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Author: Alfons Fischer Publisher: John Wiley & Sons ISBN: 3527628525 Category : Technology & Engineering Languages : en Pages : 784
Book Description
The proceedings collect invited and contributed papers from more than 150 scientists and engineers worldwide which provide an up-to-date overview of the current research on friction and wear, including new systematic approaches as well as innovative technical solutions.
Author: Alfons Fischer Publisher: John Wiley & Sons ISBN: 3527628525 Category : Technology & Engineering Languages : en Pages : 784
Book Description
The proceedings collect invited and contributed papers from more than 150 scientists and engineers worldwide which provide an up-to-date overview of the current research on friction and wear, including new systematic approaches as well as innovative technical solutions.
Author: Toshiro Doi Publisher: William Andrew ISBN: 1437778593 Category : Science Languages : en Pages : 330
Book Description
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan
Author: Bharat Bhushan Publisher: Springer Science & Business Media ISBN: 3540740856 Category : Technology & Engineering Languages : en Pages : 475
Book Description
The volumes VIII, IX and X examine the physical and technical foundation for recent progress in applied scanning probe techniques. This is the first book to summarize the state-of-the-art of this technique. The field is progressing so fast that there is a need for a set of volumes every 12 to 18 months to capture latest developments. These volumes constitute a timely comprehensive overview of SPM applications.
Author: Michael Liehr Publisher: ISBN: Category : Technology & Engineering Languages : en Pages : 440
Book Description
Wafer cleaning, microcontamination and surface passivation are the key focus of this proceedings volume, the 3rd in a successful series from MRS. It is a field in which control of surface chemistry and surface morphology, as well as particle and molecular contamination removal, are of critical importance. This volume expands the scope of the topic to include ultraclean technology in a broader sense, emphasizing the identification and characterization of trace contamination, strategies for removal, and equipment considerations, as well as critical limits for impact on devices. Novel processes, such as chemical mechanical polishing (CMP), and their ramifications for contamination removal are also addressed.
Author: Anna Igual Munoz Publisher: Springer Nature ISBN: 3030481077 Category : Technology & Engineering Languages : en Pages : 110
Book Description
This book is a toolbox for identifying and addressing tribocorrosion situations from an engineering point of view. It is an accessible and introductory guideline to the emerging and interdisciplinary field of tribocorrosion covering the main concepts of tribology and corrosion. It describes specific tribocorrosion concepts, models and experimental techniques as well as their application to practical situations in which mechanical and chemical phenomena act simultaneously.
Author: Ernest Rabinowicz Publisher: Wiley-Interscience ISBN: Category : Science Languages : en Pages : 334
Book Description
Friction and Wear of Materials Second Edition Written by one of the world’s foremost authorities on friction, this classic book offers a lucid presentation of the theory of mechanical surface interactions as it applies to friction, wear, adhesion, and boundary lubrication. To aid engineers in design decisions, Friction and Wear of Materials evaluates the properties of materials which, under specified conditions, cause one material to function better as a bearing material than another. Featured also are thorough treatments of lubricants and the sizes and shapes of wear particles. This updated Second Edition includes new material on erosive wear, impact wear, and friction. Professor Rabinowicz’s book will be especially welcomed by mechanical and design engineers, surface scientists, tribologists and others who design, produce and operate products, machines and equipment which involve friction and its effects.
Author: Joseph M. Steigerwald Publisher: John Wiley & Sons ISBN: 3527617752 Category : Science Languages : en Pages : 337
Book Description
Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.
Author: Rajiv Kohli Publisher: Elsevier ISBN: 0815516851 Category : Science Languages : en Pages : 1209
Book Description
Surface contamination is of cardinal importance in a host of technologies and industries, ranging from microelectronics to optics to automotive to biomedical. Thus, the need to understand the causes of surface contamination and their removal is very patent. Generally speaking, there are two broad categories of surface contaminants: film-type and particulates. In the world of shrinking dimensions, such as the ever-decreasing size of microelectronic devices, there is an intensified need to understand the behavior of nanoscale particles and to devise ways to remove them to an acceptable level. Particles which were functionally innocuous a few years ago are ôkiller defectsö today, with serious implications for yield and reliability of the components. This book addresses the sources, detection, characterization and removal of both kinds of contaminants, as well as ways to prevent surfaces from being contaminated. A number of techniques to monitor the level of cleanliness are also discussed. Special emphasis is placed on the behaviour of nanoscale particles. The book is amply referenced and profusely illustrated.• Excellent reference for a host of technologies and industries ranging from microelectronics to optics to automotive to biomedical.• A single source document addressing everything from the sources of contamination to their removal and prevention.• Amply referenced and profusely illustrated.
Author: Alfons Fischer
Author: Alfons Fischer
Author: Toshiro Doi
Author: Iowa State University
Author: Bharat Bhushan
Author: Michael Liehr
Author: Anna Igual Munoz
Author: Ernest Rabinowicz
Author: 
Author: Joseph M. Steigerwald
Author: Rajiv Kohli