engineering Languages : en Pages : 354
Book Description
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
Author: Cristina Silvano Publisher: Springer Science & Business Media ISBN: 144196911X Category : Technology & Engineering Languages : en Pages : 301
Book Description
In recent years, both Networks-on-Chip, as an architectural solution for high-speed interconnect, and power consumption, as a key design constraint, have continued to gain interest in the design and research communities. This book offers a single-source reference to some of the most important design techniques proposed in the context of low-power design for networks-on-chip architectures.
Author: Bernd Höfflinger Publisher: Springer ISBN: 3319220934 Category : Science Languages : en Pages : 342
Book Description
The release of this second volume of CHIPS 2020 coincides with the 50th anniversary of Moore’s Law, a critical year marked by the end of the nanometer roadmap and by a significantly reduced annual rise in chip performance. At the same time, we are witnessing a data explosion in the Internet, which is consuming 40% more electrical power every year, leading to fears of a major blackout of the Internet by 2020. The messages of the first CHIPS 2020, published in 2012, concerned the realization of quantum steps for improving the energy efficiency of all chip functions. With this second volume, we review these messages and amplify upon the most promising directions: ultra-low-voltage electronics, nanoscale monolithic 3D integration, relevant-data, brain- and human-vision-inspired processing, and energy harvesting for chip autonomy. The team of authors, enlarged by more world leaders in low-power, monolithic 3D, video, and Silicon brains, presents new vistas in nanoelectronics, promising Moore-like exponential growth sustainable through to the 2030s.
Author: Bruno Allard Publisher: John Wiley & Sons ISBN: 1119377684 Category : Science Languages : en Pages : 346
Book Description
The book gathers the major issues involved in the practical design of Power Management solutions in wireless products as Internet-of-things. Presentation is not about state-of-the-art but about appropriation of validated recent technologies by practicing engineers. The book delivers insights on major trade-offs and a presentation of examples as a cookbook. The content is segmented in chapters to make access easier for the lay-person.
Author: Bashir M. Al-Hashimi Publisher: IET ISBN: 0863415520 Category : Technology & Engineering Languages : en Pages : 940
Book Description
This book highlights both the key achievements of electronic systems design targeting SoC implementation style, and the future challenges presented by the continuing scaling of CMOS technology.
Author: Myoung-Seo Kim Publisher: ISBN: 9781339820132 Category : Languages : en Pages : 145
Book Description
Since dark silicon and the end of multicore scaling, multi/many-core system-on-a-chip (SoC) platform designs nowadays are facing some conflicting issues regarding product development. One is induced by increasing design complexity and another is induced by decreasing time-to-market. Hence, designers are seeking a more efficient and reliable methodology in order to design complex multimillion gate SoC under such harsh conditions.In particular, the complexity of a generic pin control block in multimedia SoC which implements input/output (I/O) paths for off-chip communication has increased exponentially in recent years. Accordingly, the possibility of introducing human errors in designing such block has grown. Operation of generic-pin control block needs to be validated with a top-level RTL from the early stages of design, which correctly checks full-chip interface. However, generic-pin control block has inherent several design issues since function registers and multi-I/O paths are usually fixed in the relatively late stages of design. Also, the role of a generic pin control block that shares limited pins causes frequent changes in pin assignment. Therefore, current design approaches of a generic pin control block are no longer adequate to meet the challenges of design productivity, design reusability, and shorter time-to-market for design. And, this results in many possible human errors when using a traditional RTL description.As a response to this problem, we developed a design automation based approach to reduce the possibility of human errors. In the case study presented, we succeeded in auto-generating a generic pin control block in multimedia SoC platforms which has more than 400 general purpose I/O interfaces including both input and output, as well as 1200 PAD pins. Ultimately, we reduced the amount of manual description for generating a generic pin control block by a whopping 98%.The Overhead of Data Preparation (ODP) is very concerned in the future design of multi/many-core systems on the same chip. Therefore, we considered this issue under the extended Amdahl's law and apply it to three "traditional" mult/many-core systems scenarios such as homogeneous symmetric, asymmetric, and dynamic. In addition, we expanded it toward two new scenarios spanning heterogeneous and dynamic CPU-GPU multi/many-core systems. Based on our evaluation, we found that potential innovations in heterogeneous system architecture are indispensable to decrease ODP.Furthermore, providing a solution of low power consumption and the trade off a small decrease in performance and throughput are the main challenges in designing future heterogeneous multi/many-core architecture on a single chip. Our design incorporates heterogeneous cores representing different points in the power-performance design space during an applications execution. Under this circumstance, system software dynamically chooses the most appropriate core to meet specific performance and power requirements. As a response to this finding, we have presented a power-aware core management scheme through tightly-coupled hardware and software interaction: (1) heuristic thread consolidation scheme in software level, (2) 3-bit core power control scheme in hardware level. It is based on efficient methods of the core power management on heterogeneous multi/many-core architecture as a mechanism to reduce huge clock cycles as a latency when a core is powered down to up. Operation is based on distinct scenarios by 3-bit core power control scheme through 5 statuses switching such as active, hot, cold, idle, and powered down. In addition, this kind of status switching is exactly triggered by referencing two information. One is the collected process ID information which is allocated by OS scheduler. Another is the decision information of heuristic thread consolidation scheme to maximize power-performance efficiency. Experiments prove that the power-performance efficiency of our model presented reduces power on average by 2.3% compared to a system with an efficient power-aware policy and by up to 15% with respect to the basic policy.At the aspect of energy-efficiency on the same chip, we have proposed a performance-energy efficiency analytical model for the future integrated heterogeneous parallel multi/many-core systems which is promising to be used for big data applications. The model extends the traditional computing-centric model by considering ODP which can not be neglected in heterogenous multi/many-core systems anymore. The analysis has clearly shown that higher parallelism gained from either computation or data preparation brings greater energy-efficiency. Improving the performance-energy efficiency of data preparation is another promising approach to affect power consumption. Therefore, more informed tradeoffs should be taken when we design a modern heterogeneous multi-many-core systems within limited budget of energy envelope.
Author: Ethiopia Enideg Nigussie Publisher: Springer ISBN: 9781489990860 Category : Technology & Engineering Languages : en Pages : 172
Book Description
This book presents design techniques, analysis and implementation of high performance and power efficient, variation tolerant on-chip interconnects. Given the design paradigm shift to multi-core, interconnect-centric designs and the increase in sources of variability and their impact in sub-100nm technologies, this book will be an invaluable reference for anyone concerned with the design of next generation, high-performance electronics systems.
Author: Publisher: Academic Press ISBN: 9780128153581 Category : Computers Languages : en Pages : 0
Book Description
Dark Silicon and the Future of On-chip Systems, Volume 110, the latest release in the Advances in Computers series published since 1960, presents detailed coverage of innovations in computer hardware, software, theory, design and applications, with this release focusing on an Introduction to dark silicon and future processors, a Revisiting of processor allocation and application mapping in future CMPs in the dark silicon era, Multi-objectivism in the dark silicon age, Dark silicon aware resource management for many-core systems, Dynamic power management for dark silicon multi-core processors, Topology specialization for networks-on-chip in the dark silicon era, and Emerging SRAM-based FPGA architectures.
Author: Emeshaw Ashenafi
Author: Emeshaw Ashenafi
Author: David Flynn
Author: Ibrahim (Abe) M. Elfadel
Author: Cristina Silvano
Author: Bernd Höfflinger
Author: Bruno Allard
Author: Bashir M. Al-Hashimi
Author: Myoung-Seo Kim
Author: Ethiopia Enideg Nigussie
Author: